Semiconductor device and method of forming guard ring around conductive TSV through semiconductor wafer
View Patent ↗A semiconductor device has a plurality of conductive vias formed into a semiconductor wafer. An insulating lining is formed around the conductive vias and a conductive layer is formed over the insulating lining. A portion of the semiconductor wafer is removed so the conductive vias extend above a surface of the semiconductor wafer. A first insulating layer is formed over the surface of the semiconductor wafer and conductive vias. A first portion of the first insulating layer is removed and a second portion of the first insulating layer remains as guard rings around the conductive vias. A conductive layer is formed over the conductive vias. A second insulating layer is formed over the surface of the semiconductor wafer, guard rings, and conductive vias. A portion of the second insulating layer is removed to expose the conductive vias and a portion of the guard rings.
1. A method of making a semiconductor device, comprising:
providing a semiconductor wafer;
forming a plurality of conductive vias into the semiconductor wafer;
removing a portion of the semiconductor wafer so the conductive vias extend above a surface of the semiconductor wafer;
forming a first insulating layer over the surface of the semiconductor wafer and conductive vias;
removing a first portion of the first insulating layer while leaving a second portion of the first insulating layer as guard rings around the conductive vias;
forming a second insulating layer over the surface of the semiconductor wafer, guard rings, and conductive vias; and
removing a portion of the second insulating layer to expose the conductive vias.
2. The method of claim 1 , wherein forming the plurality of conductive vias includes:
forming a plurality of vias through the semiconductor wafer;
forming a third insulating layer in the vias; and
depositing a conductive material in the vias.
3. The method of claim 2 , further including forming a conductive layer over the third insulating layer.
4. The method of claim 1 , further including forming a conductive layer over the conductive vias.
5. The method of claim 1 , further including removing the portion of the second insulating layer to expose the guard rings.
6. The method of claim 1 , further including removing the first portion of the first insulating layer by laser direct ablation.
7. A method of making a semiconductor device, comprising:
providing a semiconductor die;
forming a conductive via through the semiconductor die with a portion of the conductive via extending above a surface of the semiconductor die;
forming a first insulating layer over the surface of the semiconductor die and conductive via; and
removing a first portion of the first insulating layer while leaving a second portion of the first insulating layer as a guard ring around the conductive via.
8. The method of claim 7 , further including:
forming a second insulating layer over the surface of the semiconductor die, guard ring, and conductive via; and
removing a portion of the second insulating layer to expose the conductive via.
9. The method of claim 8 , further including removing the portion of the second insulating layer to expose the guard ring.
10. The method of claim 8 , further including removing the portion of the second insulating layer over the conductive via by laser direct ablation.
11. The method of claim 7 , wherein forming the conductive via includes:
forming a via through the semiconductor die;
forming a second insulating layer in the via; and
depositing a conductive material in the via.
12. The method of claim 11 , further including forming a conductive layer over the second insulating layer.
13. The method of claim 7 , further including forming a conductive layer over the conductive via.
14. A method of making a semiconductor device, comprising:
providing a semiconductor die;
forming a conductive via through the semiconductor die with a portion of the conductive via extending above a surface of the semiconductor die;
forming a guard ring over the surface of the semiconductor die around the conductive via;
forming a first insulating layer over the surface of the semiconductor die, guard ring, and conductive via; and
removing a portion of the first insulating layer to expose the conductive via and guard ring.
15. The method of claim 14 , wherein forming the guard ring includes:
forming a second insulating layer over the surface of the semiconductor die and conductive via; and
removing a first portion of the second insulating layer while leaving a second portion of the second insulating layer as the guard ring around the conductive via.
16. The method of claim 14 , wherein forming the conductive via includes:
forming a via through the semiconductor die;
forming a second insulating layer in the via; and
depositing a conductive material in the via.
17. The method of claim 14 , further including forming a conductive layer over the conductive via.
18. A semiconductor device, comprising:
a semiconductor die;
a conductive via formed through the semiconductor die with a portion of the conductive via extending above a surface of the semiconductor die;
a guard ring formed over the surface of the semiconductor die around the conductive via; and
a first insulating layer formed over the surface of the semiconductor die and conductive via to expose the guard ring and conductive via.
19. The semiconductor device of claim 18 , further including a second insulating layer formed around the conductive via.
20. The semiconductor device of claim 18 , further including a conductive layer formed over the conductive via.