Programmable logic device partitioning method for application specific integrated circuit prototyping
View Patent ↗The interconnect pin count between field programmable gate arrays (FPGAS) used in prototyping an application specific integrated circuit (ASIC) is reduced without compromising the prototyping by using serial links between the FPGAs. A block A of the ASIC is programmed in a first FPGA. A block B of the ASIC is programmed in a second FPGA. Blocks A and B are identical between ASIC and FPGA implementations. Block A communicates with block B via two interconnected wrappers, which are, in this example, serial COM wrappers connected by a serial link.
1. A method for application specific integrated circuit prototyping comprising:
programming a first block of said application specific integrated circuit in a first programmable logic device wherein said first block generates a plurality of parallel output signals;
programming a second block of said application specific integrated circuit in a second programmable logic device;
using a first serial COM wrapper, in said first programmable logic device, to convert said plurality of parallel output signals to a serial data stream; and
using a second serial COM wrapper, in said second programmable logic device, to convert said serial data stream to said plurality of parallel output signals.
2. The method of claim 1 further comprising:
using a plurality of n serializer units in said first COM wrapper, wherein each serializer unit in said plurality of n serializer units processes a different set of output signals in said plurality of parallel output signals to create a serial data stream so that a plurality of n serial data streams are created, wherein n is an integer.
3. The method of claim 2 further comprising:
using a plurality of n deserializer units in said second COM wrapper, wherein each deserializer unit in said plurality of n deserializer units processes a different serial data stream in said plurality of n serial data streams.
4. The method of claim 1 wherein said first programmable logic device is a field programmable gate array, and said second programmable logic device is another field programmable gate array.
5. A structure comprising:
a printed circuit board;
a first programmable logic device, coupled to said printed circuit board, comprising:
a pin; a
a block of an application specific integrated circuit being prototyped wherein said block generates a plurality of output signals wherein said block of said application specific integrated circuit was programmed in said first programmable logic device; and
a serial COM wrapper coupled to said block to receive a plurality of parallel output signals, and coupled to said pin;
a second programmable logic device, coupled to said printed circuit board, comprising:
another pin;
another block of said application specific integrated circuit being prototyped wherein said another block of said application specific integrated circuit was programmed in said first programmable logic device; and
another serial COM wrapper coupled to said another block to provide a plurality of parallel input signals, and coupled to said another pin; and
a trace on said printed circuit board coupling said pin to said another pin.
6. The structure of claim 5 wherein said serial COM wrapper comprises:
at least one serializer unit.
7. The structure of claim 5 wherein said serial COM wrapper comprises:
a plurality of serializer units wherein each serializer unit is coupled to receive a different set of output signals in said plurality of output signals.
8. The structure of claim 5 wherein said another serial COM wrapper comprises:
at least one deserializer unit.
9. The structure of claim 5 wherein said another serial COM wrapper comprises:
a plurality of deserializer units wherein each deserializer unit is coupled to receive a different serial data stream.
10. The structure of claim 5 wherein said first programmable logic device is a field programmable gate array, and said second programmable logic device is another field programmable gate array.