Integrated circuit packaging system with interposer

1. An integrated circuit packaging system comprising:

a base package substrate;

a first integrated circuit die attached over the base package substrate; and

an interposer having a recessed edge and a corner that extends to a singulation edge, the interposer mounted over the first integrated circuit die, the interposer having a recess gap between the recessed edge and the singulation edge.

2. The system as claimed in claim 1 further comprising an electrical interconnect coupled between the interposer and the base package substrate through the recess gap in the interposer.

3. The system as claimed in claim 1 further comprising an encapsulant molded through the recess gap in the interposer.

4. The system as claimed in claim 1 further comprising a second integrated circuit die mounted over the first integrated circuit die.

5. The system as claimed in claim 1 further comprising a contact array on the interposer, the contact array including interposer bonding contacts, interposer pin pads, interposer contacts, or a combination thereof.

6. The system as claimed in claim 1 further comprising:

an interposer bonding contact adjacent to the recess gap in the interposer;

an upper surface contact on the base package substrate; and

an adhesive between the base package substrate and the first integrated circuit die includes the adhesive between the interposer and the first integrated circuit die.

7. The system as claimed in claim 6 further comprising:

an electrical interconnect through the recess gap coupled between the interposer and the base package substrate; and

a second integrated circuit die coupled to the first integrated circuit die, the base package substrate, the interposer, or a combination thereof.

8. The system as claimed in claim 6 further comprising:

an encapsulant molded through the recess gap; and

an electrical interconnect and a portion of the interposer encased in the encapsulant.

9. The system as claimed in claim 6 further comprising a second integrated circuit die mounted over the first integrated circuit die;

wherein:

the adhesive is between the first integrated circuit die and the second integrated circuit die.

10. The system as claimed in claim 6 further comprising:

a contact array on the interposer, the contact array including interposer bonding contacts, interposer pin pads, interposer contacts, or a combination thereof; and

an encapsulant molded over the interposer bonding contacts and not on the interposer pin pads or the interposer contacts.