Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die
View Patent ↗A semiconductor device has a semiconductor die mounted over a surface of a substrate. A mold underfill dispensing needle has a width substantially equal to a width of the semiconductor die. The dispensing needle is placed in fluid communication with a side of the semiconductor die. A mold underfill is deposited from an outlet of the dispensing needle evenly across a width of the semiconductor die into an area between the semiconductor die and substrate without motion of the dispensing needle. The dispensing needle has a shank and the outlet in a T-configuration. The dispensing needle can have a plurality of pole portions between a shank and the outlet. The dispensing needle has a plate between a shank and the outlet. The outlet has an upper edge with a length substantially equal to or greater than a length of a lower edge of the outlet.
1. A method of making a semiconductor device, comprising:
providing a substrate;
providing a semiconductor die;
mounting the semiconductor die over a surface of the substrate;
providing a mold underfill dispensing needle having a width substantially equal to a width of the semiconductor die;
placing the mold underfill dispensing needle in fluid communication with a side of the semiconductor die; and
depositing a mold underfill from an outlet of the dispensing needle evenly across a width of the semiconductor die into an area between the semiconductor die and substrate without motion of the dispensing needle.
2. The method of claim 1 , further including providing the dispensing needle with a shank and the outlet in a T-configuration.
3. The method of claim 1 , further including providing the dispensing needle with a plurality of pole portions between a shank and the outlet.
4. The method of claim 1 , further including providing the dispensing needle with a plate between a shank and the outlet.
5. The method of claim 1 , wherein the outlet includes a first edge having a length substantially equal to a length of a second edge of the outlet.
6. The method of claim 1 , wherein the outlet includes a first edge having a length greater than a length of a second edge of the outlet.
7. A method of making a semiconductor device, comprising:
mounting a semiconductor die over a substrate;
providing a dispensing needle disposed across a width of the semiconductor die;
disposing the dispensing needle in fluid communication with a side of the semiconductor die; and
depositing a mold underfill from an outlet of the dispensing needle into an area between the semiconductor die and substrate.
8. The method of claim 7 , further including providing the dispensing needle with a shank and the outlet in a T-configuration.
9. The method of claim 7 , further including providing the dispensing needle with a plurality of pole portions between a shank and the outlet.
10. The method of claim 7 , further including providing the dispensing needle with a plate between a shank and the outlet.
11. The method of claim 7 , wherein the outlet includes a first edge having a length substantially equal to a length of a second edge of the outlet.
12. The method of claim 7 , wherein the outlet includes a first edge having a length greater than a length of a second edge of the outlet.
13. The method of claim 7 , further including changing the dispensing needle to match a width of the semiconductor die.
14. A method of making a semiconductor device, comprising:
mounting a semiconductor die over a substrate;
providing a dispensing needle;
disposing the dispensing needle in fluid communication with a side of the semiconductor die; and
depositing a mold underfill from an outlet of the dispensing needle into an area between the semiconductor die and substrate without motion of the dispensing needle.
15. The method of claim 14 , wherein the dispensing needle has a width substantially equal to a width of the semiconductor die.
16. The method of claim 14 , further including providing the dispensing needle with a shank and the outlet in a T-configuration.
17. The method of claim 14 , further including providing the dispensing needle with a plurality of pole portions between a shank and the outlet.
18. The method of claim 14 , further including providing the dispensing needle with a plate between a shank and the outlet.
19. The method of claim 14 , wherein the outlet includes a first edge having a length substantially equal to a length of a second edge of the outlet.
20. The method of claim 14 , wherein the outlet includes a first edge having a length greater than a length of a second edge of the outlet.