Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation
A semiconductor device has a semiconductor die with a plurality of bumps formed over a surface of the first semiconductor die. A penetrable adhesive layer is formed over a temporary carrier. The adhesive layer can include a plurality of slots. The semiconductor die is mounted to the carrier by embedding the bumps into the penetrable adhesive layer. The semiconductor die and interconnect structure can be separated by a gap. An encapsulant is deposited over the first semiconductor die. The bumps embedded into the penetrable adhesive layer reduce shifting of the first semiconductor die while depositing the encapsulant. The carrier is removed. An interconnect structure is formed over the semiconductor die. The interconnect structure is electrically connected to the bumps. A thermally conductive bump is formed over the semiconductor die, and a heat sink is mounted to the interconnect structure and thermally connected to the thermally conductive bump.
1. A semiconductor device, comprising:
a first semiconductor die including a plurality of bumps formed on a surface of the first semiconductor die;
a penetrable adhesive layer disposed directly on the surface of the first semiconductor die with the bumps completely embedded within the penetrable adhesive layer to displace the penetrable adhesive layer;
an encapsulant deposited over the first semiconductor die; and
an interconnect structure formed over the first semiconductor die and electrically connected to the bumps.
2. The semiconductor device of claim 1 , wherein the bumps completely embedded within the penetrable adhesive layer reduce shifting of the first semiconductor die.
3. The semiconductor device of claim 1 , wherein the interconnect structure includes:
a conductive layer; and
an insulating layer formed around the conductive layer.
4. The semiconductor device of claim 1 , further including a plurality of electrically isolated bumps formed over the surface of the first semiconductor die.
5. The semiconductor device of claim 1 , further including a second semiconductor die or component disposed over a surface of the interconnect structure opposite the first semiconductor die.
6. A semiconductor device, comprising:
a first semiconductor die including a first bump formed over a surface of the first semiconductor die;
an adhesive layer disposed over the first semiconductor die with the first bump embedded within the adhesive layer to displace the adhesive layer; and
an encapsulant deposited over the first semiconductor die.
7. The semiconductor device of claim 6 , wherein the first bump embedded within the adhesive layer reduces shifting of the first semiconductor die.
8. The semiconductor device of claim 6 , further including an interconnect structure formed over the first semiconductor die and electrically connected to the first bump.
9. The semiconductor device of claim 6 , further including a second bump disposed over the semiconductor die, the second bump including a cross-sectional area larger than the first bump.
10. The semiconductor device of claim 6 , further including a plurality of openings formed in the adhesive layer.
11. The semiconductor device of claim 8 , further including:
a thermally conductive via formed in the interconnect structure; and
a heat sink disposed over a surface of the interconnect structure opposite the first semiconductor die and connected to the thermally conductive via.
12. The semiconductor device of claim 8 , further including a second semiconductor die or component disposed over a surface of the interconnect structure opposite the first semiconductor die.
13. A semiconductor device, comprising:
a first semiconductor die including first bumps formed on a surface of the semiconductor die;
an adhesive layer disposed over the first semiconductor die to embed the bumps; and
an encapsulant deposited over the first semiconductor die.
14. The semiconductor device of claim 13 , further including a plurality of second bumps formed over the surface of the first semiconductor die and at least partially embedded in the adhesive layer to reduce shifting of the first semiconductor die.
15. The semiconductor device of claim 13 , further including an interconnect structure formed over the first semiconductor die.
16. The semiconductor device of claim 13 , further including a plurality of openings formed in the adhesive layer.
17. The semiconductor device of claim 15 , further including a thermally conductive via formed in the interconnect structure.
18. The semiconductor device of claim 15 , further including a heat sink disposed over a surface of the interconnect structure opposite the first semiconductor die.
19. The semiconductor device of claim 15 , further including a second semiconductor die or component disposed over a surface of the interconnect structure opposite the first semiconductor die.
20. A semiconductor device, comprising:
a first semiconductor die including bumps formed over a surface of the first semiconductor die;
an adhesive layer disposed over the surface of the first semiconductor die with the bumps at least partially embedded into the adhesive layer to reduce shifting of the first semiconductor die; and
an encapsulant deposited over the first semiconductor die.
21. The semiconductor device of claim 20 , further including an interconnect structure formed over the first semiconductor die and electrically connected to the bumps.
22. The semiconductor device of claim 21 , further including a thermally conductive via formed in the interconnect structure.
23. The semiconductor device of claim 21 , further including a heat sink disposed over a surface of the interconnect structure opposite the first semiconductor die.
24. The semiconductor device of claim 21 , further including a second semiconductor die or component disposed over a surface of the interconnect structure opposite the first semiconductor die.