Integrated circuit package system with post-passivation interconnection and integration
View Patent ↗An integrated circuit package system including: providing an integrated circuit die, forming a first layer over the integrated circuit die, forming a bridge on and in the first layer, forming a second layer on the first layer, and forming bump pads on and in the second layer, the bump pads connected to ends of the bridge.
1. A method for manufacturing an integrated circuit package system comprising:
providing an integrated circuit die with a bond pad;
forming a passivation layer over the integrated circuit die;
forming a first metal layer over the passivation layer to form a bridge directly on the passivation layer;
forming an insulation layer on the passivation layer, the insulation layer having openings provided therein; and
forming a second metal layer including a redistribution layer between the bond pad and the bridge over the insulation layer, the second metal layer having separate portions, each separate portion connected to the bridge and directly on or in the insulation layer by the openings provided in the insulation layer.
2. The method as claimed in claim 1 wherein:
providing the integrated circuit die provides the integrated circuit die with adjacent bond pads; and
forming the first metal layer includes forming another bridge connected at ends thereof to the adjacent bond pads.
3. The method as claimed in claim 1 wherein:
providing the integrated circuit die provides the integrated circuit die with integral adjacent bond pads;
forming the passivation layer provides openings therein exposing the integral adjacent bond pads;
forming the first metal layer forms separate contacts connected to the integral adjacent bond pads; and
forming the second metal layer forms separate circuit components respectively connected to the separate contacts through openings in the insulation layer.
4. The method as claimed in claim 1 wherein forming the second metal layer forms a separate portion as a circuit component.
5. The method as claimed in claim 1 further comprising:
forming the second metal layer includes forming a bump pad; and
connecting a solder ball on top of the bump pad.
6. An integrated circuit package system comprising:
an integrated circuit die with a bond pad;
a passivation layer over the integrated circuit die;
a first metal layer over the passivation layer including a bridge directly on the passivation layer;
an insulation layer on the passivation layer, the insulation layer having openings provided therein; and
a second metal layer including a redistribution layer between the bond pad and the bridge over the insulation layer, the second metal layer having separate portions, each separate portion connected to the bridge and directly on or in the insulation layer.
7. The system as claimed in claim 6 wherein:
the integrated circuit die provides the integrated circuit die with adjacent bond pads; and
the first metal layer includes another bridge connected at ends thereof to one of the adjacent bond pads.
8. The system as claimed in claim 6 wherein:
the integrated circuit die provides the integrated circuit die with integral adjacent bond pads;
the passivation layer provides openings therein exposing the integral adjacent bond pads;
the first metal layer is formed into separate contacts with the separate contacts connected to the integral adjacent bond pads; and
the second metal layer is formed into separate circuit components respectively connected to the separate contacts through openings in the insulation layer.
9. The system as claimed in claim 6 wherein the second metal layer has a separate portion in the form of a circuit component.
10. The system as claimed in claim 6 wherein:
the second metal layer has a separate portion in the form of a bump pad; and
a solder ball is on top of the bump pad.