Composition for tungsten CMP

1. A chemical mechanical polishing composition comprising:

a water based liquid carrier;

a colloidal silica abrasive dispersed in the liquid carrier, the colloidal silica abrasive having a permanent positive charge of at least 6 mV; and

a polycationic amine compound in solution in the liquid carrier.

2. The composition of claim 1 , wherein the colloidal silica has a permanent positive charge of at least 15 mV.

3. The composition of claim 1 , wherein the colloidal silica is treated with an aminosilane compound.

4. The composition of claim 3 , wherein the aminosilane compound is selected from the group consisting of such as bis(2-hydroxyethyl)-3-aminopropyl trialkoxysilane, diethylaminomethyltrialkoxysilane, (N,N-diethyl-3-aminopropyl)trialkoxysilane), 3-(N-styrylmethyl-2-aminoethylaminopropyl trialkoxysilane, aminopropyl trialkoxysilane, (2-N-benzylaminoethyl)-3-aminopropyl trialkoxysilane), trialkoxysilyl propyl-N,N,N-trimethyl ammonium chloride, N-(trialkoxysilylethyl)benzyl-N,N,N-trimethyl ammonium chloride, (bis(methyldialkoxysilylpropyl)-N-methyl amine, bis(trialkoxysilylpropyl)urea, bis(3-(trialkoxysilyl)propyl)-ethylenediamine, bis(trialkoxysilylpropyl)amine, bis(trialkoxysilylpropyl)amine, and mixtures thereof.

5. The composition of claim 1 , further comprising an iron containing accelerator.

6. The composition of claim 5 , wherein the iron containing accelerator comprises a soluble iron containing catalyst.

7. The composition of claim 6 , further comprising a stabilizer bound to the soluble iron containing catalyst, the stabilizer being selected from the group consisting of phosphoric acid, phthalic acid, citric acid, adipic acid, oxalic acid, malonic acid, aspartic acid, succinic acid, glutaric acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, maleic acid, glutaconic acid, muconic acid, ethylenediaminetetraacetic acid, propylenediaminetetraacetic acid, and mixtures thereof.

8. The composition of claim 1 , further comprising a hydrogen peroxide oxidizer.

9. The composition of claim 1 , having a pH in a range from about 2.0 to about 3.5.

10. The composition of claim 1 , wherein the polycationic amine compound is a polyquaternary amine compound.

11. The composition of claim 10 , wherein the polyquaternary amine compound is a diquaternary amine compound.

12. The composition of claim 11 , wherein the diquaternary amine is selected from the group consisting of N,N′-methylenebis(dimethyltetradecylammonium bromide), 1,1,4,4-tetrabutylpiperazinediium dibromide, N,N,N′,N′,N′-pentamethyl-N-tallow-1,3-propane-diammonium dichloride, N,N′-hexamethylenebis(tributylammonium hydroxide), didodecyl-tetramethyl-1,4-butanediaminium diiodide, 1,5-dimethyl-1,5-diazoniabicyclo(3.2.2)nonane dibromide, and N(1),N(6)-didodecyl-N(1),N(1),N(6),N(6)-tetramethyl-1,6-hexanediaminium diiodide, and mixtures thereof.

13. The composition of claim 11 , wherein the diquaternary amine comprises an alkyl group having 10 or more carbon atoms.

14. A method of chemical mechanical polishing a substrate including a tungsten layer, the method comprising:

(a) contacting the substrate with a polishing composition comprising:

(i) a water based liquid carrier;

(ii) a colloidal silica abrasive dispersed in the liquid carrier, the colloidal silica abrasive having a permanent positive charge of at least 6 mV; and

(iii) a polycationic amine compound in solution in the liquid carrier;

(b) moving the polishing composition relative to the substrate; and

(c) abrading the substrate to remove a portion of the tungsten from the substrate and thereby polish the substrate.

15. The method of claim 14 , wherein the colloidal silica has a permanent positive charge of at least 15 mV.

16. The method of claim 14 , wherein the colloidal silica is treated with an aminosilane compound selected from the group consisting of such as bis(2-hydroxyethyl)-3-aminopropyl trialkoxysilane, diethylaminomethyltrialkoxysilane, (N,N-diethyl-3-aminopropyl)trialkoxysilane), 3-(N-styrylmethyl-2-aminoethylaminopropyl trialkoxysilane, aminopropyl trialkoxysilane, (2-N-benzylaminoethyl)-3-aminopropyl trialkoxysilane), trialkoxysilyl propyl-N,N,N-trimethyl ammonium chloride, N-(trialkoxysilylethyl)benzyl-N,N,N-trimethyl ammonium chloride, (bis(methyldialkoxysilylpropyl)-N-methyl amine, bis(trialkoxysilylpropyl)urea, bis(3-(trialkoxysilyl)propyl)-ethylenediamine, bis(trialkoxysilylpropyl)amine, bis(trialkoxysilylpropyl)amine, and mixtures thereof.

17. The method of claim 14 , wherein the polishing composition further comprises:

a soluble iron containing catalyst; and

a stabilizer bound to the soluble iron containing catalyst, the stabilizer being selected from the group consisting of phosphoric acid, phthalic acid, citric acid, adipic acid, oxalic acid, malonic acid, aspartic acid, succinic acid, glutaric acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, maleic acid, glutaconic acid, muconic acid, ethylenediaminetetraacetic acid, propylenediaminetetraacetic acid, and mixtures thereof.

18. The method of claim 14 , wherein the polishing composition further comprises a hydrogen peroxide oxidizer.

19. The method of claim 14 , wherein the polycationic amine compound is a diquaternary amine compound selected from the group consisting of N,N′-methylenebis(dimethyltetradecylammonium bromide), 1,1,4,4-tetrabutylpiperazinediium dibromide, N,N,N′,N′,N′-pentamethyl-N-tallow-1,3-propane-diammonium dichloride, N,N′-hexamethylenebis(tributylammonium hydroxide), didodecyl-tetramethyl-1,4-butanediaminium diiodide, 1,5-dimethyl-1,5-diazoniabicyclo(3.2.2)nonane dibromide, and N(1),N(6)-didodecyl-N(1),N(1),N(6),N(6)-tetramethyl-1,6-hexanediaminium diiodide, and mixtures thereof.

20. The composition of claim 14 , wherein the polycationic amine compound comprises a diquaternary amine compound having an alkyl group with 10 or more carbon atoms.