IP Library Granted Patent US 6,730,931
Granted Patent Utility
US 6,730,931 · Confirmation No. 2253

INTEGRATED CIRCUIT FEATURE LAYOUT FOR IMPROVED CHEMICAL MECHANICAL POLISHING

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Code Description Pages PDF
2004-03-15 IFEE Issue Fee Payment (PTO-85B) 1 View
2001-10-02 TRNA Transmittal of New Application 2 View
2001-10-02 SPEC Specification 14 View
2001-10-02 CLM Claims 4 View
2001-10-02 ABST Abstract 1 View
2001-08-22 TRNA Transmittal of New Application 4 View
2001-08-22 A.PE Preliminary Amendment 2 View
2001-08-22 SPEC Specification 16 View
2001-08-22 CLM Claims 4 View
2001-08-22 ABST Abstract 1 View
2001-08-22 DRW Drawings-only black and white line drawings 5 View
2001-08-22 OATH Oath or Declaration filed 4 View
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Quick Facts
Patent No.
US 6,730,931
App. No.
09/935,862
Filed
2001-08-22
Granted
2004-05-04
Pub. No.
US20020104991A1
Art Unit
2815
PTA
-53 days