Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP
A semiconductor device is made by mounting a semiconductor wafer to a temporary carrier. A plurality of TSV is formed through the wafer. A cavity is formed partially through the wafer. A first semiconductor die is mounted to a second semiconductor die. The first and second die are mounted to the wafer such that the first die is disposed over the wafer and electrically connected to the TSV and the second die is disposed within the cavity. An encapsulant is deposited over the wafer and first and second die. A portion of the encapsulant is removed to expose a first surface of the first die. A portion of the wafer is removed to expose the TSV and a surface of the second die. The remaining portion of the wafer operates as a TSV interposer for the first and second die. An interconnect structure is formed over the TSV interposer.
1. A semiconductor device, comprising:
a first substrate including a plurality of conductive vias formed through a surface of the first substrate and a cavity formed partially but not completely through the first substrate;
a second substrate disposed within the cavity;
a first semiconductor die mounted to a surface of the second substrate and to the first substrate;
a first interconnect structure formed on a first surface of the first semiconductor die and contacting the second substrate and first semiconductor die; and
an encapsulant deposited over the surface of the first substrate and first semiconductor die with a second surface of the first semiconductor die coplanar with a surface of the encapsulant and with a trench of the first substrate adjacent to the cavity completely occupied by the encapsulant.
2. The semiconductor device of claim 1 , wherein the conductive vias are exposed from the first substrate.
3. The semiconductor device of claim 1 , further including a second interconnect structure formed over the first semiconductor die and encapsulant.
4. The semiconductor device of claim 1 , further including a heat sink or shielding layer formed over the first semiconductor die.
5. The semiconductor device of claim 1 , further including a second interconnect structure formed through the encapsulant around the first semiconductor die.
6. The semiconductor device of claim 1 , wherein the second substrate includes a second semiconductor die.
7. The semiconductor device of claim 1 , further including a passive device mounted to the first substrate.
8. The semiconductor device of claim 1 , wherein the first substrate, second substrate, and first semiconductor die include matching coefficients of thermal expansion (CTE) to reduce warpage of the semiconductor device.