Linear semiconductor processing facilities
View Patent ↗Methods and systems are provided for handling materials, including materials used in semiconductor manufacturing systems. The methods and systems include linear semiconductor processing facilities for vacuum-based semiconductor processing and handling, as well as linkable or extensible semiconductor processing facilities that can be flexibly configured to meet a variety of constraints.
1. A system comprising:
a front end module operating in an atmospheric environment;
a first robotic handler operating in a vacuum environment;
a load lock coupling the front end module to the first robotic handler, the load lock having stacked workpiece transfer planes adapted to transfer workpieces between the atmospheric environment and the vacuum environment and allowing workpieces to enter or exit the system along different transfer planes;
a second robotic handler operating in the vacuum environment, the second robotic handler operable to exchange the workpieces with the first robotic handler, wherein at least one of the first robotic handler and the second robotic handler is adapted to move the workpiece in at least two different horizontal planes and another of the first robotic handler and the second robotic handler is substantially vertically fixed and includes a transport arm for transporting the workpiece along at least one intermediate transfer plane;
a second load lock coupled to the second robotic handler, the second load lock having stacked transfer planes for allowing workpieces to enter or exit the system along different transfer planes; and
a second equipment front end module coupled to the second load lock, the second equipment front end module operating in an atmospheric environment, where the second load lock is adapted to exchange workpieces between the vacuum environment of the second robotic handler and the atmospheric environment along the stacked transfer planes;
wherein passage of workpieces between the first and second robotic handlers is along the at least one intermediate workpiece transfer plane, each of the at least one intermediate workpiece transfer plane being disposed between the stacked workpiece transfer planes of the first and second load locks and independent of other ones of the at least one intermediate workpiece transfer planes for transferring workpieces to respective process modules aligned with the at least one intermediate transfer plane.
2. The system of claim 1 wherein at least one of the first robotic handler and the second robotic handler includes a z motor for moving between the at least two different horizontal planes.
3. The system of claim 1 further comprising a buffer for exchanging workpieces between the first robotic handler and the second robotic handler.
4. The system of claim 1 wherein the at least two different horizontal planes allow independent transfer of a plurality of workpieces.
5. The system of claim 1 wherein the first robotic handler is coupled to two or more process modules, the two or more process modules sharing the vacuum environment with the first robotic handler and the first robotic handler configured to move workpieces among the two or more process modules.
6. The system of claim 5 further comprising a slot valve for selectively isolating an interior of one of the two or more process modules from the vacuum environment.
7. The system of claim 1 wherein the second robotic handler is coupled to two or more process modules, the two or more process modules sharing the vacuum environment with the second robotic handler and the second robotic handler configured to move workpieces among the two or more process modules.
8. The system of claim 7 further comprising a slot valve for selectively isolating an interior of one of the two or more process modules from the vacuum environment.
9. The system of claim 1 wherein at least one of the first robotic handler and the second robotic handler includes a dual-arm robot.
10. The system of claim 1 wherein at least one of the first robotic handler and the second robotic handler includes dual robots.
11. The system of claim 1 wherein the load lock includes two load locks vertically stacked with respect to one another.
12. The system of claim 1 wherein the front end modules include an atmospheric robotic handler.
13. The system of claim 1 further comprising a third robotic handler operating in the vacuum environment, the third robotic handler operable to exchange workpieces with the first and second robotic handlers.
14. The system of claim 13 further comprising a third load lock coupled to the third robotic handler, the third load lock adapted to exchange workpieces between the vacuum environment of the third robotic handler and the atmospheric environment.