IP Library › Granted Patent US 8,263,927
Granted Patent B2
US 8,263,927 · App. 12/861,919 · Granted Sep 11, 2012

Circuit and method for temperature and process independent transimpedance amplifier arrangement

Assignee: Microsemi Corporation
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Quick Facts
Patent No.
US 8,263,927
App. No.
12/861,919
Granted
Sep 11, 2012
Kind
B2
Abstract

An integrated circuit transimpedance amplifier arrangement constituted of: a plurality of internal matched resistors; a current multiplier arranged to output a signal whose value is a function of an input current signal, an external resistor and a first set of the plurality of internal matched resistors; and an output transimpedance amplifier coupled to the output of the current multiplier, the output transimpedance amplifier exhibiting a gain whose value is a function of a second set of the plurality of internal matched resistors, wherein the output of the output transimpedance amplifier is a function of the input current signal, the external resistor, the first set of the plurality of internal matched resistors and the second set of the plurality of internal matched resistors, wherein the variations with temperature of the first set of the plurality of internal matched resistors and the second set of the plurality of internal matched resistors cancel.

Claims (39)

1. An integrated circuit transimpedance amplifier arrangement comprising:

a plurality of internal matched resistors;

a current multiplier arranged to output a signal whose value is a function of an input current signal, an external resistor and a first set of said plurality of internal matched resistors; and

an output transimpedance amplifier coupled to the output of said current multiplier, said output transimpedance amplifier exhibiting a gain whose value is a function of a second set of said plurality of internal matched resistors,

wherein the output of said output transimpedance amplifier is a function of the input current signal, the external resistor, said first set of said plurality of internal matched resistors and said second set of said plurality of internal matched resistors, wherein the variations with temperature of said first set of said plurality of internal matched resistors and said second set of said plurality of internal matched resistors cancel.

2. The integrated circuit transimpedance amplifier arrangement of claim 1 , further comprising an output difference circuit coupled to said output transimpedance amplifier, said output difference circuit arranged to cancel an offset of said output transimpedance amplifier.

3. The integrated circuit transimpedance amplifier arrangement of claim 2 , further comprising an output amplifier coupled to said output difference circuit, said output amplifier exhibiting a gain whose value is a function of the output of said output transimpedance amplifier and a third set of said plurality of internal matched resistors, wherein the variations with temperature of the constituent resistors of said third set of said plurality of internal matched resistors cancel.

4. The integrated circuit transimpedance amplifier arrangement of claim 1 , further comprising an input transimpedance amplifier and a voltage to current conversion unit coupled to said input transimpedance amplifier, the output of said voltage to current conversion unit exhibiting a gain whose value is a function of an input current and a fourth set of said plurality of internal matched resistors, wherein the variations with temperature of the constituent resistors of said fourth set of said plurality of internal matched resistors cancel.

5. The integrated circuit transimpedance amplifier arrangement of claim 1 , further comprising:

a first photo-diode exposed to a target light;

a second photo-diode not exposed to the target light; and

an input difference circuit arranged to provide the difference between the current of said first photo-diode and said second photo-diode,

the output of said input difference circuit presenting said input current signal.

6. A method comprising:

providing a plurality of internal matched resistors within an integrated circuit;

multiplying a current to provide a signal whose value is a function of an input current signal, an external resistor and a first set of said provided plurality of internal matched resistors; and

providing an output transimpedance amplifier coupled to provided signal, said provided output transimpedance amplifier exhibiting a gain whose value is a function of a second set of said provided plurality of internal matched resistors,

wherein the output of said provided output transimpedance amplifier is a function of the input current signal, an external resistor, said first set of said provided plurality of internal matched resistors and said second set of said provided plurality of internal matched resistors, wherein the variations with temperature of said first set of said provided plurality of internal matched resistors and said second set of said provided plurality of internal matched resistors cancel.

7. The method of claim 6 , further comprising:

canceling an offset of said provided output transimpedance amplifier.

8. The method of claim 7 , further comprising:

amplifying said cancelled offset output of said provided output transimpedance amplifier by a function of the output of said provided output transimpedance amplifier and a third set of said provided plurality of internal matched resistors, wherein the variations with temperature of the constituent resistors of said third set of said plurality of internal matched resistors cancel.

9. The method of claim 6 , further comprising:

providing an input transimpedance amplifier and a voltage to current conversion unit coupled to said provided input transimpedance amplifier, the output of said provided voltage to current conversion unit exhibiting a gain whose value is a function of an input current and a fourth set of said provided plurality of internal matched resistors, wherein the variations with temperature of the constituent resistors of said fourth set of said plurality of internal matched resistors cancel.

