IP Library Granted Patent US 7,956,491
Granted Patent B2
US 7,956,491 · App. 12/404,971 · Granted Jun 7, 2011

Integrated multi-transformer

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Quick Facts
Patent No.
US 7,956,491
App. No.
12/404,971
Granted
Jun 7, 2011
Kind
B2
Abstract

Methods, systems, and devices are described for integrating multiple transformers on a shared core, while avoiding interference between the transformers and other potentially undesirable effects of the integration. In one embodiment, multiple transformers are wound on a shared core. Each transformer is wound on the core, so that its primary and secondary windings are magnetically coupled to each other through the core without being coupled to the windings of other transformers sharing the core. The multiple integrated transformers may then be provided in a circuit arrangement by placing only a single core element in the arrangement.

Claims (66)

1. An integrated multi-transformer, comprising:

a core made of magnetic material;

a plurality of transformers magnetically coupled with the core, including:

a pulse transformer comprising a first primary winding and a first secondary winding, the first primary winding being configured to receive a first primary current and to couple the first primary current to the core to generate a first core flux, and the first secondary winding being configured so that at least a portion of the first core flux is coupled from the core to induce a first secondary current in the first secondary winding; and

a power transformer comprising a second primary winding and a second secondary winding, the second primary winding being configured to receive a second primary current and to couple the second primary current to the core to generate a second core flux, and the second secondary winding being configured so that at least a portion of the second core flux is coupled from the core to induce a second secondary current in the second secondary winding,

wherein the first core flux induces substantially no current in the power transformer and the second core flux induces substantially no current in the pulse transformer.

2. The integrated multi-transformer of claim 1 , wherein:

the core is an “E” core, comprising a first leg, a second leg, and a third leg, wherein the first leg and the third leg have substantially equivalent cross-sectional areas;

the first primary winding is wound on the first leg and the third leg;

the first secondary winding is wound on the first leg and the third leg; and

the second primary winding and the second secondary winding are wound on the second leg.

3. The integrated multi-transformer of claim 2 , wherein,

the second leg has substantially double the cross-sectional area of the first leg.

4. The integrated multi-transformer of claim 1 ,

wherein the core comprises a number of legs, the number of legs being one greater than the number of transformers coupled with the core.

5. The integrated multi-transformer of claim 1 ,

wherein the power transformer is wound substantially orthogonally with respect to the pulse transformer.

6. The integrated multi-transformer of claim 5 , wherein the plurality of transformers further includes:

an additional transformer wound on the core substantially orthogonally with respect to the pulse transformer.

7. The integrated multi-transformer of claim 1 , wherein the plurality of transformers further includes:

an additional transformer wound on the core substantially orthogonally with respect to at least one of the pulse transformer or the power transformer.

8. The integrated multi-transformer of claim 7 , wherein:

the additional transformer is selected from the group consisting of: a power transformer, a pulse transformer, a signal transformer, and a current sense transformer.

9. The integrated multi-transformer of claim 1 , wherein:

the pulse transformer is wound substantially orthogonally with respect to the power transformer; and

the plurality of transformers further includes an additional transformer wound on the core substantially orthogonally with respect to both the pulse transformer or the power transformer.

10. The integrated multi-transformer of claim 1 ,

wherein at least a portion of the core is circular and the pulse transformer is formed toroidally around the core.

11. The integrated multi-transformer of claim 1 , further comprising:

packaging configured to be placed in a circuit arrangement and to house at least a portion of the core and the plurality of transformers magnetically coupled with the core.

12. The integrated multi-transformer of claim 11 ,

wherein the packaging is further configured to provide at least partial physical, electrical, or electromagnetic isolation.

13. The integrated multi-transformer of claim 11 ,

wherein the packaging comprises a plurality of interface regions, including:

a first interface region coupled with the first primary winding;

a second interface region coupled with the first secondary winding;

a third interface region coupled with the second primary winding; and

a fourth interface region coupled with the second secondary winding.

14. The integrated multi-transformer of claim 11 ,

wherein the packaging comprises a core interface region coupled with the core.

15. A system for handling multiple signals using an integrated multi-transformer, the system comprising:

a first signal generation module configured to generate a first generated signal;

a second signal generation module configured to generate a second generated signal;

a first signal utilization module configured to utilize a first transformed signal;

a second signal utilization module configured to utilize a second transformed signal; and

a multi-transformer, comprising core, a pulse transformer, and a power transformer, the pulse transformer being wound on the core and configured to generate a first magnetic flux in the core, and the power transformer being wound on the core and configured to generate a second magnetic flux in the core, the second magnetic flux being decoupled from the first magnetic flux,

wherein the pulse transformer is configured to receive the first generated signal from the first signal generation module, generate the first transformed signal as a function of the first generated signal, and communicate the first transformed signal with the first signal utilization module, and

wherein the power transformer is configured to receive the second generated signal from the second signal generation module, generate the second transformed signal as a function of the second generated signal, and communicate the second transformed signal with the second signal utilization module.

