IP Library Assignment 058094/0100
Patent Assignment
Reel/Frame 058094/0100

Assignment of Assignor's Interest

Recorded: 2021-11-12 Pages: 5
Assignor
WESTERN DIGITAL TECHNOLOGIES, INC.
Executed: 2021-07-29
Assignee
WODEN TECHNOLOGIES INC.
251 LITTLE FALLS DRIVE, WILMINGTON, DELAWARE, 19808
Covered Properties (22)
Fabrication of Semiconductor Devices
Patent: 6,586,327 →
Application: 09/965,622 →
Publication: US 2002/0086542
Fabrication of Semiconductor Devices
Patent: 7,183,206 →
Application: 10/459,699 →
Publication: US 2004/0132288
Direct Cooling Pallet Tray for Temperature Stability for Deep Ion Mill Etch Process
Patent: 7,296,420 →
Application: 11/001,795 →
Publication: US 2006/0117762
Direct Cooling Pallet Assembly for Temperature Stability for Deep Ion Mill Etch Process
Patent: 7,481,312 →
Application: 11/001,798 →
Publication: US 2006/0118447
Fabrication of Semiconductor Devices
Patent: 7,507,663 →
Application: 11/655,470 →
Publication: US 2007/0117388
Memory Array with Readout Isolation
Patent: 7,593,256 →
Application: 11/729,322 →
Publication: US 2007/0230243
Memory Array with Readout Isolation
Patent: 7,548,453 →
Application: 11/729,323 →
Publication: US 2007/0242494
Memory Array with Readout Isolation
Patent: 7,548,454 →
Application: 11/729,423 →
Publication: US 2007/0253234
Low-Complexity Electronic Circuits and Methods of Forming the Same
Patent: 8,351,238 →
Application: 12/417,245 →
Publication: US 2009/0257269
Ram Memory Device with Nand Type Interface
Patent: 8,537,618 →
Application: 13/199,328 →
Publication: US 2012/0051140
Low-Complexity Electronic Circuit and Methods of Forming the Same
Patent: 8,526,217 →
Application: 13/692,638 →
Publication: US 2013/0114328
3-D Planes Memory Device
Patent: 9,679,946 →
Application: 14/835,642 →
Publication: US 2016/0056206
Vertical Memory Structure with Array Interconnects and Method for Producing the Same
Patent: 9,741,769 →
Application: 15/132,609 →
3-D Planes Memory Device
Application: 15/613,842 →
Publication: US 2017/0271407
Vertical Memory Structure with Array Interconnects and Method for Producing the Same
Application: 15/668,342 →
Publication: US 2017/0358626
Means and method for low cost semiconductor processing
Application: 60/235,853 →
Memory array with readout isolation
Application: 60/787,247 →
Low component complexity electronic circuit latch
Application: 61/123,612 →
Low component complexity electronic circuit addressable sequencer
Application: 61/124,065 →
Low component complexity electronic circuit sequencer
Application: 61/124,071 →
RAM memory device with NAND type interface
Application: 61/402,238 →
3-D Planes Memory Device
Application: 62/041,306 →
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name Oct 25, 2012
From: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
To: HGST NETHERLANDS B.V.
Reel/Frame 029341/0777 →
Change of Name Oct 31, 2012
From: NUP2 INCORPORATED
To: CONTOUR SEMICONDUCTOR, INC.
Reel/Frame 029218/0958 →
Assignment of Assignor's Interest Nov 6, 2012
From: GROSSMAN, STEVEN J.; PARKINSON, WARD; SHEPARD, DANIEL R.; TRENT, THOMAS M.
To: CONTOUR SEMICONDUCTOR, INC.
Reel/Frame 029245/0154 →
Assignment of Assignor's Interest Dec 10, 2012
From: SHEPARD, DANIEL R.
To: CONTOUR SEMICONDUCTOR, INC.
Reel/Frame 029436/0790 →
Security Agreement Jan 18, 2013
From: CONTOUR SEMICONDUCTOR, INC.
