Method of forming RDL wider than contact pad along first axis and narrower than contact pad along second axis
View Patent ↗A semiconductor device has a semiconductor die and first conductive layer formed over a surface of the semiconductor die. A first insulating layer is formed over the surface of the semiconductor die. A second insulating layer is formed over the first insulating layer and first conductive layer. An opening is formed in the second insulating layer over the first conductive layer. A second conductive layer is formed in the opening over the first conductive layer and second insulating layer. The second conductive layer has a width that is less than a width of the first conductive layer along a first axis. The second conductive layer has a width that is greater than a width of the first conductive layer along a second axis perpendicular to the first axis. A third insulating layer is formed over the second conductive layer and first insulating layer.
1. A method of making a semiconductor device, comprising:
providing a substrate;
forming a first conductive layer over the substrate;
forming a first insulating layer over the substrate; and
forming a second conductive layer over the first conductive layer, the second conductive layer including a first width that is less than a first width of the first conductive layer along a first axis and a second width that is greater than a second width of the first conductive layer along a second axis perpendicular to the first axis.
2. The method of claim 1 , further including forming a second insulating layer over the second conductive layer and first insulating layer.
3. The method of claim 1 , further including forming a second insulating layer over the substrate prior to forming the first insulating layer.
4. The method of claim 1 , wherein the second width of the second conductive layer is greater than the second width of the first conductive layer along the second axis by 10-20 micrometers.
5. The method of claim 1 , wherein the first width of the first conductive layer is greater than the first width of the second conductive layer along the first axis by 10-20 micrometers.
6. The method of claim 1 , wherein the substrate includes a semiconductor die.
7. A semiconductor device, comprising:
a substrate;
a first conductive layer formed over the substrate;
a first insulating layer formed over the substrate; and
a second conductive layer formed over the first conductive layer, the second conductive layer including a first width that is less than a first width of the first conductive layer along a first axis and a second width that is greater than a second width of the first conductive layer along a second axis to the first axis.
8. The semiconductor device of claim 7 , further including a second insulating layer formed over the second conductive layer and first insulating layer.
9. The semiconductor device of claim 7 , further including a second insulating layer formed over the substrate.
10. The semiconductor device of claim 7 , wherein the second width of the second conductive layer is greater than the second width of the first conductive layer along the second axis by 10-20 micrometers.
11. The semiconductor device of claim 7 , wherein the first width of the first conductive layer is greater than the first width of the second conductive layer along the first axis by 10-20 micrometers.
12. The semiconductor device of claim 7 , wherein the substrate includes a semiconductor die.
13. A method of making a semiconductor device, comprising:
providing a substrate;
forming a first conductive layer over the substrate;
forming a first insulating layer over the substrate; and
forming an opening in the first insulating layer that is narrower than the first conductive layer along a first axis and wider than the first conductive layer along a second axis.
14. The method of claim 13 , further including forming a second conductive layer over the first insulating layer and within the opening.
15. The method of claim 13 , further including forming a second conductive layer over the first conductive layer that is narrower than the first conductive layer along the first axis and wider than the first conductive layer along the second axis.
16. The method of claim 15 , wherein a width of the second conductive layer is less than a width of the first conductive layer along the first axis by 10-20 micrometers.
17. The method of claim 15 , wherein a width of a contact interface between the first conductive layer and second conductive layer ranges from 20-40 micrometers.
18. The method of claim 13 , further including forming a second insulating layer over the substrate prior to forming the first insulating layer.
19. The method of claim 13 , wherein the substrate includes a semiconductor die.
20. A semiconductor device, comprising:
a substrate;
a first conductive layer formed over the substrate;
a first insulating layer formed over the substrate; and
a second conductive layer formed over the first conductive layer that is narrower than the first conductive layer along a first axis and wider than the first conductive layer along a second axis.
21. The semiconductor device of claim 20 , wherein the second axis is perpendicular to the first axis.
22. The semiconductor device of claim 20 , further including an opening formed in the first insulating layer over the first conductive layer, the opening extending beyond the first conductive layer on first and second opposing edges of the first conductive layer.
23. The semiconductor device of claim 20 , wherein a width of the second conductive layer is greater than a width of the first conductive layer along the second axis by 10-20 micrometers.
24. The semiconductor device of claim 20 , wherein a width of the second conductive layer is less than a width of the first conductive layer along the first axis by 10-20 micrometers.
25. The semiconductor device of claim 20 , wherein the substrate includes a semiconductor die.