Slurry for chemical mechanical polishing of cobalt

1. A chemical-mechanical polishing composition comprising:

(a) about 0.1 wt. % to about 13 wt. % of an abrasive comprising alumina particles, silica particles, or a combination thereof,

(b) about 0.05 wt. % to about 5 wt. % of a rate accelerator comprising a phosphonic acid, an N-heterocyclic compound, or a combination thereof,

(c) a corrosion inhibitor comprising an amphoteric surfactant, a sulfonate, a fatty acid amino acid, an amide, or a combination thereof,

(d) about 0.1 wt. % to about 5 wt. % of an oxidizing agent, and

(e) an aqueous carrier, wherein the polishing composition further comprises a secondary rate accelerator comprising a phosphate salt, a borate salt, or a combination thereof, at a concentration of about 0.1 wt. % to about 1 wt. %.

2. The chemical-mechanical polishing composition of claim 1 , wherein the abrasive comprises alumina particles, wherein the alumina particles are alpha alumina particles, and wherein at least a portion of the surface of the alpha alumina particles is coated with a negatively-charged polymer or copolymer.

3. The chemical-mechanical polishing composition of claim 1 , wherein the abrasive comprises silica particles, and wherein the silica particles are colloidal silica particles.

4. The chemical-mechanical polishing composition of claim 1 , wherein the abrasive is present in the polishing composition at a concentration of about 0.3 wt. % to about 4 wt. %.

5. The chemical-mechanical polishing composition of claim 1 , wherein the rate accelerator is present in the polishing composition at a concentration of about 0.2 wt. % to about 1 wt. %.

6. The chemical-mechanical polishing composition of claim 1 , wherein the rate accelerator comprises a phosphonic acid.

7. The chemical-mechanical polishing composition of claim 6 , wherein the phosphonic acid is an amino tri(methylene phosphonic acid).

8. The chemical-mechanical polishing composition of claim 1 , wherein the rate accelerator comprises an N-heterocyclic compound.

9. The chemical-mechanical polishing composition of claim 8 , wherein the N-heterocyclic compound is picolinic acid, L-histidine, 2-mercapto-1-methylimidazole, or imidazole.

10. The chemical-mechanical polishing composition of claim 1 , wherein the corrosion inhibitor is present in the polishing composition at a concentration of about 0.001 wt. % to about 0.25 wt. %.

11. The chemical-mechanical polishing composition of claim 1 , wherein the corrosion inhibitor is a fatty acid amino acid.

12. The chemical-mechanical polishing composition of claim 11 , wherein the fatty acid amino acid is sodium lauroyl sarcosinate, sodium cocoyl alaninate, cocoyl glutamate, cocoyl sarcosinate, or myristoyl sarcosinate.

13. The chemical-mechanical polishing composition of claim 1 , wherein the corrosion inhibitor is a sodium C 14-17 sec-alkyl sulfonate.

14. The chemical-mechanical polishing composition of claim 1 , wherein the corrosion inhibitor is a cocoyl diethanolamide.

15. The chemical-mechanical polishing composition of claim 1 , wherein the polishing composition further comprises an ethylene oxide/propylene oxide block copolymer.

16. The chemical-mechanical polishing composition of claim 15 , wherein the ethylene oxide/propylene oxide block copolymer is present in the polishing composition at a concentration of about 0.005 wt. % to about 0.1 wt. %.

17. The chemical-mechanical polishing composition of claim 1 , wherein the polishing composition further comprises polyacrylic acid.

18. The chemical-mechanical polishing composition of claim 1 , wherein the pH of the polishing composition is about 4 to about 7.

19. The chemical-mechanical polishing composition of claim 1 , wherein the pH of the polishing composition is about 8 to about 11.