IP Library Granted Patent US 6,847,012
Granted Patent B1
US 6,847,012 · App. 09/913,269 · Granted Jan 25, 2005

Apparatus and method for measuring the temperature of substrates

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Quick Facts
Patent No.
US 6,847,012
App. No.
09/913,269
Granted
Jan 25, 2005
Kind
B1
Abstract

The invention relates to a device for measuring the temperature of substrates, notably semiconductor wafers. The device comprises at least one radiation sensor for measuring the radiation emitted by the substrate and an element ( 19 ) which restricts the field of vision of the radiation sensor and is positioned between the substrate and the radiation sensor. The substrate temperature can be determined correctly and simply, even if the substrate vibrates or is tilting, owing to the fact that the edges ( 20 ) of the element extend in a straight line. The invention also relates to a corresponding method.

Claims (14)

1. An apparatus for measuring the temperature of substrates, comprising:

at least one first radiation detector for measuring radiation emitted by said substrate;

at least one elongated heating element for heating said substrate:

a polygonal restrictor that restricts a field of vision of said at least one first radiation detector, wherein said restrictor is disposed between said substrate and said at least one first radiation detector, wherein edges of said restrictor defining said field of vision are essentially linear and stepped, wherein images of said elongated heating element on said substrate intersect, at substantially right angles, boundary lines forming a polygon step of said field of vision, and wherein ones of said boundary lines extending substantially perpendicular to said images of said heating element on said substrate have a length greater than an expected drifting of images therealong caused by vibration or tilting of said substrate.

2. An apparatus according to claim 1 , wherein an imaging means is disposed between the substrate and said at least one first radiation detector.

3. An apparatus according to claim 2 , wherein said restrictor is disposed in an intermediate image plane of said imaging means.

4. An apparatus according to claim 1 , wherein a plurality of said first radiation detectors are provided, and wherein the fields of vision of said first radiation detectors are disposed parallel to one another.

5. An apparatus according to claim 1 , wherein a device for rotating the substrate is provided.

6. An apparatus according to claim 1 , wherein at least one further radiation detector is provided for measuring thermal radiation from at least one heating element.

7. An apparatus according to claim 6 , wherein said restricted field of vision of said at least one first radiation detector is associated with a field of vision of said further radiation detector.

8. An apparatus according to claim 1 , wherein a plurality of heating elements is provided.

9. An apparatus according to claim 6 , wherein said radiation detectors are pyrometers.

10. An apparatus according to claim 6 , wherein a cylindrical lens is disposed between the substrate and said radiation detectors.

11. An apparatus according to claim 10 , wherein said heating elements are rod lamps, and wherein an axis of said cylindrical lens is parallel to axes of said rod lamps.

Assignments (11)
RELEASE OF SECURITY INTEREST Recorded Apr 15, 2021
From: EAST WEST BANK
To: MATTSON TECHNOLOGY, INC.
Reel/Frame 055950/0452 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 23, 2021
From: MATTSON THERMAL PRODUCTS, GMBH
To: MATTSON TECHNOLOGY, INC.
Reel/Frame 055368/0987 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 23, 2021
From: MATTSON TECHNOLOGY, INC.
To: MATTSON TECHNOLOGY, INC.; BEIJING E-TOWN SEMICONDUCTOR TECHNOLOGY CO., LTD
Reel/Frame 055370/0755 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 30, 2019
From: MATTSON TECHNOLOGY, INC.
To: MATTSON TECHNOLOGY, INC.; BEIJING E-TOWN SEMICONDUCTOR TECHNOLOGY, CO., LTD
Reel/Frame 050582/0796 →
SECURITY INTEREST Recorded Aug 27, 2018
From: MATTSON TECHNOLOGY, INC.
To: EAST WEST BANK
Reel/Frame 046956/0348 →
CORRECTIVE ASSIGNMENT TO CORRECT THE PATENT NUMBER 7037797 PREVIOUSLY RECORDED AT REEL: 045763 FRAME: 0296. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 14, 2018
From: MATTSON THERMAL PRODUCTS GMBH
To: MATTSON TECHNOLOGY, INC.
Reel/Frame 046151/0332 →
CORRECTIVE ASSIGNMENT TO CORRECT THE PATENT NUMBER 7037797 PREVIOUSLY RECORDED AT REEL: 045781 FRAME: 0177. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Recorded May 14, 2018
From: STEAG RTP SYSTEMS GMBH
To: MATTSON THERMAL PRODUCTS GMBH
Reel/Frame 046151/0462 →
CORRECTIVE ASSIGNMENT TO CORRECT THE PATENT NUMBER 7,037,797 PREVIOUSLY RECORDED AT REEL: 045781 FRAME: 0177. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Recorded May 14, 2018
From: STEAG RTP SYSTEMS GMBH
To: MATTSON THERMAL PRODUCTS GMBH
Reel/Frame 046719/0574 →
CHANGE OF NAME Recorded Mar 29, 2018
From: STEAG RTP SYSTEMS GMBH
To: MATTSON THERMAL PRODUCTS GMBH
Reel/Frame 045781/0177 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 29, 2018
From: MATTSON THERMAL PRODUCTS GMBH
To: MATTSON TECHNOLOGY, INC.
Reel/Frame 045763/0296 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 16, 2001
From: HAUF, MARKUS
To: STEAG RTP SYSTEMS GMBH
Reel/Frame 012375/0802 →