Large die package structures and fabrication method therefor
View Patent ↗A method for fabricating large die package structures is provided wherein at least portions of the leadtips of at least a plurality of leadfingers of a leadframe are electrically insulated. A die is positioned on the electrically insulated leadtips. The die is electrically connected to at least a plurality of the leadfingers.
1. A method for fabricating large die package structures, comprising:
providing a leadframe having a die paddle and a plurality of leadfingers;
electrically insulating at least portions of the leadtips of at least a plurality of leadfingers of the leadframe;
forming notches in at least a plurality of the leadtips;
positioning a die in the notches on the electrically insulated leadtips;
attaching the die to a die paddle on the leadframe;
electrically connecting the die to at least some of the plurality of leadfingers; and
encapsulating at least a portion of the leadframe and die in a mold compound.
2. The method of claim 1 wherein electrically insulating further comprises insulating with a non-conductive material located between the leadtips and the die.
3. The method of claim 1 wherein forming notches further comprises forming notches in the upper surfaces of the leadtips for receiving the die therein.
4. The method of claim 1 wherein positioning the die further comprises supporting the die on a flip chip that is located on the leadframe and electrically connected thereto.
5. A method for fabricating large die package structures, comprising:
electrically insulating the leadtips of leadfingers of a leadframe;
etching notches in the upper surfaces of the leadtips for receiving a die therein;
positioning a die in the notches on the electrically insulated leadtips;
wire bonding the die to the leadfingers to electrically connect the die thereto; and
encapsulating at least a portion of the leadframe and die in a mold compound.
6. The method of claim 5 wherein electrically insulating further comprises insulating with a non-conductive film located between the leadtips and the die.
7. The method of claim 5 wherein positioning the die further comprises attaching the die to a die paddle on the leadframe with a conductive adhesive.
8. The method of claim 5 wherein positioning the die further comprises supporting the die on a flip chip that is located on the leadframe and electrically connected thereto.
9. A large die package structure, comprising:
a leadframe having leadfingers and a die paddle;
leadtips on the leadfingers;
at least portions of the leadtips of at least some of the plurality of leadfingers being electrically insulated;
notches in at least a plurality of the leadtips;
a die positioned in the notches on the electrically insulated leadtips;
the die being attached to the die paddle and electrically connected to at least some of the plurality of leadfingers; and
a mold compound encapsulating at least a portion of the leadframe and the die.
10. The structure of claim 9 wherein the leadfingers are electrically insulated with a non-conductive material located between the leadtips and the die.
11. The structure of claim 9 wherein the notches further comprise notches in the upper surfaces of the leadtips for receiving the die therein.
12. The structure of claim 9 :
further comprising a flip chip that is located on the leadframe and electrically connected thereto; and
wherein the die is supported on the flip chip.
13. A large die package structure, comprising:
a leadframe having a die paddle and leadfingers;
leadtips on the leadfingers;
the leadtips of the leadfingers being electrically insulated;
notches in the leadtips configured for receiving a die in the notches;
a die positioned in the notches on the electrically insulated leadtips and attached to the die paddle;
wirebonds electrically connecting the die to the leadfingers; and
a mold compound encapsulating at least a portion of the leadframe and the die.
14. The structure of claim 13 wherein the leadfingers are electrically insulated with a non-conductive material located between the leadtips and the die.
15. The structure of claim 13 wherein the notches further comprise notches in the upper surfaces of the leadtips for receiving the die therein.
16. The structure of claim 13 :
further comprising a flip chip that is located on the leadframe and electrically connected thereto; and
wherein the die is supported on the flip chip.