IP Library Granted Patent US 6,558,883
Granted Patent Utility
US 6,558,883 · Confirmation No. 2877

APPARATUS AND METHOD FOR PATTERNING A SEMICONDUCTOR WAFER

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Code Description Pages PDF
2001-04-16 SPEC Specification 1 View
2001-04-16 CLM Claims 4 View
2001-04-16 ABST Abstract 1 View
2001-04-16 DRW Drawings-only black and white line drawings 3 View
2001-03-08 TRNA Transmittal of New Application 2 View
2001-03-08 A.PE Preliminary Amendment 10 View
2001-03-08 SPEC Specification 12 View
2001-03-08 CLM Claims 4 View
2001-03-08 ABST Abstract 1 View
2001-03-08 DRW Drawings-only black and white line drawings 4 View
2001-03-08 OATH Oath or Declaration filed 9 View
2001-03-08 LET. Miscellaneous Incoming Letter 1 View
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Quick Facts
Patent No.
US 6,558,883
App. No.
09/801,413
Filed
2001-03-08
Granted
2003-05-06
Pub. No.
US20020127501A1
Art Unit
1756
PTA
-12 days