Composition and method for polishing silicon carbide
View Patent ↗The invention provides a chemical-mechanical polishing composition comprising (a) silica particles, (b) a polymer comprising sulfonic acid monomeric units, (c) optionally, a buffering agent, and (d) water, wherein the polishing composition has a pH of about 2 to about 5. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate comprises silicon carbide and silicon nitride.
1. A method of chemically mechanically polishing a substrate comprising:
(i) providing a substrate, wherein the substrate comprises a silicon carbide layer on a surface of the substrate;
(ii) providing a polishing pad;
(iii) providing a polishing composition comprising:
(a) silica particles,
(b) a polymer comprising sulfonic acid monomeric units selected from polystyrenesulfonic acid, poly(2-acrylamido-2-methyl-1-propanesulfonic acid), and poly(styrenesulfonic acid-co-maleic acid), and has an average molecular weight of about 75,000 g/mole to about 200,000 g/mole, and
(c) water,
wherein the polishing composition has a pH of about 2 to about 5;
(iv) contacting the substrate with the polishing pad and the polishing composition; and
(v) moving the polishing pad and the polishing composition relative to the substrate to abrade at least a portion of the silicon carbide layer on a surface of the substrate to polish the substrate.
2. The method of claim 1 , wherein the silica particles comprise aluminum ions, and wherein the aluminum ions are uniformly distributed within the silica particles.
3. The method of claim 1 , wherein the silica particles have an average particle size of about 40 nm to about 60 nm.
4. The method of claim 1 , wherein the polymer comprising sulfonic acid monomeric units is polystyrenesulfonic acid.
5. The method of claim 1 , wherein the polishing composition further comprises an oxidizing agent.
6. The method of claim 1 , wherein the polishing composition further comprises a buffering agent.
7. The method of claim 1 , wherein the substrate further comprises a silicon nitride layer on a surface of the substrate, and wherein at least a portion of the silicon nitride layer on a surface of the substrate is abraded to polish the substrate, wherein the polishing composition exhibits selectivity for the polishing of the silicon carbide layer over the silicon nitride layer.
8. The method of claim 1 , wherein the substrate further comprises a silicon oxide layer on a surface of the substrate, and wherein at least a portion of the silicon oxide layer on a surface of the substrate is abraded to polish the substrate, wherein the polishing composition exhibits selectivity for the polishing of the silicon carbide layer over the silicon oxide layer.