IP Library Granted Patent US 10,444,749
Granted Patent B2
US 10,444,749 · App. 11/877,058 · Granted Oct 15, 2019

Methods and systems for controlling a semiconductor fabrication process

Inventors: Patrick D. Pannese (Lynnfield, MA); Vinaya Kavathekar (Cupertino, CA); Peter van der Meulen (Newburyport, MA)
Assignee: BROOKS AUTOMATION, INC.
G05B99/00G05B15/02G05B19/41865G05B19/41885G05B23/0267G06T7/0004H01L21/6719H01L21/67161H01L21/67184H01L21/67196H01L21/67201H01L21/67207H01L21/67742H01L21/67745G05B2219/30G05B2219/31G05B2219/31467G05B2219/31472G05B2219/32128G05B2219/32267G05B2219/32329G05B2219/32335G05B2219/32342G05B2219/32351G05B2219/35494G05B2219/40411G05B2219/40412G05B2219/40413G05B2219/40419G05B2219/40424G05B2219/45031G06F15/00Y02P90/18Y02P90/20Y02P90/26Y02P90/86
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Quick Facts
Patent No.
US 10,444,749
App. No.
11/877,058
Granted
Oct 15, 2019
Kind
B2
Abstract

Software for controlling processes in a heterogeneous semiconductor manufacturing environment may include a wafer-centric database, a real-time scheduler using a neural network, and a graphical user interface displaying simulated operation of the system. These features may be employed alone or in combination to offer improved usability and computational efficiency for real time control and monitoring of a semiconductor manufacturing process. More generally, these techniques may be usefully employed in a variety of real time control systems, particularly systems requiring complex scheduling decisions or heterogeneous systems constructed of hardware from numerous independent vendors.

Claims (27)

1. A semiconductor workpiece handling system user interface comprising:

a display of a three-dimensional simulation of a physical semiconductor workpiece handling system that includes at least one hardware item, wherein the at least one hardware item includes both a semiconductor workpiece handling hardware item and a semiconductor workpiece hardware item that is handled by the semiconductor workpiece handling hardware item;

a link to information corresponding to and representative of a respective one of the at least one hardware item so that each different link corresponds to and is representative of a different respective one of the at least one hardware item, wherein each different link is contained within a different area of the display where each different respective one of the at least one hardware item resides, and wherein at least one link to the information includes at least a status of the at least one hardware item and technical information informing a real time state of both the semiconductor workpiece handling hardware item and the semiconductor workpiece hardware item of the at least one hardware item obtained from at least a semiconductor wafer-centric data base, where the real time state of the semiconductor workpiece hardware item relates to a change in location of the semiconductor workpiece hardware item; and

a controller configured to

effect generation of the three-dimensional simulation in real time based on concurrent operational data, from semiconductor workpiece processing, received from the physical semiconductor workpiece handling system, and

generate the display of the three-dimensional simulation substantially coincident with the generation of the three-dimensional simulation, the three-dimensional simulation being generated substantially coincident with and based on a real-world operation of the semiconductor workpiece handling system that generates the concurrent operation data, so that the display of the three-dimensional simulation is generated in real time with the three dimensional simulation and is based on and concurrent with the concurrent operational data, from semiconductor workpiece processing, received from the physical semiconductor workpiece handling system, so that the concurrent operational data, that is the basis of the three-dimensional simulation, and generation of the display of the three-dimensional simulation are substantially coincident,

where the concurrent operational data includes data identifying the status of the hardware item concurrent with the real time simulation.

2. The semiconductor workpiece handling system user interface of claim 1 , wherein the semiconductor workpiece handling system includes a plurality of hardware items, each one of the plurality of hardware items having a link to information associated therewith.

3. The semiconductor workpiece handling system user interface of claim 1 , wherein the technical information includes at least one of a list of replacement parts for the hardware item, a manual for the hardware item, and a maintenance log for the hardware item.

4. The semiconductor workpiece handling system user interface of claim 1 , wherein the link is activated by at least one of mouse over of the link and a mouse click of the link.

5. The semiconductor workpiece handling system user interface of claim 1 , wherein the information is displayed in a new window upon activation of the link.

6. The semiconductor workpiece handling system user interface of claim 1 , wherein the information is displayed in a pop-up window upon activation of the link.

7. The semiconductor workpiece handling system user interface of claim 1 , wherein the status information includes sensor data received from the hardware item.

8. The semiconductor workpiece handling system user interface of claim 1 , wherein the status information includes diagnostic information for the hardware item.

9. The semiconductor workpiece handling system user interface of claim 8 , wherein the diagnostic information includes one or more of a performance evaluation, an expected time to failure, a maintenance alert, and an operating condition alert.

10. The semiconductor workpiece handling system user interface of claim 1 , wherein the hardware item includes one or more of a robotic arm, an end effector, an isolation valve, a heating station, a cooling station, a load lock, a vacuum pump, a robot drive, a metrology device, a sensor, a process module, and a device within a process module.

11. The semiconductor workpiece handling system user interface of claim 1 , wherein the information includes one or more of a particle map of the semiconductor wafer, an estimated temperature of the semiconductor wafer, and a wafer center location of the semiconductor wafer.

12. The semiconductor workpiece handling system user interface of claim 1 wherein the status information includes real time data for the hardware item.

