Patent Assignment
Reel/Frame 026690/0390
Assignment of Assignor's Interest
Recorded: 2011-08-02
Pages: 3
Assignors
CHUANG, CHIH-WEI
Executed: 2011-08-01
LIN, CHAO-KUN
Executed: 2011-08-01
YANG, LONG
Executed: 2011-08-01
HAMAGUCHI, NORIHITO
Executed: 2011-08-01
Assignee
BRIDGELUX, INC.
101 PORTOLA AVENUE, LIVERMORE, CALIFORNIA, 94551
Covered Property
(1)
High Temperature Gold-Free Wafer Bonding for Light Emitting Diodes
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Nov 12, 2012
From: BRIDGELUX, INC.
To: WHITE OAK GLOBAL ADVISORS, LLC, AS COLLATERAL AGENT
Reel/Frame 029281/0844 →
Release of Security Interest
May 22, 2013
From: WHITE OAK GLOBAL ADVISORS, LLC, AS COLLATERAL AGENT
To: BRIDGELUX, INC.
Reel/Frame 030466/0093 →
Assignment of Assignor's Interest
Jul 1, 2013
From: BRIDGELUX, INC.
To: TOSHIBA TECHNO CENTER INC.
Reel/Frame 030724/0395 →
Assignment of Assignor's Interest
Aug 1, 2014
From: TOSHIBA TECHNO CENTER INC.
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 033443/0908 →
Assignment of Assignor's Interest
Jan 24, 2020
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA ELECTRONIC DEVICES AND STORAGE CORPORATION
Reel/Frame 051691/0442 →
Assignment of Assignor's Interest
Apr 6, 2020
From: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
To: SEOUL SEMICONDUCTOR CO., LTD.
Reel/Frame 052316/0044 →