Wafer level package utilizing molded interposer
A molded interposer includes a layer of first molding compound having a first side and a second side opposite to the first side; a first redistribution layer (RDL) structure disposed on the first side; a second redistribution layer (RDL) structure disposed on the second side; a plurality of metal vias embedded in the layer of first molding compound for electrically connecting the first RDL structure with the second RDL structure; and a passive device embedded in the layer of first molding compound.
1. A semiconductor package, comprising:
a molded interposer, comprising:
a layer of first molding compound having a first side and a second side opposite to the first side;
a first redistribution layer (RDL) structure disposed on the first side;
a second redistribution layer (RDL) structure disposed on the second side;
a plurality of metal vias embedded in the layer of first molding compound electrically connecting the first RDL structure with the second RDL structure; and
passive devices, each passive device comprising a first side facing the first RDL structure and an opposite second side facing the second RDL structure, each passive device completely embedded in and completely surrounded by the layer of first molding compound, wherein each passive device is electrically connected to the first RDL structure through a plurality of connecting elements extending directly, vertically between the first RDL structure and the first side of each respective passive device, wherein the plurality of connecting elements are embedded in the layer of first molding compound and surrounded by the layer of first molding compound;
semiconductor dice mounted on the first RDL structure and electrically connected thereto on a side of the first RDL structure opposite the passive device, each semiconductor die of the semiconductor dice being electrically connected to, and having a footprint covering, a corresponding one of the passive devices by a direct, vertical connection utilizing the plurality of connecting elements to form a face-to-face connection between each semiconductor die and the corresponding one of the passive devices; and
a plurality of solder balls mounted on the second RDL structure.
2. The semiconductor package of claim 1 , further comprising:
a dummy metal via embedded in the layer of the first molding compound and extending between the first RDL structure and the second RDL structure, the dummy metal via being electrically isolated from signals and positioned for at least one of stress relief or warpage control of the semiconductor package.
3. The semiconductor package of claim 1 , wherein the first RDL structure comprises at least one first dielectric layer and at least one first metal layer.
4. The semiconductor package of claim 3 , wherein the at least one first dielectric layer comprises an organic material or an inorganic material.
5. The semiconductor package of claim 4 , wherein the organic material comprises polyimide.
6. The semiconductor package of claim 4 , wherein the inorganic material comprises silicon nitride or silicon oxide.
7. The semiconductor package of claim 3 , wherein the at least one first dielectric layer is in direct contact with the layer of first molding compound.
8. The semiconductor package of claim 1 , wherein the second RDL structure comprises a second dielectric layer and a second metal layer.
9. The semiconductor package of claim 8 , further comprising a solder mask on the second RDL structure.
10. The semiconductor package of claim 1 , wherein the layer of first molding compound has a thickness that is thicker than a thickness of the passive device.
11. The semiconductor package of claim 1 , wherein the at least one semiconductor die is encapsulated by a layer of second molding compound on the side of the first RDL structure opposite the passive device.
12. The semiconductor package of claim 11 , wherein the first molding compound and the layer of second molding compound have different compositions.