IP Library › Granted Patent US 6,573,173
Granted Patent Utility
US 6,573,173 · Confirmation No. 2536

METHOD FOR FORMING A COPPER INTERCONNECT USING A MULTI-PLATEN CHEMICAL MECHANICAL POLISHING (CMP) PROCESS

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2017-07-10 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2017-07-10 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2017-06-29 PA.. Power of Attorney 1 View
2017-06-29 R3.73 Assignee showing of ownership per 37 CFR 3.73 2 View
2017-06-29 N417 Electronic Filing System Acknowledgment Receipt 2 View
2002-06-20 TRNA Transmittal of New Application 2 View
2002-06-20 A.PE Preliminary Amendment 1 View
2002-06-20 SPEC Specification 18 View
2002-06-20 CLM Claims 9 View
2002-06-20 ABST Abstract 1 View
2002-06-20 DRW Drawings-only black and white line drawings 5 View
2002-06-20 OATH Oath or Declaration filed 4 View
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Quick Facts
Patent No.
US 6,573,173
App. No.
10/175,637
Filed
2002-06-20
Granted
2003-06-03
Pub. No.
US20020151167A1
Art Unit
2829
PTA
0 days