Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer
View Patent ↗A semiconductor wafer contains a plurality of die with contact pads disposed on a first surface of each die. Metal vias are formed in trenches in the saw street guides and are surrounded by organic material. Traces connect the contact pads and metal vias. The metal vias can be half-circle vias or full-circle vias. The metal vias are surrounded by organic material. Redistribution layers (RDL) are formed on a second surface of the die opposite the first surface. The RDL and THV provide expanded interconnect flexibility to adjacent die. Repassivation layers are formed between the RDL on the second surface of the die for electrical isolation. The die are stackable and can be placed in a semiconductor package with other die. The RDL provide electrical interconnect to the adjacent die. Bond wires and solder bumps also provide electrical connection to the semiconductor die.
1. A method of making a semiconductor device, comprising:
providing a plurality of semiconductor die with a plurality of contact pads disposed over a first surface of the semiconductor die;
forming a trench between the semiconductor die;
depositing an insulating material in the trench;
forming a plurality of conductive vias through the insulating material;
forming a plurality of conductive traces over the first surface electrically connecting a first portion of the conductive vias to the contact pads;
forming a redistribution layer (RDL) over a second surface of the semiconductor die opposite the first surface, the RDL extending across the second surface of the semiconductor die to route electrical signals to areas on the second surface including a central region of the semiconductor die, wherein a second portion of the conductive vias is electrically isolated from the conductive traces; and
forming a repassivation layer over the second surface of the semiconductor die for electrical isolation between portions of the RDL.
2. The method of claim 1 , further including expanding a space between the semiconductor die to increase a width of the trench.
3. The method of claim 1 , further including singulating the semiconductor device through the conductive vias to separate the semiconductor die.
4. The method of claim 1 , further including forming the conductive vias side-by-side in the insulating material.
5. The method of claim 1 , further including singulating the semiconductor device between the conductive vias to separate the semiconductor die.
6. The method of claim 1 , further including:
stacking a plurality of semiconductor die; and
electrically connecting the stacked semiconductor die through the RDL and conductive vias.
7. A method of making a semiconductor device, comprising:
providing a plurality of semiconductor die with a plurality of contact pads disposed over a first surface of the semiconductor die;
depositing an insulating material around the semiconductor die;
forming a plurality of conductive vias through the insulating material;
forming a plurality of conductive traces over the first surface electrically connecting a first portion of the conductive vias to the contact pads;
forming a redistribution layer (RDL) over a second surface of the semiconductor die opposite the first surface, wherein a first portion of the RDL is electrically connected to the conductive vias and a second portion of the RDL is electrically isolated from the conductive vias; and
forming a repassivation layer over the second surface of the semiconductor die for electrical isolation between portions of the RDL.
8. The method of claim 7 , wherein a second portion of the conductive vias is electrically isolated from the conductive traces.
9. The method of claim 7 , wherein the RDL extends across the second surface of the semiconductor die to route electrical signals to areas on the second surface including a central region of the semiconductor die.
10. The method of claim 7 , further including singulating the semiconductor device through the conductive vias to separate the semiconductor die.
11. The method of claim 7 , further including forming the conductive vias side-by-side in the insulating material.
12. The method of claim 7 , further including singulating the semiconductor device between the conductive vias to separate the semiconductor die.
13. The method of claim 7 , further including:
stacking a plurality of semiconductor die; and
electrically connecting the stacked semiconductor die through the RDL and conductive vias.
14. A method of making a semiconductor device, comprising:
providing a plurality of semiconductor die;
depositing an insulating material around the semiconductor die;
forming a plurality of conductive vias through the insulating material;
forming a plurality of conductive traces over a first surface of the semiconductor die electrically connecting the conductive vias to contact pads of the semiconductor die; and
forming a redistribution layer (RDL) over a second surface of the semiconductor die opposite the first surface, wherein a first portion of the RDL is electrically connected to the conductive vias, wherein a second portion of the RDL is electrically isolated from the conductive vias.
15. The method of claim 14 , further including forming a repassivation layer over the second surface of the semiconductor die for electrical isolation between portions of the RDL.
16. The method of claim 14 , wherein the RDL extends across the second surface of the semiconductor die to route electrical signals to areas on the second surface.
17. The method of claim 14 , further including singulating the semiconductor device through or between the conductive vias to separate the semiconductor die.
18. The method of claim 14 , further including:
stacking a plurality of semiconductor die; and
electrically connecting the stacked semiconductor die through the RDL and conductive vias.
19. A method of making a semiconductor device, comprising:
providing a plurality of semiconductor die;
depositing an insulating material around the semiconductor die;
forming a plurality of conductive vias through the insulating material;
forming a plurality of conductive traces over a first surface of the semiconductor die; and
forming a redistribution layer (RDL) over a second surface of the semiconductor die opposite the first surface, wherein a first portion of the RDL is electrically connected to the conductive vias, wherein a second portion of the RDL is electrically isolated from the conductive vias.
20. The method of claim 19 , further including forming a repassivation layer over the second surface of the semiconductor die for electrical isolation between portions of the RDL.
21. The method of claim 19 , wherein the RDL extends across the second surface of the semiconductor die to route electrical signals to areas on the second surface.
22. The method of claim 19 , further including singulating the semiconductor device through or between the conductive vias to separate the semiconductor die.
23. The method of claim 19 , further including:
stacking a plurality of semiconductor die; and
electrically connecting the stacked semiconductor die through the RDL and conductive vias.
24. A method of making a semiconductor device, comprising:
providing a plurality of semiconductor die;
depositing an insulating material around the semiconductor die;
forming a plurality of vias through the insulating material;
depositing a conductive material in the vias to form a plurality of conductive vias; and
forming a plurality of conductive traces over a first surface of the semiconductor die electrically connecting a first portion of the conductive vias to contact pads of the semiconductor die, wherein a second portion of the conductive vias is electrically isolated from the conductive traces.
25. The method of claim 24 , further including forming a redistribution layer (RDL) over a second surface of the semiconductor die opposite the first surface, wherein a first portion of the RDL is electrically connected to the conductive vias.
26. The method of claim 25 , wherein a second portion of the RDL is electrically isolated from the conductive vias.
27. The method of claim 25 , wherein the RDL extends across the second surface of the semiconductor die to route electrical signals to areas on the second surface.
28. The method of claim 24 , further including singulating the semiconductor device through or between the conductive vias to separate the semiconductor die.
29. The method of claim 24 , further including:
stacking a plurality of semiconductor die; and
electrically connecting the stacked semiconductor die through the conductive vias.
30. A method of making a semiconductor device, comprising:
providing a plurality of semiconductor die;
forming an insulating material around the semiconductor die;
forming a plurality of conductive vias through the insulating material;
forming a plurality of conductive traces over a first surface of the semiconductor die; and
forming a redistribution layer (RDL) over a second surface of the semiconductor die opposite the first surface, wherein a first portion of the RDL is electrically connected to the conductive vias and a second portion of the RDL is electrically isolated from the conductive vias.
31. The method of claim 30 , wherein the RDL extends across the second surface of the semiconductor die to route electrical signals to areas on the second surface.
32. The method of claim 30 , further including singulating the semiconductor device through or between the conductive vias to separate the semiconductor die.
33. The method of claim 30 , wherein a first portion of the conductive vias is electrically connected to contact pads of the semiconductor die with the conductive traces and a second portion of the conductive vias is electrically isolated from the conductive traces.
34. The method of claim 30 , further including:
stacking a plurality of semiconductor die; and
electrically connecting the stacked semiconductor die through the conductive vias.