Method and apparatus for the thermal treatment of substrates
View Patent ↗In order to achieve temperature distribution, in particular a homogeneous temperature distribution in, for example, a substrate during a thermal treatment process of said substrate, a method is disclosed for the thermal treatment of substrates, in particular semi-conductor wafers, in a process chamber comprising at least one temperature distribution influencing element located in the process chamber. During thermal treatment, the spatial arrangement of the element is altered relative to the substrate and/or to the process chamber. A device for the thermal treatment of substrates in a process chamber is also disclosed, comprising at least one temperature distribution influencing element located in a process chamber wherein a device is provided in order to alter the spatial arrangement of the element relative to the substrate and/or to the process chamber during the thermal treatment process.
1. A method of thermally treating substrates in a process chamber having therein at least one element that influences a temperature distribution, wherein said element comprises at least one of compensation member that is adapted to surround a substrate, and a light-transforming plate that is spaced from a substrate, said method including the step of:
during a thermal treatment, varying a spatial arrangement of said at least one element, which is a passive element, relative to at least one of a substrate and said process chamber.
2. A method according to claim 1 , wherein a relative movement for said varying of said arrangement is controlled as a function of a temperature curve of said thermal treatment.
3. A method according to claim 1 , wherein said at least one element is moved relative to at least one of a substrate and said process chamber.
4. A method according to claim 3 , wherein said movement is at least one of a tilting movement, a pivoting movement and a displacement movement.
5. A method according to claim 1 , wherein said element is a compensation element, especially a compensation ring, which at least partially surrounds a substrate in a plane that is parallel to said substrate.
6. A method according to claim 1 , wherein said element is comprised of a plurality of segments, especially ring segments, and wherein at least one of said segments is moved.
7. A method according to claim 6 , wherein a movement of each segment is controlled as a function of an arrangement of at least one other segment.
8. A method according to claim 6 , wherein at least two segments are moved simultaneously.
9. A method according to claim 8 , wherein said segments are disposed diametrically across from one another in pairs relative to said substrate, and wherein said segment pairs are moved simultaneously.
10. A method according to claim 1 , wherein the spatial arrangement of at least two elements is varied relative to at least one of a substrate and said process chamber.
11. A method according to claim 1 , wherein at least one element and a substrate are moved.
12. An apparatus for thermally treating substrates, comprising:
a process chamber having therein at least one passive element that influences a temperature distribution, wherein said element is in the form of at least one of a compensation member that is adapted to surround a substrate, and a light-transforming plate that is spaced from a substrate; and
means for varying a spatial arrangement of said at least one element relative to at least one of a substrate and said process chamber during a thermal treatment.
13. An apparatus according to claim 12 , which includes means for controlling said spatial arrangement as a function of a temperature curve of said thermal treatment.
14. An apparatus according to claim 12 , wherein means are provided for moving said at least one element relative to at least one of said substrate and said process chamber.
15. An apparatus according to claim 14 , wherein said movement is at least one of a tilting movement, a pivoting movement and a displacement movement.
16. An apparatus according to claim 12 , wherein said element is a compensation member in the form of a compensation ring that surrounds a substrate in a plane that is parallel to said substrate.
17. An apparatus according to claim 16 , wherein said compensation ring is disposed at an angle to said plane of said substrate.
18. An apparatus according to claim 12 , wherein said element comprises a plurality of segments, especially ring segments, and wherein means are provided for moving at least one of said segments.
19. An apparatus according to claim 12 , wherein said spatial arrangement of at least two elements is variable relative to at least one of a substrate and said process chamber.
20. An apparatus according to claim 12 , wherein at least one element and a substrate are movable.