IP Library Assignment 044677/0045
Patent Assignment
Reel/Frame 044677/0045

Assignment of Assignor's Interest

Recorded: 2018-01-19 Pages: 5
Assignor
NEXPLANAR CORPORATION
Executed: 2017-07-17
Assignee
CABOT MICROELECTRONICS CORPORATION
870 NORTH COMMONS DRIVE, AURORA, ILLINOIS, 60504
Covered Property (1)
Coated Compressive Subpad for Chemical Mechanical Polishing
Application: 15/875,773 →
Publication: US 2018/0141183
Related Assignments (8)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 19, 2018
From: SCOTT, DIANE; LEFEVRE, PAUL ANDRE
To: NEXPLANAR CORPORATION
Reel/Frame 044676/0973 →
Security Agreement Nov 16, 2018
From: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 047588/0263 →
Change of Name Jan 13, 2021
From: CABOT MICROELECTRONICS CORPORATION
To: CMC MATERIALS, INC.
Reel/Frame 054980/0681 →
Release of Security Interest Jul 6, 2022
From: JPMORGAN CHASE BANK, N.A.
To: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.
Reel/Frame 060592/0260 →
Security Interest Jul 8, 2022
From: ENTEGRIS, INC.; ENTEGRIS GP, INC.; POCO GRAPHITE, INC.; CMC MATERIALS, INC.
To: TRUIST BANK, AS NOTES COLLATERAL AGENT
Reel/Frame 060613/0072 →
Security Interest Jul 8, 2022
From: CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 060615/0001 →
Change of Name Nov 8, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065517/0783 →
Change of Name Nov 22, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065663/0466 →