Patent Assignment
Reel/Frame 033448/0145
Assignment of Assignor's Interest
Recorded: 2014-08-01
Pages: 5
Assignors
HSIEH, MING-CHE
Executed: 2014-07-25
LEE, CHIEN CHEN
Executed: 2014-07-25
PERNG, BAW-CHING
Executed: 2014-07-25
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Making Wafer Level Chip Scale Package
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0382 →
Release of Security Interest
Dec 13, 2019
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 051285/0318 →
Assignment of Assignor's Interest
Dec 18, 2019
From: STATS CHIPPAC PTE. LTD.
To: JCET SEMICONDUCTOR (SHAOXING) CO., LTD.
Reel/Frame 051365/0680 →
This Submission Is to Correct a Typographical Error in the Cover Sheet Previously Recorded on Reel: 038378 Frame: 0382 to Correct the Spelling of Assignee's Name from "Stats Chippac Pte. Lte." to "Stats Chippac Pte. Ltd."
Sep 6, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064869/0363 →