10. The method of claim 6 , further comprising:

providing a first photo-diode exposed to a target light;

providing a second photo-diode not exposed to the target light; and

producing the input current signal as a function of the difference between the current of said first photo-diode and said second photo-diode.

11. A light sensor comprising:

a plurality of internal matched resistors;

a first photo-diode exposed to a target light;

a second photo-diode not exposed to the target light;

an input difference circuit arranged to output a signal representing the difference between the current of said first photo-diode and said second photo-diode;

a current multiplier coupled to the output of said input difference circuit, said current multiplier arranged to output a signal whose value is a function of said signal representing the difference output by said input difference circuit, an external resistor and a first set of said plurality of internal matched resistors; and

an output transimpedance amplifier coupled to the output of said current multiplier, said output transimpedance amplifier exhibiting a gain whose value is a function of a second set of said plurality of internal matched resistors,

wherein the output of said output transimpedance amplifier is a function of said signal representing the difference output by said input difference circuit, the external resistor, said first set of said plurality of internal matched resistors and said second set of said plurality of internal matched resistors, wherein the variations with temperature of said first set of said plurality of internal matched resistors and said second set of said plurality of internal matched resistors cancel.

12. The light sensor of claim 11 , further comprising an output difference circuit coupled to said output transimpedance amplifier, said output difference circuit arranged to cancel an offset of said output transimpedance amplifier.

13. The light sensor of claim 12 , further comprising an output amplifier coupled to said output difference circuit, said output amplifier exhibiting a gain whose value is a function of the output of said output transimpedance amplifier and a third set of said plurality of internal matched resistors, wherein the variations with temperature of the constituent resistors of said third set of said plurality of internal matched resistors cancel.

14. The light sensor of claim 13 , further comprising an input transimpedance amplifier and a voltage to current conversion unit coupled to said input transimpedance amplifier, the output of said voltage to current conversion unit exhibiting a gain whose value is a function of an input current and a fourth set of said plurality of internal matched resistors, wherein the variations with temperature of the constituent resistors of said fourth set of said plurality of internal matched resistors cancel.

Assignments (18)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
RELEASE OF SECURITY INTEREST Recorded May 29, 2018
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.), INC.; MICROSEMI FREQUENCY AND TIME CORPORATION; MICROSEMI COMMUNICATIONS, INC.; MICROSEMI SOC CORP.; MICROSEMI CORP. - POWER PRODUCTS GROUP; MICROSEMI CORP. - RF INTEGRATED SOLUTIONS
Reel/Frame 046251/0391 →
PATENT SECURITY AGREEMENT Recorded Feb 3, 2016
From: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC. (F/K/A LEGERITY, INC., ZARLINK SEMICONDUCTOR (V.N.) INC., CENTELLAX, INC., AND ZARLINK SEMICONDUCTOR (U.S.) INC.); MICROSEMI FREQUENCY AND TIME CORPORATION (F/K/A SYMMETRICON, INC.); MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION); MICROSEMI SOC CORP. (F/K/A ACTEL CORPORATION); MICROSEMI CORP. - POWER PRODUCTS GROUP (F/K/A ADVANCED POWER TECHNOLOGY INC.); MICROSEMI CORP. - RF INTEGRATED SOLUTIONS (F/K/A AML COMMUNICATIONS, INC.)
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037691/0697 →
RELEASE OF SECURITY INTEREST Recorded Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION; MICROSEMI FREQUENCY AND TIME CORPORATION, A DELAWARE CORPORATION; MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION), A DELAWARE CORPORATION; MICROSEMI CORP.-MEMORY AND STORAGE SOLUTIONS (F/K/A WHITE ELECTRONIC DESIGNS CORPORATION), AN INDIANA CORPORATION
Reel/Frame 037558/0711 →
NOTICE OF SUCCESSION OF AGENCY Recorded Apr 9, 2015
From: ROYAL BANK OF CANADA (AS SUCCESSOR TO MORGAN STANLEY & CO. LLC)
To: BANK OF AMERICA, N.A., AS SUCCESSOR AGENT
Reel/Frame 035657/0223 →
SUPPLEMENTAL PATENT SECURITY AGREEMENT Recorded Nov 11, 2011
From: MICROSEMI CORPORATION; MICROSEMI CORP. - ANALOG MIXED SIGNAL GROUP; MICROSEMI CORP. - MASSACHUSETTS; ACTEL CORPORATION
To: MORGAN STANLEY & CO. LLC
Reel/Frame 027213/0611 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 13, 2010
From: CHAN, WILLIAM; KIM, PETER
To: MICROSEMI CORPORATION
Reel/Frame 024974/0726 →
Continuity (2)
Provisional Application 61241413 · Sep 11, 2009
Related Publication 20110062311A1 · Mar 17, 2011