IP Library Granted Patent US 7,464,192
Granted Patent B2
US 7,464,192 · App. 10/238,757 · Granted Dec 9, 2008

Programmable serial interface for a semiconductor circuit

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Quick Facts
Patent No.
US 7,464,192
App. No.
10/238,757
Granted
Dec 9, 2008
Kind
B2
Abstract

A programmable serial interface is disclosed for use in a semiconductor circuit that supports a plurality of communication protocols. The programmable serial interface includes one or more shared hardware components that implement tasks and functions of a plurality of communication protocols, optional protocol specific hardware, a processor and memory. For each task or function required by a supported communication protocol, a determination is made as to which parts of the function will be implemented using shared hardware, protocol specific hardware or in software. The communication protocols to be supported are identified, and the functions performed in accordance with each of the supported protocols are analyzed to identify those functions suitable for common or shared hardware with other communication protocols. In addition, unique or time-critical functions are identified that must be implemented in hardware. Finally, any functions that are not implemented in hardware are implemented in software.

Claims (37)

1. A smart card programmable serial interface for use in a semiconductor circuit that supports a plurality of protocols, the serial interface comprising:

an input/output buffer for use in a smart card and for providing serial communication between the semiconductor circuit and an external device using at least one of the plurality of protocols, the input/output buffer including an electrical connection for coupling to said external device, the input/output buffer being configurable to provide, on the electrical connection, signals having electrical characteristics of each protocol of the plurality of protocols;

at least one shared hardware element for use in the smart card and coupled to the input/output buffer, the shared hardware element performing a common task for said plurality of protocols; and

a programmable logic array for use in the smart card and coupled to the input/output buffer, the programmable logic array implementing one or more additional tasks for said plurality of protocols;

wherein said smart card programmable serial interface is reconfigurable by software to support each protocol of said plurality of protocols.

2. The programmable serial interface of claim 1 , wherein said programmable logic array is reconfigurable.

3. The programmable serial interface of claim 1 , wherein said at least one shared hardware element is reconfigurable.

4. The programmable serial interface of claim 1 , wherein said common task is a serial-to-parallel conversion.

5. The programmable serial interface of claim 1 , wherein said common task is a parallel-to-serial conversion.

6. The programmable serial interface of claim 1 , wherein the semiconductor circuit comprises integrated circuitry logically arranged to implement hardware components that are one or both of shared by the plurality of protocols and/or required for protocol-specific functionality.

7. The programmable serial interface of claim 1 , wherein said common task is a clock recovery function.

8. The programmable serial interface of claim 1 , wherein said additional task is a bit stuffing function.

9. The programmable serial interface of claim 1 , wherein said programmable logic array is a field programmable gate array.

10. The programmable serial interface of claim 1 , wherein said programmable logic array is an electrical programmable logic device (EPLD).

11. A method for designing a smart card semiconductor circuit, said method comprising the steps of:

in a semiconductor circuit for use in a smart card, identifying a plurality of communication protocols to be supported by said semiconductor circuit;

analyzing functions required by each of said supported communication protocols to identify those functions suitable for an implementation using shared hardware with other communication protocols;

designing an input/output buffer for use in a smart card for providing serial communication between the semiconductor circuit and an external device using at least one of the plurality of protocols, the input/output buffer including an electrical connection for coupling to said external device, the input/output buffer being configurable to provide, on the electrical connection, signals having electrical characteristics of each protocol of the plurality of protocols; and

designing a shared hardware element for use in the smart card and coupled to the input/output buffer, the shared hardware element performing a common task for said plurality of communication protocols;

wherein said semiconductor circuit is reconfigurable by software to support each protocol of said plurality of communication protocols.

12. The method of claim 11 , further comprising the step of identifying functions required by a supported communication protocol that must be performed in hardware.

13. The method of claim 12 , wherein said hardware is a programmable logic array.

14. The method of claim 13 , wherein said programmable logic array is reconfigurable.

15. The method of claim 13 , wherein said programmable logic array is a field programmable gate array.

16. The method of claim 13 , wherein said programmable logic array is an electrical programmable logic device (EPLD).

17. The method of claim 11 , further comprising the step of implementing at least a portion of the functions required by a supported communication protocol in software.

18. The method of claim 11 , wherein said shared hardware element is reconfigurable.

19. A system for designing a smart card semiconductor circuit, said system comprising:

a memory that stores computer-readable code; and

a processor operatively coupled to said memory, said processor configured to implement said computer-readable code, said computer-readable code configured to:

identify a plurality of communication protocols to be supported by said semiconductor circuit;

analyze functions required by each of said supported communication protocols to identify those functions suitable for an implementation using shared hardware with other communication protocols;

design an input/output buffer for use in a smart card for providing serial communication between the semiconductor circuit and an external device using at least one of the plurality of protocols, the input/output buffer including an electrical connection for coupling to said external device, the input/output buffer being configurable to provide, on the electrical connection, signals having electrical characteristics of each protocol of the plurality of protocols; and

design a shared hardware element for use in the smart card and coupled to the input/output buffer, the shared hardware element performing a common task for said plurality of communication protocols;

wherein said smart card semiconductor circuit is reconfigurable by software to support each protocol of said plurality of communication protocols.

20. The system of claim 19 , wherein said processor is further configured to identify functions required by a supported communication protocol that must be performed in hardware.

21. The system of claim 19 , wherein said processor is further configured to identify functions required by a supported communication protocol to be performed in software.

Assignments (19)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 059687/0344 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: SILICON STORAGE TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0316 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 17, 2005
From: EMOSYN AMERICA, INC.
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 016793/0321 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 30, 2004
From: ADVANCED TECHNOLOGY MATERIALS, INC.
To: EMOSYN AMERICA, INC.
Reel/Frame 015503/0023 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 9, 2004
From: ADVANCED TECHNOLOGY MATERIALS, INC.
To: ADVANCED TECHNOLOGY MATERIALS, INC.; EM MICROELECTRIC-MARIN SA
Reel/Frame 015098/0493 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 22, 2004
From: BARNETT, PHILIP C.; GREEN, ANDY
To: ADVANCED TECHNOLOGY MATERIALS, INC.
Reel/Frame 015120/0916 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 27, 2003
From: BARNETT, PHILIP C.
To: ADVANCED TECHNOLOGY MATERIALS, INC.
Reel/Frame 013792/0089 →