IP Library Granted Patent US 8,612,198
Granted Patent B2
US 8,612,198 · App. 11/877,191 · Granted Dec 17, 2013

Methods and systems for controlling a semiconductor fabrication process

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Quick Facts
Patent No.
US 8,612,198
App. No.
11/877,191
Granted
Dec 17, 2013
Kind
B2
Abstract

Software for controlling processes in a heterogeneous semiconductor manufacturing environment may include a wafer-centric database, a real-time scheduler using a neural network, and a graphical user interface displaying simulated operation of the system. These features may be employed alone or in combination to offer improved usability and computational efficiency for real time control and monitoring of a semiconductor manufacturing process. More generally, these techniques may be usefully employed in a variety of real time control systems, particularly systems requiring complex scheduling decisions or heterogeneous systems constructed of hardware from numerous independent vendors.

Claims (32)

1. A method comprising:

providing a semiconductor handling system including at least one robot and a plurality of process chambers;

controlling the operation of the handling system with a software controller configured for employing a neural network and a finite state machine scheduler that provides controls signals to both of at least one of the at least one robot and the plurality of process chambers at least in part for effecting processing of at least one workpiece; and

serially coupling the at least one robot, the plurality of process chambers, and the controller to each other in a daisy chain communicating relationship with an electronic interface including a shared medium.

2. The method of claim 1 , wherein the at least one robot, the plurality of process chambers, and the controller share at least one wire in a configuration that forms the daisy chain.

3. The method of claim 1 , wherein the shared medium includes a wireless network.

4. The method of claim 1 , wherein the operation of the handling system includes controlling one or more slot valves.

5. The method of claim 1 , wherein the operation of the handling system includes moving the one or more workpieces among the process chambers with the at least one robot.

6. The method of claim 1 , wherein the operation of the handling system includes receiving sensor data from at least one of the plurality of process chambers.

7. A system comprising:

a semiconductor handling system including at least one robot and a plurality of process chambers;

a software controller that controls operation of the handling system, the controller being configured for employing a neural network and a finite state machine scheduler that provides controls signals to both of at least one of the at least one robot and the plurality of process chambers at least in part for effecting processing of at least one workpiece; and

an electronic interface including a shared medium that serially couples the at least one robot, the plurality of process chambers, and the controller to each other in a daisy chain communicating relationship.

8. The method of claim 7 , wherein the at least one robot, the plurality of process chambers, and the controller share at least one wire in a configuration that forms the daisy chain.

9. The system of claim 7 , wherein the shared medium includes a wireless network.

10. The system of claim 7 , wherein the operation of the handling system includes controlling one or more slot valves.

11. The system of claim 7 , wherein the operation of the handling system includes moving the one or more workpieces among the process chambers with the at least one robot.

12. The system of claim 7 , wherein the operation of the handling system includes receiving sensor data from at least one of the plurality of process chambers.

13. A semiconductor handling system comprising:

at least one robot;

a plurality of process chambers configured to form a vacuum wafer handling environment with the at least one robot;

a software controller configured for employing a neural network and a finite state machine scheduler that provides controls signals to both of at least one of the at least one robot and the plurality of process chambers at least in part for effecting processing of at least one wafer by the at least one robot, the software controller comprising:

the neural network; and

a finite state machine; and

an electronic interface including a shared medium for serially coupling the at least one robot, the plurality of process chambers, and the controller to each other in a daisy chain communicating relationship.

14. The method of claim 13 , wherein the at least one robot, the plurality of process chambers, and the controller share at least one wire in a configuration that forms the daisy chain.

15. The system of claim 13 , wherein the shared medium includes a wireless network.

16. The system of claim 13 , wherein the operation of the handling system includes controlling one or more vacuum isolation slot valves.

17. The system of claim 13 , wherein handling includes moving the one or more workpieces among the process chambers with the at least one robot.

18. The system of claim 13 , wherein scheduling is based at least on sensor data received from at least one of the plurality of process chambers.

19. The method of claim 18 , wherein the sensor data represents a position of a workpiece within the semiconductor handling system.

20. The method of claim 18 , wherein the sensor data represents a position of an isolation slot valve within the system.

Assignments (9)
RELEASE OF SECURITY INTEREST RECORDED AT REEL/FRAME 044142/0258 Recorded Nov 4, 2025
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: AZENTA, INC. (F/K/A BROOKS AUTOMATION, INC.); AZENTA US, INC. (F/K/A BROOKS LIFE SCIENCES, INC., F/K/A BIOSTORAGE TECHNOLOGIES, INC.)
Reel/Frame 073514/0609 →
RELEASE OF SECURITY INTEREST RECORDED AT REEL/FRAME 038891/0765 Recorded Nov 4, 2025
From: WELLS FARGO BANK, NATIONAL ASSOCIATION
To: AZENTA, INC. (F/K/A BROOKS AUTOMATION, INC.); AZENTA USA, INC. (F/K/A BIOSTORAGE TECHNOLOGIES, INC.)
Reel/Frame 073446/0080 →
SECOND LIEN PATENT SECURITY AGREEMENT Recorded Feb 2, 2022
From: BROOKS AUTOMATION US, LLC
To: GOLDMAN SACHS BANK USA
Reel/Frame 058945/0748 →
FIRST LIEN PATENT SECURITY AGREEMENT Recorded Feb 2, 2022
From: BROOKS AUTOMATION US, LLC
To: BARCLAYS BANK PLC
Reel/Frame 058950/0146 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 9, 2021
From: BROOKS AUTOMATION,INC
To: BROOKS AUTOMATION HOLDING, LLC
Reel/Frame 058481/0740 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 9, 2021
From: BROOKS AUTOMATION HOLDING, LLC
To: BROOKS AUTOMATION US, LLC
Reel/Frame 058482/0001 →
SECURITY INTEREST Recorded Oct 6, 2017
From: BROOKS AUTOMATION, INC.; BIOSTORAGE TECHNOLOGIES, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 044142/0258 →
SECURITY AGREEMENT Recorded May 31, 2016
From: BROOKS AUTOMATION, INC.; BIOSTORAGE TECHNOLOGIES
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 038891/0765 →
BILL OF SALE Recorded Oct 16, 2012
From: BLUESHIFT TECHNOLOGIES, INC.
To: BROOKS AUTOMATION, INC.
Reel/Frame 029134/0283 →