IP Library › Granted Patent US 6,444,569
Granted Patent Utility
US 6,444,569 · Confirmation No. 4615

METHOD FOR FORMING A COPPER INTERCONNECT USING A MULTI-PLATEN CHEMICAL MECHANICAL POLISHING (CMP) PROCESS

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2017-07-05 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2017-07-05 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2017-06-29 PA.. Power of Attorney 1 View
2017-06-29 R3.73 Assignee showing of ownership per 37 CFR 3.73 2 View
2017-06-29 N417 Electronic Filing System Acknowledgment Receipt 2 View
2001-04-16 TRNA Transmittal of New Application 3 View
2001-04-16 A.PE Preliminary Amendment 2 View
2001-04-16 SPEC Specification 18 View
2001-04-16 CLM Claims 9 View
2001-04-16 ABST Abstract 1 View
2001-04-16 DRW Drawings-only black and white line drawings 5 View
2001-04-16 OATH Oath or Declaration filed 4 View
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Quick Facts
Patent No.
US 6,444,569
App. No.
09/835,276
Filed
2001-04-16
Granted
2002-09-03
Pub. No.
US20010027083A1
Art Unit
2829
PTA
0 days