Patent Assignment
Reel/Frame 031292/0370
Assignment of Assignor's Interest
Recorded: 2013-09-26
Pages: 11
Assignors
KIM, KYUNGMOON
Executed: 2013-09-17
LEE, KOOHONG
Executed: 2013-09-25
YEE, JAEHAK
Executed: 2013-09-17
KIM, YOUNGCHUL
Executed: 2013-09-17
HOANG, LAN
Executed: 2013-09-26
MARIMUTHU, PANDI C.
Executed: 2013-09-18
ANDERSON, STEVE
Executed: 2013-09-20
CHI, HEEJO
Executed: 2013-09-17
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Simultaneous Molding and Thermalcompression Bonding
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0382 →
Release of Security Interest
Jun 16, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052963/0546 →
This Submission Is to Correct a Typographical Error in the Cover Sheet Previously Recorded on Reel: 038378 Frame: 0382 to Correct the Spelling of Assignee's Name from "Stats Chippac Pte. Lte." to "Stats Chippac Pte. Ltd."
Sep 6, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064869/0363 →
Assignment of Assignor's Interest
Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →