IP Library Granted Patent US 7,437,641
Granted Patent B1
US 7,437,641 · App. 11/096,293 · Granted Oct 14, 2008

Systems and methods for signature circuits

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Quick Facts
Patent No.
US 7,437,641
App. No.
11/096,293
Granted
Oct 14, 2008
Kind
B1
Abstract

Signature circuits are used during testing of an integrated circuit. Test vectors are applied as inputs to a circuit under test. A signature circuit stores a “signature” for the circuit under test based on a combination of signals from the circuit under test in response to test vectors and a previous stored state of the signature register. The value contained in the signature register at the end of the test is the signature. A fault-free circuit generates a particular signature for the applied test vectors. Faults can be determined by detecting variances from the expected signature. In one embodiment, the signature circuit uses a combination of two error detection codes.

Claims (24)

1. A signature circuit comprising:

a first check symbol generator circuit in communication with a circuit under test (CUT), where the first check symbol generator circuit is configured to generate a first error detection code that is a parity type of code as an output; and

a second check symbol generator circuit in communication with the first check symbol generator circuit, wherein the second check symbol generator circuit is configured to generate a second error detection code that is a check of the first error detection code from states of at least a portion of the first error detection code as the first error detection code is being generated, wherein the second check symbol generator circuit is configured to generate a weight-based code of an information word from the first check symbol generator circuit such that the second error detection code is a different type of error detection code than the first error detection code.

2. The signature circuit as defined in claim 1 , wherein the first check symbol generator circuit corresponds to a diagonal bit-interleaved parity (BIP) check symbol generation circuit and where the second check symbol generator circuit corresponds to a Bose-Lin check symbol code generator circuit.

3. The signature circuit as defined in claim 1 , wherein the second check symbol generator circuit is further configured to generate a modulo count of logical ones or zeroes of states of an information word from the first check symbol generator circuit.

4. The signature circuit as defined in claim 1 , wherein the first check symbol generator circuit corresponds to a Multiple Input Signature Register (MISR) circuit and where the second check symbol generator circuit is configured to generate a modulo count of logical ones or zeroes of states of an information word from the MISR circuit.

5. A method of testing a circuit, the method comprising:

applying test vectors to the circuit under test;

monitoring selected signals of the circuit under test;

generating a first error detection code at least partially based on the monitored signals, wherein the first error detection code corresponds to a parity of error detection code; and

generating a second error detection code as a check for the first error detection code from states of at least a portion of the first error detection code as the first error detection code is being generated, wherein the second error detection code corresponds to a weight-based code such that the second error detection code is a different type of error detection code than the first error detection code.

6. The method as defined in claim 5 , wherein the first error detection code is generated by bit-interleaved parity and where the second error detection code corresponds to a Bose-Lin code.

7. The method as defined in claim 5 , wherein the second error detection code corresponds to a modulo count of logical ones or zeroes.

8. The method as defined in claim 5 , wherein the first error detection code corresponds to a parity type of error detection code computed by a Multiple Input Signature Register (MISR) and wherein the second error detection code corresponds to a modulo count of logical ones or zeroes.

9. A method of testing a circuit, the method comprising:

applying test vectors to the circuit under test;

monitoring selected signals of the circuit under test;

generating a first error detection code based at least partly on a parity check calculation of the monitored signals; and

generating a second error detection code as a check for the first error detection code from states of a selected bit of the first error detection code, wherein the second error detection code is a weight-based code generated by counting occurrences of one of logical “0” or “1” in the selected bit of the first error detection code as the first error detection code is being generated.

10. The method as defined in claim 9 , further comprising counting occurrences in a selected bit of a prior state of the error detection code.

11. A signature circuit comprising:

a means for monitoring selected signals of a circuit under test;

a means for generating a first error detection code at least partially based on the monitored signals, wherein the means for generating the first error detection code is configured to generate a parity type of code; and

a means for generating a second error detection code as a check for the first error detection code from states of at least a portion of the first error detection code as the first error detection code is being generated, wherein the means for generating the second error detection code is configured to generate a weight-based code such that the second error detection code is a different type of error detection code than the first error detection code.

Assignments (17)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
RELEASE OF SECURITY INTEREST Recorded May 29, 2018
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI STORAGE SOLUTIONS, INC.; MICROSEMI STORAGE SOLUTIONS (U.S.), INC.
Reel/Frame 046251/0271 →
CHANGE OF NAME Recorded Apr 7, 2016
From: PMC-SIERRA, INC.
To: MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 038381/0753 →
PATENT SECURITY AGREEMENT Recorded Feb 3, 2016
From: MICROSEMI STORAGE SOLUTIONS, INC. (F/K/A PMC-SIERRA, INC.); MICROSEMI STORAGE SOLUTIONS (U.S.), INC. (F/K/A PMC-SIERRA US, INC.)
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037689/0719 →
RELEASE OF SECURITY INTEREST Recorded Feb 1, 2016
From: BANK OF AMERICA, N.A.
To: PMC-SIERRA, INC.; PMC-SIERRA US, INC.; WINTEGRA, INC.
Reel/Frame 037675/0129 →
SECURITY INTEREST IN PATENTS Recorded Aug 6, 2013
From: PMC-SIERRA, INC.; PMC-SIERRA US, INC.; WINTEGRA, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 030947/0710 →