Granted Patent B2

US 7,626,277 · App. 11/164,329 · Granted Dec 1, 2009

Abstract

Claims (40)

1. An integrated circuit package comprising:

a substrate including:

a core layer having a through opening and vias provided therein,

a first conductive layer on the core layer covering the through opening, and

a second conductive layer on the core layer opposite the first conductive layer,

the second conductive layer in the through opening and in the vias contacting the first conductive layer;

an integrated circuit die bonded to the second conductive layer and in the through opening;

connections between the integrated circuit die and the second conductive layer; and

an encapsulant encapsulating the integrated circuit die and the connections.

2. The package as claimed in claim 1 wherein:

the first conductive layer is formed into terminals and a ground or thermal pad; and

the second conductive layer is formed into an integrated circuit die bonded portion and terminals, the terminals extending from the core layer.

3. The package as claimed in claim 1 wherein:

the first conductive layer is formed into terminals and a ground or thermal pad;

the second conductive layer is formed into an integrated circuit die bonded portion and terminals; and

the terminals of the first and second conductive layers have a shape of at least one of square, rectangular, and round.

4. The package as claimed in claim 1 wherein:

the second conductive layer is formed into terminals and a ground or thermal pad; and

further comprising solder balls connected to the terminals in a plurality of rows.

5. The package as claimed in claim 1 wherein:

the first conductive layer is a ground or thermal pad;

the second conductive layer is formed into an integrated circuit die bonded portion and terminals; and

further comprising solder balls connected to the terminals.

6. The package as claimed in claim 1 wherein the second conductive layer forms blind vias in the vias.

7. The package as claimed in claim 1 wherein the first conductive layer forms a plurality of rows of terminals.

8. The package as claimed in claim 1 wherein the first conductive layer forms a plurality of terminals having at least one shape from a rectangle, square, and circle.

9. The package as claimed in claim 1 further comprising a solder mask over at least one of the first and second conductive layer.

10. The package as claimed in claim 1 further comprising:

a second substrate including:

a core layer having a through opening and vias provided therein,

a first conductive layer on the bottom of the core layer covering the through opening, and

a second conductive layer on the top of the core layer, the second conductive layer in the through opening and in the vias contacting the first conductive layer, the second conductive layer in the vias formed into terminals;

a second integrated circuit die bonded to the second conductive layer of the second substrate and in the through opening thereof;

second connections bonding the integrated circuit die to the second conductive layer of the second substrate;

an encapsulant encapsulating the second integrated circuit die and the second connections; and

wherein:

the first substrate includes the first conductive layer thereof formed into terminals extending from the core layer thereof;

the first and second substrates are bonded with the terminals of the first and second substrates electrically connected.

11. The package as claimed in claim 10 wherein:

the first and second substrates are bonded by at least one of solder, solder balls, conductive adhesive, or a combination thereof.

Assignments (8)