IP Library Granted Patent US 7,032,064
Granted Patent B2
US 7,032,064 · App. 10/376,682 · Granted Apr 18, 2006

Single chip embedded microcontroller having multiple non-volatile erasable PROMS sharing a single high voltage generator

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Quick Facts
Patent No.
US 7,032,064
App. No.
10/376,682
Granted
Apr 18, 2006
Kind
B2
Abstract

A single chip embedded microcontroller has a processor that communicates with multiple non-volatile erasable PROMS which may be an OTPROM and an EEPROM. The processor also communicates with a high voltage generator that produces the erase and write voltages for the OTPROM and EEPROM. A switch communicates with the high voltage generator and switches the erase and write voltages alternately between the OTPROM and EEPROM. The OTPROM and EEPROM are FLASH arrays. The FLASH array technology allows the EEPROM and OTPROM to have similar erase and write voltages and therefore to share one high voltage generator. The high voltage generator is switched alternately between the first and second non-volatile erasable PROM arrays to enforce the principle that the EEPROM and OTPROM cannot be written to or erased at the same and may only be written to or erased one at a time.

Claims (35)

1. A single chip embedded microcontroller comprising,

a processor,

a first non-volatile erasable PROM array having a communication link with said processor, said processor capable of reading, erasing and writing information to and from said first non-volatile erasable PROM, wherein said erasing of said first non-volatile erasable PROM array is performed on a plurality of bytes, and where said first non-volatile erasable PROM array is an OTPROM,

a second non-volatile erasable PROM array having a communication link with said processor, said processor capable of reading, erasing and writing information to and from said second non-volatile erasable PROM, wherein said erasing of said second non-volatile erasable PROM array is performed on a single byte,

a high voltage generator having a communication link with said processor, said high voltage generator generating two or more different erase and write voltages,

a switch communicating with said high voltage generator, said switch connects said two or more different erase and write voltages between said first and second non-volatile erasable PROM arrays, and

said first non-volatile erasable PROM array contains an operating system which controls said single chip embedded microcontroller and alternately provides said two or more different erase and write voltages to said first and second non-volatile erasable PROM arrays.

2. The single chip embedded microcontroller of claim 1 where said switch operates such that said two or more different erase and write voltages cannot be applied simultaneously to both of said first and second non-volatile PROM arrays and can only be applied to either of said first and second non-volatile PROM arrays.

3. The single chip embedded microcontroller of claim 1 in which said first and second non-volatile erasable PROM arrays are FLASH arrays.

4. The single chip embedded microcontroller of claim 1 in which said second non-volatile erasable PROM array is an EEPROM.

5. The single chip embedded microcontroller of claim 1 having an interface circuit that receives signals from outside said single chip embedded microcontroller, said interface circuit having a communication link with said processor.

6. The single chip embedded microcontroller of claim 1 having a ROM containing a program to load said first non-volatile erasable PROM array with an operating system, said ROM communicating with said processor.

7. A single chip embedded microcontroller comprising,

a processor,

a first non-volatile erasable PROM array having a communication link with said processor, said processor capable of reading, erasing and writing information to and from said first non-volatile erasable PROM, wherein said erasing of said first non-volatile erasable PROM array is performed on a plurality of bytes, and where said first non-volatile erasable PROM array is an OTPROM,

a second non-volatile erasable PROM array having a communication link with said processor, said processor capable of reading, erasing and writing information to and from said second non-volatile erasable PROM, wherein said erasing of said second non-volatile erasable PROM array is performed on a single byte,

a high voltage generator that generates two or more different erase and write voltages and provides said two or more different erase and write voltages to said first and second non-volatile erasable PROM arrays, said high voltage generator having a communication link with said processor, and

said first non-volatile erasable PROM array contains an operating system which controls said single ship embedded microcontroller and alternately provides said two or more different erase and write voltages to said first and second non-volatile erasable PROM arrays.

8. The single chip embedded microcontroller of claim 7 where said high voltage generator operates such that said two or more different erase and write voltages cannot be applied simultaneously to both of said first and second non-volatile PROM arrays and can only be applied to either of said first and second non-volatile PROM arrays.

9. The single chip embedded microcontroller of claim 7 in which said first and second non-volatile erasable PROM arrays are FLASH arrays.

10. The single chip embedded microcontroller of claim 7 in which said second non-volatile erasable PROM array is an EEPROM.

11. The single chip embedded microcontroller of claim 7 having a ROM containing a program to load said first non-volatile erasable PROM array with an operating system, said ROM communicating with said processor.

12. A single chip embedded microcontroller comprising,

a processor,

a first non-volatile erasable PROM array having a communication link with said processor, said processor capable of reading, erasing and writing information to and from said first non-volatile erasable PROM, wherein said erasing of said first non-volatile erasable PROM array is performed on a plurality of bytes, and where said first non-volatile erasable PROM array is an OTPROM,

a ROM containing a program to load said first non-volatile erasable PROM array with an operating system, said ROM communicating with said processor,

a second non-volatile erasable PROM array having a communication link with said processor, said processor capable of reading, erasing and writing information to and from said second non-volatile erasable PROM, wherein said erasing of said second non-volatile erasable PROM array is performed on a single byte,

a high voltage generator having a communication link with said processor, said high voltage generator generating two or more different erase and write voltages, and

a switch communicating with said high voltage generator, said switch connects said two or more different erase and write voltages between said first and second non-volatile erasable PROM arrays.

13. A single chip embedded microcontroller comprising,

a processor,

a first non-volatile erasable PROM array having a communication link with said processor, said processor capable of reading, erasing and writing information to and from said first non-volatile erasable PROM, wherein said erasing of said first non-volatile erasable PROM array is performed on a plurality of bytes, and where said first non-volatile erasable PROM array is an OTPROM,

a ROM containing a program to load said first non-volatile erasable PROM array OTPROM-with an operating system, said ROM communicating with said processors

a second non-volatile erasable PROM array having a communication link with said processor, said processor capable of reading, erasing and writing information to and from said second non-volatile erasable PROM, wherein said erasing of said second non-volatile erasable PROM array is performed on a single byte, and

a high voltage generator that generates two or more different erase and write voltages and provides said two or more different erase and write voltages to said first and second non-volatile erasable PROM arrays, said high voltage generator having a communication link with said processor.

Assignments (16)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 059687/0344 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: SILICON STORAGE TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0316 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 17, 2005
From: EMOSYN AMERICA, INC.
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 016793/0321 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 30, 2004
From: ADVANCED TECHNOLOGY MATERIALS, INC.
To: EMOSYN AMERICA, INC.
Reel/Frame 015503/0023 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 9, 2004
From: ADVANCED TECHNOLOGY MATERIALS, INC.
To: ADVANCED TECHNOLOGY MATERIALS, INC.; EM MICROELECTRIC-MARIN SA
Reel/Frame 015098/0493 →