IP Library Granted Patent US 8,639,365
Granted Patent B2
US 8,639,365 · App. 11/877,071 · Granted Jan 28, 2014

Methods and systems for controlling a semiconductor fabrication process

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Quick Facts
Patent No.
US 8,639,365
App. No.
11/877,071
Granted
Jan 28, 2014
Kind
B2
Abstract

Software for controlling processes in a heterogeneous semiconductor manufacturing environment may include a wafer-centric database, a real-time scheduler using a neural network, and a graphical user interface displaying simulated operation of the system. These features may be employed alone or in combination to offer improved usability and computational efficiency for real time control and monitoring of a semiconductor manufacturing process. More generally, these techniques may be usefully employed in a variety of real time control systems, particularly systems requiring complex scheduling decisions or heterogeneous systems constructed of hardware from numerous independent vendors.

Claims (27)

1. A system comprising:

a neural network enabled controller for controlling the operation of a semiconductor manufacturing system to schedule processing of one or more workpieces, wherein the neural network receives as inputs data from the semiconductor manufacturing system, where the data from the semiconductor manufacturing system embodies a position identification of an isolation valve within the system through which workpieces pass and that selectively isolates an environment of process tool from a shared vacuum environment of the system that transfers the workpieces to the process tool; and

a workpiece data structure, the data structure including an identity of the workpiece and one or more fields for storing information relating to the workpiece.

2. The system of claim 1 , wherein the data from the semiconductor manufacturing system represents a state of an item of hardware within the semiconductor manufacturing system.

3. The system of claim 1 , wherein the data from the semiconductor manufacturing system represents a position of a workpiece within the semiconductor manufacturing system.

4. The system of claim 1 , wherein the neural network is updated in substantially real time.

5. The system of claim 1 , wherein the neural network is updated every 20 milliseconds.

6. The system of claim 1 , wherein the inputs to the neural network include one or more of sensor data, temperature data, a detected workpiece position, an estimated workpiece temperature, an actual workpiece temperature, a valve state, an isolation valve state, robotic drive encoder data, robotic arm position data, end effector height data, a process time, a process status, a pick time, a place time, and a control signal.

7. The system of claim 1 , wherein the inputs to the neural network include at least one process time for a workpiece within the semiconductor manufacturing system.

8. The system of claim 7 , wherein the at least one process time includes one or more of a target duration, a start time, an end time, and an estimated end time.

9. The system of claim 1 , wherein the inputs include a transition time.

10. The system of claim 9 , wherein the transition time includes one or more of a pump down to vacuum time and a vent to atmosphere time.

11. The system of claim 1 , wherein the neural network receives as inputs data from the workpiece data structure.

12. A method comprising:

controlling operation of a semiconductor manufacturing system with a neural network to schedule coordinated processing of one or more workpieces;

creating a data structure for one of the one or more workpieces, the data structure including an identity of the one workpiece and one or more fields for storing information relating to the one workpiece; and

receiving data from the semiconductor manufacturing system as an input to the neural network, where the data from the semiconductor manufacturing system embodies a position identification of an isolation valve within the system through which workpieces pass and that selectively isolates an environment of process tool from a shared vacuum environment of the system that transfers the workpieces to the process tool.

13. The method of claim 12 , wherein the data from the semiconductor manufacturing system represents a state of an item of hardware within the semiconductor manufacturing system.

14. The method of claim 12 , wherein the data from the semiconductor manufacturing system represents a position of a workpiece within the semiconductor manufacturing system.

15. The method of claim 12 , wherein data from the semiconductor manufacturing system includes data from the workpiece data structure.

16. The method of claim 12 , wherein the neural network receives as inputs data from the workpiece data structure.

17. A system comprising:

a neural network enabled controller for controlling the operation of a semiconductor manufacturing system to schedule processing of one or more workpieces, wherein the neural network receives as inputs data from the semiconductor manufacturing system, where the inputs include a transition time and the transition time includes one or more of a pump down to vacuum time and a vent to atmosphere time; and

a workpiece data structure, the data structure including an identity of the workpiece and one or more fields for storing information relating to the workpiece.

18. The system of claim 17 , wherein the data from the semiconductor manufacturing system represents a state of an item of hardware within the semiconductor manufacturing system.

19. The system of claim 17 , wherein the data from the semiconductor manufacturing system represents a position of a workpiece within the semiconductor manufacturing system.

20. The system of claim 17 , wherein the inputs to the neural network include one or more of sensor data, temperature data, a detected workpiece position, an estimated workpiece temperature, an actual workpiece temperature, a valve state, an isolation valve state, robotic drive encoder data, robotic arm position data, end effector height data, a process time, a process status, a pick time, a place time, and a control signal.

Assignments (10)
RELEASE OF SECURITY INTEREST RECORDED AT REEL/FRAME 038891/0765 Recorded Nov 4, 2025
From: WELLS FARGO BANK, NATIONAL ASSOCIATION
To: AZENTA, INC. (F/K/A BROOKS AUTOMATION, INC.); AZENTA USA, INC. (F/K/A BIOSTORAGE TECHNOLOGIES, INC.)
Reel/Frame 073446/0080 →
RELEASE OF SECURITY INTEREST RECORDED AT REEL/FRAME 044142/0258 Recorded Nov 4, 2025
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: AZENTA, INC. (F/K/A BROOKS AUTOMATION, INC.); AZENTA US, INC. (F/K/A BROOKS LIFE SCIENCES, INC., F/K/A BIOSTORAGE TECHNOLOGIES, INC.)
Reel/Frame 073514/0609 →
FIRST LIEN PATENT SECURITY AGREEMENT Recorded Feb 2, 2022
From: BROOKS AUTOMATION US, LLC
To: BARCLAYS BANK PLC
Reel/Frame 058950/0146 →
SECOND LIEN PATENT SECURITY AGREEMENT Recorded Feb 2, 2022
From: BROOKS AUTOMATION US, LLC
To: GOLDMAN SACHS BANK USA
Reel/Frame 058945/0748 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 9, 2021
From: BROOKS AUTOMATION,INC
To: BROOKS AUTOMATION HOLDING, LLC
Reel/Frame 058481/0740 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 9, 2021
From: BROOKS AUTOMATION HOLDING, LLC
To: BROOKS AUTOMATION US, LLC
Reel/Frame 058482/0001 →
SECURITY INTEREST Recorded Oct 6, 2017
From: BROOKS AUTOMATION, INC.; BIOSTORAGE TECHNOLOGIES, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 044142/0258 →
SECURITY AGREEMENT Recorded May 31, 2016
From: BROOKS AUTOMATION, INC.; BIOSTORAGE TECHNOLOGIES
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 038891/0765 →
BILL OF SALE Recorded Oct 16, 2012
From: BLUESHIFT TECHNOLOGIES, INC.
To: BROOKS AUTOMATION, INC.
Reel/Frame 029134/0283 →
BILL OF SALE Recorded Mar 21, 2012
From: BLUESHIFT TECHNOLOGIES, INC.
To: BROOKS AUTOMATION, INC.
Reel/Frame 027898/0416 →