Patent Assignment
Reel/Frame 071549/0923
Corrective Assignment to Correct the Name of Receiving Party Data from Stats Chippac Pte. Lte. to Stats Chippac Pte. Ltd. Previously Recorded on Reel 38378 Frame 227. Assignor(S) Hereby Confirms the Change of Name.
Recorded: 2025-06-13
Pages: 8
Assignor
STATS CHIPPAC LTD.
Executed: 2016-03-29
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System with Laser Hole and Method of Manufacture Thereof
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 29, 2011
From: LEE, HYUNGMIN; CHI, HEEJO; PARK, YEONGIM
To: STATS CHIPPAC LTD.
Reel/Frame 026524/0051 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0227 →
Release of Security Interest
Jun 4, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052844/0491 →
Assignment of Assignor's Interest
Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →