Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud bumps
View Patent ↗A semiconductor device is made by providing a semiconductor die having bond pads formed on a surface of the semiconductor die, forming a UBM over the bond pads of the semiconductor die, forming a fusible layer over the UBM, providing a substrate having bond pads formed on a surface of the substrate, and forming a plurality of stud bumps containing non-fusible material over the bond pads on the substrate. Each stud bump includes a wire having a first end attached to the bond pad of the substrate and second end of uniform height. The method further includes electrically connecting the second end of the wire for each stud bump to the bond pads of the semiconductor die by reflowing the fusible layer or applying thermal compression bonding, depositing an underfill material between the semiconductor die and substrate, and depositing an encapsulant over the semiconductor die and substrate.
1. A method of making a semiconductor device, comprising:
providing a semiconductor die having a plurality of bond pads formed on a surface of the semiconductor die;
forming an under bump metallization (UBM) over the bond pads of the semiconductor die;
forming a fusible layer over the UBM;
providing a substrate having a plurality of traces formed on a surface of the substrate; forming a plurality of stud bumps containing non-fusible material over the traces on the substrate, each stud bump including a wire having a base contacting first and second side surfaces of the traces and a tip of uniform height opposite the base; and
electrically connecting the tip of the wire to the bond pad of the semiconductor die by reflowing the fusible layer or applying thermal compression bonding such that the fusible layer contacts the tip while leaving exposed an intermediate portion of the wire between the tip and base.
2. The method of claim 1 , wherein the fusible layer includes tin or tin alloy.
3. The method of claim 1 , wherein forming the UBM includes:
forming an adhesion layer over the bond pads on the semiconductor die;
forming a barrier layer over the adhesion layer; and
forming a wettable layer over the barrier layer.
4. The method of claim 1 , further including:
depositing an underfill material between the semiconductor die and substrate; and
depositing an encapsulant over the semiconductor die and substrate.
5. A method of making a semiconductor device, comprising:
providing a semiconductor die having a plurality of bond pads formed on a surface of the semiconductor die;
forming a fusible layer over the surface of the semiconductor die; providing a substrate having a plurality of traces formed on a surface of the substrate; forming a plurality of electrical interconnects containing non-fusible material contacting first and second side surfaces of the traces on the substrate, the electrical interconnects each including a wire having a base and a tip of uniform height opposite the base; and
electrically connecting the tip of the wire to the bond pad of the semiconductor die such that the fusible layer contacts the tip while leaving exposed an intermediate portion of the wire between the tip and base.
6. The method of claim 5 , further including cutting and flattening the tip of the wire by mechanical pressure to the uniform height.
7. The method of claim 5 , further including electrically connecting the tip of the wire to the bond pad of the semiconductor die by reflowing the fusible layer or applying thermal compression bonding.
8. The method of claim 5 , wherein the fusible layer includes tin or tin alloy.
9. The method of claim 5 , further including forming an under bump metallization (UBM) between the fusible layer and bond pads of the semiconductor die.
10. The method of claim 9 , wherein forming the UBM includes:
forming an adhesion layer over the bond pads on the semiconductor die;
forming a barrier layer over the adhesion layer; and
forming a wettable layer over the barrier layer.
11. The method of claim 5 , further including depositing an underfill material between the semiconductor die and substrate.
12. The method of claim 5 , further including depositing an encapsulant over the semiconductor die and substrate.
13. A method of making a semiconductor device, comprising:
providing a semiconductor die having a plurality of bond pads formed on a surface of the semiconductor die;
forming an under bump metallization (UBM) over the bond pads of the semiconductor die;
forming a fusible layer over the UBM;
providing a substrate having a plurality of traces formed on a surface of the substrate; forming a plurality of stud bumps containing non-fusible material contacting first and second side surfaces of the traces; and
electrically connecting the stud bumps to the bond pads of the semiconductor die.
14. The method of claim 13 , wherein the stud bumps each include a wire having a base formed over first and second side surfaces of the traces and a tip of uniform height opposite the base electrically connected to the bond pad of the semiconductor die.
15. The method of claim 14 , further including electrically connecting the tip of the wire to the bond pad of the semiconductor die by reflowing the fusible layer or applying thermal compression bonding.
16. The method of claim 13 , wherein the fusible layer includes tin or tin alloy.
17. The method of claim 13 , wherein forming the UBM includes:
forming an adhesion layer over the bond pads on the semiconductor die;
forming a barrier layer over the adhesion layer; and
forming a wettable layer over the barrier layer.
18. The method of claim 13 , further including depositing an underfill material between the semiconductor die and substrate.
19. The method of claim 13 , further including depositing an encapsulant over the semiconductor die and substrate.
20. A method of making a semiconductor device, comprising:
providing a semiconductor die having a plurality of bond pads formed on a surface of the semiconductor die;
forming a fusible layer over the surface of the semiconductor die;
providing a substrate having a plurality of traces formed on a surface of the substrate; forming a plurality of electrical interconnects containing non-fusible material over the traces on the substrate, the electrical interconnects including a wire having a base contacting first and second side surfaces of the traces and a tip of uniform height opposite the base; and
electrically connecting the tip of the wire to the bond pad of the semiconductor die.
21. The method of claim 20 , wherein the fusible layer includes tin or tin alloy.
22. The method of claim 20 , further including forming an under bump metallization (UBM) between the fusible layer and bond pads of the semiconductor die.
23. The method of claim 22 , wherein forming the UBM includes:
forming an adhesion layer over the bond pads on the semiconductor die;
forming a barrier layer over the adhesion layer; and
forming a wettable layer over the barrier layer.
24. The method of claim 20 , further including:
depositing an underfill material between the semiconductor die and substrate; and
depositing an encapsulant over the semiconductor die and substrate.
25. The method of claim 1 , further including cutting and flattening the tip of the wire by mechanical pressure to the uniform height.