Patent Assignment
Reel/Frame 032458/0866
Release of Security Interest to Reel/Frame: 012273/0145
Recorded: 2014-03-17
Pages: 14
Assignor
CITICORP USA, INC.
Executed: 2014-03-13
Assignees
MEMC ELECTRONIC MATERIALS, INC. (NOW KNOWN AS SUNEDISON, INC.)
501 PEARL DRIVE, ST. PETERS, MISSOURI, 63376
MEMC PASADENA, INC.
3000 N. SOUTH STREET, PASADENA, TEXAS, 77503
PLASMASIL, L.L.C.
501 PEARL DRIVE, ST. PETERS, MISSOURI, 63376
SIBOND, L.L.C.
501 PEARL DRIVE, ST. PETERS, MISSOURI, 63376
MEMC SOUTHWEST INC.
501 PEARL DRIVE, ST. PETERS, MISSOURI, 63376
MEMC INTERNATIONAL, INC. (NOW KNOWN AS SUNEDISON INTERNATIONAL, INC.)
501 PEARL DRIVE, ST. PETERS, MISSOURI, 63376
Covered Properties
(2)
Method of Determining Performance Characteristics of Polishing Pads
Patent:
6,293,139 →
Application:
09/432,928 →
Method and Apparatus for Forming a Silicon Wafer with a Denuded Zone
Patent:
6,599,815 →
Application:
09/607,391 →
Related Assignments
(11)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Agreement
Oct 1, 2012
From: NVT, LLC; SUN EDISON LLC; SOLAICX, INC.; MEMC ELECTRONIC MATERIALS, INC.
To: GOLDMAN SACHS BANK USA
Reel/Frame 029057/0810 →
Release of Security Interest
Dec 26, 2013
From: BANK OF AMERICA, N.A.
To: ENFLEX CORPORATION; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0031 →
Release of Security Interest
Dec 26, 2013
From: GOLDMAN SACHS BANK USA
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0092 →
Security Agreement
Jan 30, 2014
From: SUNEDISON, INC.; SOLAICX; SUN EDISON, LLC; NVT, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 032177/0359 →
Release of Security Interest
Mar 3, 2014
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC.
Reel/Frame 032382/0724 →
Release of Security Interest to Reel/Frame: 012280/0161
Mar 17, 2014
From: CITICORP USA, INC.
To: MEMC ELECTRONIC MATERIALS, INC. (NOW KNOWN AS SUNEDISON, INC.); MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.
Reel/Frame 032458/0794 →
Release of Security Interest to Reel/Frame: 012365/0345
Mar 17, 2014
From: CITICORP USA, INC.
To: MEMC ELECTRONIC MATERIALS, INC. (NOW KNOWN AS SUNEDISON, INC.); MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.
Reel/Frame 032458/0901 →
Release of Security Interest to Reel/Frame: 013964/0378
Mar 17, 2014
From: CITICORP USA, INC.
To: MEMC ELECTRONIC MATERIALS, INC. (NOW KNOWN AS SUNEDISON, INC.); MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.
Reel/Frame 032458/0958 →
Assignment of Assignor's Interest
May 27, 2014
From: MEMC ELECTRONIC MATERIALS, INC.
To: SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H)
Reel/Frame 033023/0430 →
Notice of License Agreement
Jun 6, 2014
From: SUNEDISON SEMICONDUCTOR LIMITED
To: SUNEDISON SEMICONDUCTOR TECHNOLOGY PTE. LTD.
Reel/Frame 033099/0001 →
Assignment of Assignor's Interest
Jun 7, 2018
From: SUNEDISON SEMICONDUCTOR LIMITED; MEMC JAPAN LIMITED; MEMC ELECTRONIC MATERIALS S.P.A.
To: GLOBALWAFERS CO., LTD.
Reel/Frame 046327/0001 →