IP Library Assignment 067396/0296
Patent Assignment
Reel/Frame 067396/0296

Assignment of Assignor's Interest

Recorded: 2024-05-13 Pages: 5
Assignor
Assignee
LIBRE HOLDINGS, INC.
230 SECOND AVE, SUITE 140, WALTHAM, MASSACHUSETTS, 02451
Covered Properties (9)
Pumped Pinned Photodiode Pixel Array
Patent: 8,674,282 →
Application: 13/242,865 →
Publication: US 2012/0241591
Exposure Time Selection Using Stacked-Chip Image Sensors
Patent: 9,270,906 →
Application: 13/875,549 →
Publication: US 2013/0293752
Back Side Illuminated Image Sensors with Back Side Charge Storage
Patent: 9,252,185 →
Application: 14/024,316 →
Publication: US 2014/0077062
Pumped Pinned Photodiode Pixel Array
Patent: 9,595,560 →
Application: 14/171,181 →
Publication: US 2014/0146209
Global Shutter Image Sensor Pixels Having Improved Shutter Efficiency
Patent: 9,832,407 →
Application: 14/554,914 →
Publication: US 2016/0150175
Image Sensor Pixels with Adjustable Body Bias
Patent: 9,591,245 →
Application: 14/686,570 →
Publication: US 2016/0307949
Bottom-Gate Thin-Body Transistors for Stacked Wafer Integrated Circuits
Patent: 9,812,555 →
Application: 14/723,719 →
Publication: US 2016/0353038
Phase Detection Pixels with Optical Structures
Patent: 9,935,146 →
Application: 15/383,430 →
Global Shutter Image Sensor Pixels Having Improved Shutter Efficiency
Application: 15/795,718 →
Publication: US 2018/0048841
Related Assignments (17)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 11, 2013
From: HYNECEK, JAROSLAV
To: APTINA IMAGING CORPORATION
Reel/Frame 031186/0859 →
Assignment of Assignor's Interest Dec 12, 2014
From: WAN, CHUNG CHUN; LI, XIANGLI
To: APTINA IMAGING CORPORATION
Reel/Frame 034488/0651 →
Assignment of Assignor's Interest Dec 18, 2014
From: APTINA IMAGING CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 034673/0001 →
Assignment of Assignor's Interest Jan 6, 2015
From: HYNECEK, JAROSLAV
To: ON SEMICONDUCTOR
Reel/Frame 034645/0160 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 034645 Frame: 0160. Assignor(S) Hereby Confirms the Assignment. Jan 8, 2015
From: HYNECEK, JAROSLAV
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 034743/0348 →
Assignment of Assignor's Interest Apr 14, 2015
From: MADURAWE, RAMINDA
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 035408/0404 →
Assignment of Assignor's Interest May 28, 2015
From: MADURAWE, RAMINDA; SOLEIMANI, HAMID; RAHIM, IRFAN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 035731/0068 →
Assignment of Assignor's Interest Jan 20, 2016
From: APTINA IMAGING CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 037536/0386 →
Security Interest Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
Corrective Assignment to Correct the Incorrect Patent Number 5859768 and to Recite Collateral Agent Role of Receiving Party in the Security Interest Previously Recorded on Reel 038620 Frame 0087. Assignor(S) Hereby Confirms the Security Interest. Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
Assignment of Assignor's Interest Dec 19, 2016
From: LEE, BYOUNGHEE
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 040672/0701 →
Assignment of Assignor's Interest Oct 27, 2017
From: HYNECEK, JAROSLAV
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 043969/0968 →
Patent Security Agreement Jul 11, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 046530/0494 →
Security Interest Oct 16, 2020
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION; ON SEMICONDUCTOR CONNECTIVITY SOLUTIONS, INC.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 054090/0617 →
Release of Security Interest in Patents Recorded at Reel 038620, Frame 0087 Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
Release of Security Interest in Patents Recorded at Reel 054090, Frame 0617 Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064081/0167 →
Release of Security Interest in Patents Recorded at Reel 046530, Frame 0494 Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064159/0524 →