Semiconductor device and method of making wafer level chip scale package

1. A method of making a semiconductor device, comprising:

providing a semiconductor wafer;

forming a redistribution layer over the semiconductor wafer, wherein the redistribution layer includes a top surface extending over a surface of the semiconductor wafer to include an interconnect site of the redistribution layer;

forming a first insulating layer over the redistribution layer;

forming an opening in the first insulating layer over the interconnect site; and

forming an interconnect structure within the opening and over the interconnect site, wherein a first portion of the interconnect structure terminates on the top surface of the redistribution layer and a second portion of the interconnect structure opposite the first portion contacts a side surface of the redistribution layer.

2. The method of claim 1 , further including:

forming a second insulating layer over the semiconductor wafer prior to forming the redistribution layer; and

forming the redistribution layer over the second insulating layer.

3. The method of claim 1 , further including forming the opening in the first insulating layer partially through the first insulating layer in an area adjacent to the interconnect site.

4. The method of claim 1 , further including:

singulating the semiconductor wafer into individual semiconductor die; and

disposing the semiconductor die over a substrate.

5. A method of making a semiconductor device, comprising:

providing a semiconductor die;

forming a first conductive layer over the semiconductor die, wherein the first conductive layer includes a top surface extending from a contact pad of the semiconductor die over a surface of the semiconductor die to include an interconnect site of the first conductive layer outside the contact pad;

forming a first insulating layer over the first conductive layer and including an opening over the interconnect site; and

forming an interconnect structure over the interconnect site, wherein a first portion of the interconnect structure terminates on the top surface of the first conductive layer and a second portion of the interconnect structure opposite the first portion contacts a side surface of the first conductive layer.

6. The method of claim 5 , further including:

forming a second insulating layer over the semiconductor die; and

forming the first conductive layer over the second insulating layer.

7. The method of claim 5 , further including forming the opening in the first insulating layer partially through the first insulating layer in an area adjacent to the interconnect site.

8. The method of claim 5 , wherein the opening in the first insulating layer is larger than the interconnect site.

9. The method of claim 5 , further including:

forming a second conductive layer as contact pads over the semiconductor die;

forming a second insulating layer over the semiconductor die; and

forming the first conductive layer over the second conductive layer and second insulating layer.

10. A semiconductor device, comprising:

a semiconductor die including a contact pad;

a redistribution layer formed over the semiconductor die, wherein the redistribution layer includes a top surface extending continuously from the contact pad over a surface of the semiconductor die to include an interconnect site of the redistribution layer outside the contact pad;

a first insulating layer formed over the top surface of the redistribution layer including an opening in the first insulating layer over the interconnect site of the redistribution layer with the first insulating layer contacting a side surface of the redistribution layer; and

an interconnect structure formed within the opening over the interconnect site of the redistribution layer and in contact with the side surface of the redistribution layer, wherein a width of opening is greater than a width of the interconnect structure.

11. The semiconductor device of claim 10 , further including a second insulating layer formed over the semiconductor die, wherein the redistribution layer is formed over the second insulating layer.

12. The semiconductor device of claim 10 , wherein the opening in the first insulating layer extends partially through the first insulating layer in an area adjacent to the redistribution layer.

13. The semiconductor device of claim 10 , wherein the interconnect structure includes a bump.

14. A semiconductor device, comprising:

a semiconductor die including a contact pad;

a conductive layer formed over the semiconductor die, wherein the conductive layer includes a top surface extending from the contact pad over a surface of the semiconductor die to include an interconnect site of the conductive layer outside the contact pad;

a first insulating layer formed over the top surface of the conductive layer including an opening in the first insulating layer over the interconnect site of the conductive layer; and

an interconnect structure formed within the opening over the interconnect site of the conductive layer, wherein a first portion of the interconnect structure terminates on the top surface of the conductive layer and a second portion of the interconnect structure opposite the first portion contacts a side surface of the conductive layer.

15. The semiconductor device of claim 14 , wherein a width of the opening is greater than a width of the interconnect structure.

16. The semiconductor device of claim 14 , wherein the opening extends partially through the first insulating layer in an area adjacent to the conductive layer.

17. The semiconductor device of claim 16 , wherein the first insulating layer contacts the side surface of the conductive layer.

18. The semiconductor device of claim 14 , wherein the interconnect structure includes a bump.

19. The semiconductor device of claim 14 , further including a second insulating layer formed over the semiconductor die, wherein the conductive layer is formed over the second insulating layer.

20. A semiconductor device, comprising:

a semiconductor die;

a redistribution layer formed over the semiconductor die, wherein the redistribution layer includes a top surface extending over a surface of the semiconductor die to include an interconnect site of the redistribution layer;

a first insulating layer formed over the redistribution layer and including an opening formed over the interconnect site with a width of the opening greater than a width of the interconnect site; and

an interconnect structure formed within the opening over the interconnect site of the redistribution layer, wherein a first portion of the interconnect structure terminates on the top surface of the redistribution layer and a second portion of the interconnect structure opposite the first portion contacts a side surface of the redistribution layer.

21. The semiconductor device of claim 20 , wherein the opening in the first insulating layer extends partially through the first insulating layer in an area adjacent to the interconnect site.

22. The semiconductor device of claim 21 , wherein the first insulating layer contacts the side surface of the redistribution layer.

23. The semiconductor device of claim 20 , wherein the opening in the first insulating layer extends completely through the first insulating layer over the interconnect site.

24. The semiconductor device of claim 20 , wherein the interconnect structure includes a bump.

25. The semiconductor device of claim 20 , further including a second insulating layer formed over the semiconductor die, wherein the redistribution layer is formed over the second insulating layer.

26. The semiconductor device of claim 20 , wherein a width of the opening is greater than a width of the interconnect structure.