System for peeling semiconductor chips from tape
View Patent ↗A semiconductor system for peeling semiconductor chips from tape, comprising: providing an outer housing having an aperture on a top thereof; providing a magnet with a needle base extension; providing needles magnetically held to the magnet; applying a vacuum through the aperture to hold an adhesive material to the outer housing; and extending the needles through the aperture in the outer housing.
1. A method for operating a semiconductor system for peeling semiconductor chips from tape, comprising:
providing an outer housing having outer features and an aperture on a top thereof;
forming a base housing having base features below the outer housing, the base features protrude horizontally outward from the base housing into the outer features preventing rotational movement between the base housing and the outer housing;
providing a magnet over the base housing;
providing needles magnetically held to the magnet;
applying a vacuum through the aperture to hold an adhesive material to the outer housing; and
extending the needles through the aperture in the outer housing.
2. The method as claimed in claim 1 further comprising assembling a needle block over the magnet for positioning the needles.
3. The method as claimed in claim 1 wherein applying the vacuum includes opening a valve.
4. The method as claimed in claim 1 wherein providing the outer housing includes forming the outer features having a shape of the base features.
5. The method as claimed in claim 1 wherein providing the needles includes forming a magnetic needle base having the magnet with the needles thereover.
6. A method for operating a semiconductor system comprising:
providing an outer housing having outer features and an aperture through a top thereof;
forming a base housing having base features below the outer housing, the base features protrude horizontally outward from the base housing into the outer features preventing rotational movement between the base housing and the outer housing;
providing a magnet over the base housing and in the outer housing;
providing needles magnetically held to the magnet;
applying a vacuum through the aperture to hold an adhesive material and a chip to the outer housing; and
extending the needles through the aperture in the outer housing for lifting the chip and portions of the adhesive material from the outer housing while peeling other portions of the adhesive material from the chip.
7. The method as claimed in claim 6 further comprising:
assembling a needle block over the magnet; and
inserting the needles through the needle block for positioning the needles.
8. The method as claimed in claim 6 further comprising:
providing a magnetic needle base;
forming a needle base extension of the magnetic needle base; and
forming a base opening of the base housing wherein the needle base extension is at least partially in the base opening for actuating the magnetic needle base.
9. The method as claimed in claim 6 wherein providing the outer housing includes forming the outer features with a shape and a size larger than the base features.
10. The method as claimed in claim 6 wherein providing the needles includes assembling the magnet provides a substantially planar horizontal position for the needles.
11. A semiconductor system for peeling semiconductor chips from tape, comprising:
an outer housing having outer features and an aperture on a top thereof;
a base housing having base features below the outer housing, the base features protrude horizontally outward from the base housing into the outer features preventing rotational movement between the base housing and the outer housing;
a magnet over the base housing;
needles magnetically held to the magnet;
a vacuum source for applying a vacuum through the aperture to hold an adhesive material to the outer housing; and
a needle base extension connected to the magnet for extending the needles through the aperture in the outer housing.
12. The system as claimed in claim 11 further comprising a needle block over the magnet for positioning the needle.
13. The system as claimed in claim 11 wherein the vacuum source includes a valve.
14. The system as claimed in claim 11 wherein the outer housing includes the outer features having a shape of the base features.
15. The system as claimed in claim 11 further comprising a magnetic needle base having the magnet with the needles thereover.
16. The system as claimed in claim 11 wherein:
the outer housing has the aperture through the top thereof;
the magnet is in the outer housing;
the needles magnetically held to the magnet;
the vacuum source applies the vacuum through the aperture to hold the adhesive material and a chip to the outer housing; and
the needle base extension is connected to the magnet for extending the needles through the aperture in the outer housing for lifting the chip and portions of the adhesive material from the outer housing while peeling other portions of the adhesive material from the chip.
17. The system as claimed in claim 16 further comprising a needle block over the magnet wherein the needles are through the needle block for positioning the needles.
18. The system as claimed in claim 16 further comprising a needle base extension includes a base opening of the base housing wherein the needle base extension is at least partially in the base opening for actuating the magnetic needle base.
19. The system as claimed in claim 16 wherein the outer housing includes the outer features with a shape and a size larger than the base features.
20. The system as claimed in claim 16 wherein the magnet provides a substantially planar horizontal position for the needles.