Semiconductor package for a large die
View Patent ↗A semiconductor package is provided. A semiconductor package has a die pad and a plurality of bonding fingers. A spacer is attached to the die pad, and a large die is attached to the spacer. The large die is wire bonded to the plurality of bonding fingers using a plurality of bonding wires. The die pad, plurality of bonding fingers, spacer, large die, and bonding wires are encapsulated to form the semiconductor package. The semiconductor package can be either a single or dual row package, such as a QFN or BGA package.
1. A semiconductor package for a large die comprising:
a die pad;
a plurality of bonding fingers having contact pads;
a spacer attached by a first adhesive to the die pad;
the large die extending over the contact pads and the spacer, the large die attached by a second adhesive to the spacer and supported only by the first adhesive, the second adhesive, and the spacer on the die pad;
bonding wires bonded between the large die and the plurality of bonding fingers, the bonding wires having portions parallel to a side of the large die; and
an encapsulant to encapsulate the die pad, the plurality of bonding fingers, the spacer, the large die, and the bonding wires.
2. The semiconductor package as claimed in claim 1 wherein the spacer is a conductive material having a thickness in the range of about 100 microns to about 300 microns.
3. The semiconductor package as claimed in claim 1 wherein the large die overlaps the inner edges of the bonding fingers.
4. The semiconductor package as claimed in claim 1 wherein:
the plurality of bonding fingers have a plurality of contact pads thereon; and
the large die at least partially overlaps the plurality of contact pads.
5. The semiconductor package as claimed in claim 1 wherein the bonding wires have a substantially 90° angle bend.
6. A semiconductor package for a large die comprising:
a die pad;
a plurality of inner bonding fingers having inner contact pads;
a plurality of outer bonding fingers;
a spacer attached by a first adhesive to the die pad;
the large die extending over the inner contact pads and the spacer, the large die attached by a second adhesive to the spacer and only supported by the first adhesive, the second adhesive, and the spacer on the die pad;
a plurality of bonding wires connected between the large die and the plurality of inner bonding fingers and the plurality of outer bonding fingers, the bonding wires having a portion substantially parallel to a side of the large die; and
an encapsulant to encapsulate the die pad, the plurality of inner bonding fingers, the plurality of outer bonding fingers, the spacer, the large die, and the plurality of bonding wires.
7. The semiconductor package as claimed in claim 6 wherein the spacer is a conductive material having a thickness in the range of about 100 microns to about 300 microns.
8. The semiconductor package as claimed in claim 6 wherein the large die overlaps the inner edge of the plurality of inner bonding fingers.
9. The semiconductor package as claimed in claim 6 wherein:
the plurality of inner bonding fingers have a plurality of contact pads thereon; and
the large die at least partially overlaps the plurality of contact pads.
10. The semiconductor package as claimed in claim 6 wherein the semiconductor package is a quad flat-packed non-leaded package, a leadframe ball grid array package, or a combination thereof.