Integrated circuit package system with step mold recess
View Patent ↗An integrated circuit package system includes: providing a stackable integrated circuit package system having a base encapsulation and a recess therein; stacking a top integrated circuit package system, having a top encapsulation with a protruding portion, with the stackable integrated circuit package system with the protruding portion aligned and matched within the recess; and connecting the top integrated circuit package system and the stackable integrated circuit package system.
1. A method of manufacturing an integrated circuit package system comprising:
providing a stackable integrated circuit package system having a first integrated circuit and a base encapsulation with a recess therein over the first integrated circuit;
providing a top integrated circuit package system, having a top encapsulation with a protruding portion filling a hole of a top carrier;
stacking the top integrated circuit package system with the stackable integrated circuit package system and the protruding portion aligned and matched within the recess; and
connecting a stacking connector between the stackable integrated circuit package system and the top integrated circuit package system with the protruding portion extending below the stacking connector.
2. The method as claimed in claim 1 wherein stacking the top integrated circuit package system with the stackable integrated circuit package system includes applying a stacking adhesive between the base encapsulation and the top encapsulation.
3. The method as claimed in claim 1 wherein stacking the top integrated circuit package system includes stacking a top carrier with a second integrated circuit thereover.
4. The method as claimed in claim 1 wherein stacking the top integrated circuit package system includes stacking a top carrier with an integrated circuit thereunder and within the protruding portion.
5. The method as claimed in claim 1 wherein connecting the stacking connector includes:
connecting an electrical connector between an exposed portion of a top carrier of the top integrated circuit package system and a base carrier of the stackable integrated circuit package system; and
further comprising:
forming a package encapsulation covering the electrical connector along a nonhorizontal peripheral side of the stackable integrated circuit package system.
6. A method of manufacturing an integrated circuit package system comprising:
providing a stackable integrated circuit package system having a first integrated circuit and a base encapsulation with recess therein over the first integrated circuit;
providing a top integrated circuit package system, having a second integrated circuit covered by a top encapsulation with a protruding portion filling a hole of a top carrier;
stacking the top integrated circuit package system with the stackable integrated circuit package system and the protruding portion aligned and matched within the recess; and
connecting a stacking connector between the stackable integrated circuit package system and the top integrated circuit package system with the protruding portion extending below the stacking connector.
7. The system as claimed in claim 6 wherein:
providing the stackable integrated circuit package system having the first integrated circuit includes exposing the first integrated circuit with the recess; and
stacking the top integrated circuit package system and the stackable integrated circuit package system includes attaching an adhesive between the first integrated circuit and the protruding portion of the top encapsulation.
8. The system as claimed in claim 6 wherein:
providing the stackable integrated circuit package system having the first integrated circuit includes providing a stackable interconnect adjacent to the first integrated circuit.
9. The method as claimed in claim 6 wherein stacking the top integrated circuit package system and the stackable integrated circuit package system includes extending the top integrated circuit package system horizontally beyond the stackable integrated circuit package system.
10. The method as claimed in claim 6 wherein connecting the stacking connector includes:
connecting an electrical connector between an exposed portion of a top carrier of the top integrated circuit package system and a base carrier of the stackable integrated circuit package system; and
further comprising:
forming a package encapsulation covering the electrical connector along a nonhorizontal peripheral side of the stackable integrated circuit package system and between the top integrated circuit package system and the stackable integrated circuit package system.
11. An integrated circuit package system comprising:
a stackable integrated circuit package system having a first integrated circuit and a base encapsulation with a recess therein over the first integrated circuit
a top integrated circuit package system, having a top encapsulation with a protruding portion filling a hole of a top carrier, stacked and connected with the stackable integrated circuit package system and the protruding portion aligned and matched within the recess; and
a stacking connector between the stackable integrated circuit package and the top integrated circuit package with the protruding portion extending below the stacking connector.
12. The system as claimed in claim 11 wherein the top integrated circuit package system stacked with the stackable integrated circuit package system includes a stacking adhesive between the base encapsulation and the top encapsulation.
13. The system as claimed in claim 11 wherein the top integrated circuit package system includes a top carrier with a second integrated circuit thereover.
14. The system as claimed in claim 11 wherein the top integrated circuit package system includes a top carrier with an integrated circuit thereunder and within the protruding portion.
15. The system as claimed in claim 11 wherein the top integrated circuit package system connected with the stackable integrated circuit package system includes:
an electrical connector between an exposed portion of a top carrier of the top integrated circuit package system and the base carrier of the stackable integrated circuit package system; and
further comprising:
a package encapsulation covering the electrical connector along a nonhorizontal peripheral side of the stackable integrated circuit package system.
16. The system as claimed in claim 11 wherein:
the stackable integrated circuit package system includes a first integrated circuit and the base encapsulation with the recess therein over the first integrated circuit; and
the top integrated circuit package system includes a second integrated circuit covered by the top encapsulation with the protruding portion.
17. The system as claimed in claim 16 wherein:
providing the stackable integrated circuit package system having the first integrated circuit includes exposing the first integrated circuit with the recess; and
stacking the top integrated circuit package system and the stackable integrated circuit package system includes attaching an adhesive between the first integrated circuit and the protruding portion of the top encapsulation.
18. The system as claimed in claim 16 wherein:
the stackable integrated circuit package system includes providing a stackable interconnect adjacent to the first integrated circuit; and
the top integrated circuit package system includes the stacking connector with the stacking connector aligned with the stackable interconnect.
19. The system as claimed in claim 16 wherein the top integrated circuit package system stacked with the stackable integrated circuit package system includes extending the top integrated circuit package system horizontally beyond the stackable integrated circuit package system.
20. The system as claimed in claim 16 further comprising:
an electrical connector between an exposed portion of a top carrier of the top integrated circuit package system and a base carrier of the stackable integrated circuit package system; and
a package encapsulation covering the electrical connector along a nonhorizontal peripheral side of the stackable integrated circuit package system and between the top integrated circuit package system and the stackable integrated circuit package system.