Granted Patent B2

US 8,227,903 · App. 12/882,856 · Granted Jul 24, 2012

Abstract

Claims (32)

1. A method of manufacture of an integrated circuit packaging system comprising:

providing a substrate;

forming layers having non-horizontal strip patterns and non-vertical strip patterns over the substrate;

mounting an integrated circuit device on the substrate adjacent the non-horizontal strip patterns and the non-vertical strip patterns; and

applying an encapsulation over the integrated circuit device, the encapsulation restricted by the layers to prevent the encapsulation from reaching an edge of the substrate.

2. The method as claimed in claim 1 further comprising forming a crevice with sides of the non-horizontal strip patterns intersected by sides of the non-vertical strip patterns.

3. The method as claimed in claim 1 wherein applying the encapsulation includes forming the encapsulation adjacent a spill zone and over the layers.

4. The method as claimed in claim 1 wherein providing the substrate includes providing the substrate having a copper traced layer.

5. The method as claimed in claim 1 further comprising inserting the substrate having the integrated circuit device and the encapsulation in an automated process device.

6. A method of manufacture of an integrated circuit packaging system comprising:

providing a substrate;

forming layers having a cavity, non-horizontal strip patterns, and non-vertical strip patterns;

mounting an integrated circuit device on the substrate adjacent the cavity, the non-horizontal strip patterns and the non-vertical strip patterns; and

applying an encapsulation over the integrated circuit device, the encapsulation restricted by the layers to prevent the encapsulation from reaching an edge of the substrate.

7. The method as claimed in claim 6 further comprising forming a crevice by sides of the non-vertical strip patterns intersecting sides of the non-horizontal strip patterns below the sides of the non-vertical strip patterns opposite and facing away from the substrate.

8. The method as claimed in claim 6 wherein applying the encapsulation includes forming the encapsulation adjacent a spill zone, in the spill zone, and on a portion of the layers.

9. The method as claimed in claim 6 wherein providing the substrate includes providing the substrate having a resin support layer.

10. The method as claimed in claim 6 further comprising inserting the substrate having the integrated circuit device and the encapsulation in a magazine for an automated process device.

11. An integrated circuit packaging system comprising:

a substrate;

layers having non-horizontal strip patterns and non-vertical strip patterns over the substrate;

an integrated circuit device on the substrate adjacent the non-horizontal strip patterns and the non-vertical strip patterns; and

an encapsulation over the integrated circuit device, the encapsulation restricted by the layers to prevent the encapsulation from reaching an edge of the substrate.

12. The system as claimed in claim 11 further comprising a crevice formed by sides of the non-horizontal strip patterns intersecting sides of the non-vertical strip patterns.

13. The system as claimed in claim 11 wherein the encapsulation includes the encapsulation adjacent a spill zone and to the layers.

14. The system as claimed in claim 11 wherein the substrate includes a copper traced layer.

15. The system as claimed in claim 11 wherein the substrate having the integrated circuit device and the encapsulation is in an automated process device.

16. The system as claimed in claim 11 further comprising a cavity formed by the non-horizontal strip patterns and the non-vertical strip patterns and adjacent the integrated circuit device.

17. The system as claimed in claim 16 further comprising a crevice formed by sides of the non-vertical strip patterns intersecting sides of the non-horizontal strip patterns below the sides of the non-vertical strip patterns opposite and facing away from the substrate.

18. The system as claimed in claim 16 wherein the encapsulation includes the encapsulation adjacent a spill zone, in the spill zone, and on a portion of the layers.

19. The system as claimed in claim 16 wherein the substrate includes a resin support layer.

20. The system as claimed in claim 16 wherein the substrate having the integrated circuit device and the encapsulation is in a magazine of an automated process device.

Assignments (8)