Ultrahigh density vertical NAND memory device
Monolithic, three dimensional NAND strings include a semiconductor channel, at least one end portion of the semiconductor channel extending substantially perpendicular to a major surface of a substrate, a plurality of control gate electrodes having a strip shape extending substantially parallel to the major surface of the substrate, the blocking dielectric comprising a plurality of blocking dielectric segments, a plurality of discrete charge storage segments, and a tunnel dielectric located between each one of the plurality of the discrete charge storage segments and the semiconductor channel.
1. A monolithic three dimensional NAND string, comprising:
a semiconductor channel located over a substrate, the semiconductor channel having a U-shaped side cross section, wherein two wing portions of the U-shaped semiconductor channel which extend substantially perpendicular to a major surface of the substrate are connected by a connecting portion which extends substantially parallel to the major surface of the substrate;
an insulating fill located over the connecting portion and separating two wing portions of the U-shaped semiconductor channel;
a plurality control gate electrodes extending substantially parallel to the major surface of the substrate, wherein the plurality of control gate electrodes comprise at least a first control gate electrode located in a first device level and a second control gate electrode located in a second device level located over the substrate and below the first device level;
a blocking dielectric is located in contact with the plurality of control gate electrodes;
a charge storage material; and
a tunneling dielectric located between the charge storage material and the semiconductor channel.
2. The monolithic three dimensional NAND string of claim 1 , wherein the blocking dielectric comprises a plurality of blocking dielectric segments having a clam shape and wherein the charge storage material is located at least partially in openings the clam-shaped blocking dielectric segments.
3. The monolithic three dimensional NAND string of claim 1 , wherein the charge storage material comprises a plurality of floating gates.
4. The monolithic three dimensional NAND string of claim 1 , wherein the charge storage material comprises a charge storage dielectric.
5. The monolithic three dimensional NAND string of claim 1 , further comprising one of a source or drain electrode contacts the first wing portion of the semiconductor channel from above, and another one of a source or drain electrode which contacts the second wing portion of the semiconductor channel from above.
6. The monolithic three dimensional NAND string of claim 5 , further comprising a body contact electrode which contacts the connecting portion of the semiconductor channel from below.
7. A monolithic, three dimensional array of memory devices located over a silicon substrate, comprising an array of vertically oriented NAND strings in which at least one memory cell in a first device level of the array is located over another memory cell in a second device level, wherein at least one vertically oriented NAND string of the array of vertically oriented NAND strings comprises:
a semiconductor channel located over the silicon substrate, the semiconductor channel having a U-shaped side cross section, wherein two wing portions of the U-shaped semiconductor channel which extend substantially perpendicular to a major surface of the silicon substrate are connected by a connecting portion which extends substantially parallel to the major surface of the silicon substrate;
an insulating fill located over the connecting portion and separating two wing portions of the U-shaped semiconductor channel;
a plurality control gate electrodes extending substantially parallel to the major surface of the silicon substrate, wherein the plurality of control gate electrodes comprise at least a first control gate electrode located in a first device level and a second control gate electrode located in a second device level located over the silicon substrate and below the first device level;
a blocking dielectric is located in contact with the plurality of control gate electrodes;
a charge storage material;
a tunneling dielectric located between the charge storage material and the semiconductor channel; and
an integrated circuit comprising a driver circuit for the memory array located on the silicon substrate.
8. The monolithic three dimensional NAND string of claim 7 , wherein the blocking dielectric of the at least one vertically oriented NAND string comprises a plurality of blocking dielectric segments having a clam shape and wherein the charge storage material of the at least one vertically oriented NAND string is located at least partially in openings the clam-shaped blocking dielectric segments.
9. The monolithic three dimensional NAND string of claim 7 , wherein the charge storage material of the at least one vertically oriented NAND string comprises a plurality of floating gates.
10. The monolithic three dimensional NAND string of claim 7 , wherein the charge storage material of the at least one vertically oriented NAND string comprises a charge storage dielectric.
11. The monolithic three dimensional NAND string of claim 7 , further comprising one of a source or drain electrode contacts the first wing portion of the semiconductor channel of the at least one vertically oriented NAND string from above, and another one of a source or drain electrode which contacts the second wing portion of the semiconductor channel of the at least one vertically oriented NAND string from above.
12. The monolithic three dimensional NAND string of claim 11 , further comprising a body contact electrode which contacts the connecting portion of the semiconductor channel of the at least one vertically oriented NAND string from below.