13. The semiconductor workpiece handling system user interface of claim 1 , wherein the display includes a tool for user selection of a perspective for viewing the three-dimensional simulation.

14. The user interface of claim 1 , wherein the three-dimensional simulation is a real time simulation illustrating a kinematic operational status of the hardware item in the physical semiconductor workpiece handling system based on concurrent operational data received from the physical semiconductor workpiece handling system.

15. A method for processing a semiconductor workpiece hardware item in a physical semiconductor workpiece handling system, the method comprising:

displaying, in a user interface a three-dimensional real time simulation of the physical semiconductor workpiece handling system that includes at least one hardware item, where the at least one hardware item includes both a semiconductor workpiece handling hardware item and the semiconductor workpiece hardware item that is handled by the semiconductor workpiece handling hardware item and the three-dimensional real time simulation is generated by a controller in real time with generation of the three-dimensional real-time simulation, the three-dimensional simulation being generated substantially coincident with and based on a real-world operation of the semiconductor workpiece handling system that generates concurrent operation data, and the three-dimensional real time simulation being based on and concurrent with the concurrent operational data, from semiconductor workpiece processing, received from the physical semiconductor workpiece handling system, so that the concurrent operational data, that is the basis of the three-dimensional real-time simulation, and generation of a display of the three-dimensional simulation are generated substantially coincident with each other in real time, the concurrent operational data including data identifying the status of the at least one hardware item concurrent with the real time simulation, where the three-dimensional real time simulation is displayed in real time substantially coincident with the generation of the three-dimensional real time simulation;

storing, in a computer memory, information that includes at least a status of the at least one hardware item and technical information for the at least one hardware item; and

providing, within different areas of the display where each different respective one of the at least one hardware item resides, a link to the stored information corresponding to and representative of a respective one of the at least one hardware item, so that each different link corresponds to and is representative of a different respective one of the at least one hardware item, wherein at least one link to the information includes at least the status of the at least one hardware item and the technical information informing a real time state of both the semiconductor workpiece handling hardware item and the semiconductor workpiece hardware item of the at least one hardware item obtained from at least a semiconductor wafer-centric data base, where the real time state of the semiconductor workpiece hardware item relates to a change in location of the semiconductor workpiece hardware item.

16. The method of claim 15 , wherein the status information includes sensor data received from the hardware item.

17. The method of claim 15 , wherein the status information includes diagnostic information for the hardware item.

18. The method of claim 17 , wherein the diagnostic information includes one or more of a performance evaluation, an expected time to failure, a maintenance alert, and an operating condition alert.

Assignments (9)
RELEASE OF SECURITY INTEREST RECORDED AT REEL/FRAME 044142/0258 Recorded Nov 4, 2025
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: AZENTA, INC. (F/K/A BROOKS AUTOMATION, INC.); AZENTA US, INC. (F/K/A BROOKS LIFE SCIENCES, INC., F/K/A BIOSTORAGE TECHNOLOGIES, INC.)
Reel/Frame 073514/0609 →
RELEASE OF SECURITY INTEREST RECORDED AT REEL/FRAME 038891/0765 Recorded Nov 4, 2025
From: WELLS FARGO BANK, NATIONAL ASSOCIATION
To: AZENTA, INC. (F/K/A BROOKS AUTOMATION, INC.); AZENTA USA, INC. (F/K/A BIOSTORAGE TECHNOLOGIES, INC.)
Reel/Frame 073446/0080 →
SECOND LIEN PATENT SECURITY AGREEMENT Recorded Feb 2, 2022
From: BROOKS AUTOMATION US, LLC
To: GOLDMAN SACHS BANK USA
Reel/Frame 058945/0748 →
FIRST LIEN PATENT SECURITY AGREEMENT Recorded Feb 2, 2022
From: BROOKS AUTOMATION US, LLC
To: BARCLAYS BANK PLC
Reel/Frame 058950/0146 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 9, 2021
From: BROOKS AUTOMATION,INC
To: BROOKS AUTOMATION HOLDING, LLC
Reel/Frame 058481/0740 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 9, 2021
From: BROOKS AUTOMATION HOLDING, LLC
To: BROOKS AUTOMATION US, LLC
Reel/Frame 058482/0001 →
SECURITY INTEREST Recorded Oct 6, 2017
From: BROOKS AUTOMATION, INC.; BIOSTORAGE TECHNOLOGIES, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 044142/0258 →
SECURITY AGREEMENT Recorded May 31, 2016
From: BROOKS AUTOMATION, INC.; BIOSTORAGE TECHNOLOGIES
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 038891/0765 →
BILL OF SALE Recorded Oct 16, 2012
From: BLUESHIFT TECHNOLOGIES, INC.
To: BROOKS AUTOMATION, INC.
Reel/Frame 029134/0283 →
Continuity (9)
Continuation In Part 11743105 · May 1, 2007
Continuation In Part 11302563 · Dec 13, 2005
Continuation In Part 11123966 · May 6, 2005
Continuation In Part 10985834 · Nov 10, 2004
Provisional Application 60746163 · May 1, 2006
Provisional Application 60807189 · Jul 12, 2006
Provisional Application 60518823 · Nov 10, 2003
Provisional Application 60607649 · Sep 7, 2004
Related Publication 20080155443A1 · Jun 26, 2008
Cited By (1)
US 12,251,830