To: AMERICAN CAPITAL, LTD.; STILL RIVER FUND III, LIMITED PARTNERSHIP; RUNNING DEER TRUST; RUNNING DEER FOUNDATION
Reel/Frame 029659/0615 →
Security Interest May 30, 2014
From: CONTOUR SEMICONDUCTOR, INC.
To: AMERICAN CAPITAL, LTD.
Reel/Frame 033063/0617 →
Security Interest Jun 20, 2014
From: CONTOUR SEMICONDUCTOR, INC.
To: AMERICAN CAPITAL, LTD.; STILL RIVER FUND III, LIMITED PARTNERSHIP; SARAH G. KURZON 2001 REVOCABLE TRUST; OVONYX, INC.
Reel/Frame 033204/0428 →
Release of Security Interest Jun 24, 2014
From: AMERICAN CAPITAL, LTD.
To: CONTOUR SEMICONDUCTOR, INC.
Reel/Frame 033225/0330 →
Assignment of Assignor's Interest Apr 21, 2015
From: SHEPARD, DANIEL R.
To: CONTOUR SEMICONDUCTOR, INC.
Reel/Frame 035453/0887 →
Release of Security Interest May 15, 2015
From: AMERICAN CAPITAL, LTD.; STILL RIVER FUND III, LIMITED PARTNERSHIP; SARAH G. KURZON 2001 REVOCABLE TRUST; OVONYX, INC.
To: CONTOUR SEMICONDUCTOR, INC.
Reel/Frame 035685/0571 →
Release of Security Interest May 20, 2015
From: AMERICAN CAPITAL, LTD.; STILL RIVER FUND III, LIMITED PARTNERSHIP; SARAH G. KURZON 2001 REVOCABLE TRUST; OVONYX, INC.
To: CONTOUR SEMICONDUCTOR, INC.
Reel/Frame 035749/0956 →
Assignment of Assignor's Interest May 21, 2015
From: CONTOUR SEMICONDUCTOR, INC.
To: HGST NETHERLANDS B.V.
Reel/Frame 035748/0909 →
Corrective Assignment to Correct the Name and Address of the Assignee Previously Recorded on Reel 035748 Frame 0909. Assignor(S) Hereby Confirms the Name and Address of the Assignee Si Hgst, Inc.,3403 Yerba Buena Road,San Jose, Ca 95135. Jun 2, 2015
From: CONTOUR SEMICONDUCTOR, INC.
To: HGST, INC.
Reel/Frame 035831/0594 →
Assignment of Assignor's Interest Oct 2, 2015
From: SHEPARD, DANIEL R.
To: HGST, INC.
Reel/Frame 036711/0707 →
Assignment of Assignor's Interest Apr 19, 2016
From: FRANCA-NETO, LUIZ M.; LILLE, JEFFREY
To: HGST NETHERLANDS B.V.
Reel/Frame 038319/0385 →
Security Agreement May 13, 2016
From: HGST, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038701/0015 →
Security Agreement May 16, 2016
From: HGST, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038708/0362 →
Security Agreement May 16, 2016
From: HGST, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038707/0819 →
Security Agreement Jul 19, 2016
From: HGST, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 039389/0684 →
Release of Security Interest Aug 16, 2016
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: HGST, INC.
Reel/Frame 039689/0950 →
Assignment of Assignor's Interest Dec 5, 2016
From: HGST NETHERLANDS B.V.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 040819/0450 →
Assignment of Assignor's Interest Dec 6, 2016
From: HGST NETHERLANDS B.V.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 040831/0265 →
Assignment of Assignor's Interest Jun 6, 2017
From: SHEPARD, DANIEL R.
To: HGST, INC.
Reel/Frame 042609/0910 →
Assignment of Assignor's Interest Aug 4, 2017
From: HGST NETHERLANDS B.V.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 043443/0652 →
Assignment of Assignor's Interest Aug 4, 2017
From: FRANCA-NETO, LUIZ M.; LILLE, JEFFREY
To: HGST NETHERLANDS B.V.
Reel/Frame 043195/0462 →