16. The system of claim 15 , wherein:

the first signal generation module comprises a sensor arrangement configured to receive a sensory input and to generate the first generated signal as a function of the sensory input.

17. The system of claim 16 ,

wherein the first signal utilization module comprises a decoder arrangement configured to receive the first transformed signal and to derive information relating to the sensory input as a function of the first transformed signal, and

wherein the first transformer is further configured to electrically isolate the decoder arrangement from the sensor arrangement.

18. A method for producing an integrated multi-transformer device, the method comprising:

winding a pulse transformer on a core made of a magnetic material, the pulse transformer comprising a first primary winding and a first secondary winding, the first primary winding being configured to receive a first primary current and to couple the first primary current to the core to generate a first core flux, and the first secondary winding being configured so that at least a portion of the first core flux is coupled from the core to induce a first secondary current in the first secondary winding; and

winding a power transformer on the core, the power transformer comprising a second primary winding and a second secondary winding, the second primary winding being configured to receive a second primary current and to couple the second primary current to the core to generate a second core flux, and the second secondary winding being configured so that at least a portion of the second core flux is coupled from the core to induce a second secondary current in the second secondary winding,

wherein the power transformer is wound on the core so that the first core flux induces substantially no current in the second secondary winding and the second core flux induces substantially no current in the first secondary winding.

19. The method of claim 18 ,

wherein winding the pulse transformer on the core comprises winding the first primary winding and the first secondary winding in a first plane, and

wherein winding the power transformer on the core comprises winding the second primary winding and the second secondary winding in a second plane, the second plane being substantially orthogonal to the first plane.

20. The method of claim 18 , further comprising:

packaging at least a portion of the core, the pulse transformer, and the power transformer into an integrated circuit component; and

placing the integrated circuit component into a circuit arrangement.

21. The method of claim 18 , further comprising:

providing the first primary current to the first primary winding of the first transformer;

providing the second primary current to the second primary winding of the second transformer, wherein a portion of the second primary current is provided substantially contemporaneously with a portion of the first primary current.

Assignments (19)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
RELEASE OF SECURITY INTEREST Recorded May 29, 2018
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.), INC.; MICROSEMI FREQUENCY AND TIME CORPORATION; MICROSEMI COMMUNICATIONS, INC.; MICROSEMI SOC CORP.; MICROSEMI CORP. - POWER PRODUCTS GROUP; MICROSEMI CORP. - RF INTEGRATED SOLUTIONS
Reel/Frame 046251/0391 →
PATENT SECURITY AGREEMENT Recorded Feb 3, 2016
From: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC. (F/K/A LEGERITY, INC., ZARLINK SEMICONDUCTOR (V.N.) INC., CENTELLAX, INC., AND ZARLINK SEMICONDUCTOR (U.S.) INC.); MICROSEMI FREQUENCY AND TIME CORPORATION (F/K/A SYMMETRICON, INC.); MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION); MICROSEMI SOC CORP. (F/K/A ACTEL CORPORATION); MICROSEMI CORP. - POWER PRODUCTS GROUP (F/K/A ADVANCED POWER TECHNOLOGY INC.); MICROSEMI CORP. - RF INTEGRATED SOLUTIONS (F/K/A AML COMMUNICATIONS, INC.)
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037691/0697 →
RELEASE OF SECURITY INTEREST Recorded Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION; MICROSEMI FREQUENCY AND TIME CORPORATION, A DELAWARE CORPORATION; MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION), A DELAWARE CORPORATION; MICROSEMI CORP.-MEMORY AND STORAGE SOLUTIONS (F/K/A WHITE ELECTRONIC DESIGNS CORPORATION), AN INDIANA CORPORATION
Reel/Frame 037558/0711 →
NOTICE OF SUCCESSION OF AGENCY Recorded Apr 9, 2015
From: ROYAL BANK OF CANADA (AS SUCCESSOR TO MORGAN STANLEY & CO. LLC)
To: BANK OF AMERICA, N.A., AS SUCCESSOR AGENT
Reel/Frame 035657/0223 →
SUPPLEMENTAL PATENT SECURITY AGREEMENT Recorded Nov 11, 2011
From: MICROSEMI CORPORATION; MICROSEMI CORP. - ANALOG MIXED SIGNAL GROUP; MICROSEMI CORP. - MASSACHUSETTS; ACTEL CORPORATION
To: MORGAN STANLEY & CO. LLC
Reel/Frame 027213/0611 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 20, 2011
From: ASIC ADVANTAGE INC.
To: MICROSEMI CORPORATION
Reel/Frame 027096/0222 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 23, 2009
From: OCHI, SAM SEIICHIRO; WITTENBREDER, ERNEST HENRY, JR.
To: ASIC ADVANTAGE INC.
Reel/Frame 022432/0444 →