BGA component masking dam and a method of manufacturing with the BGA component masking dam
The proposed masking dam protects ball grid array integrated circuit components from conformal coating overflow, preventing joint breakage and thermal mismatch. The masking dam includes a frame with an integrated seal, a cover, and a fastening mechanism. The frame is sealed to a circuit board surround a component, the cover is attached to the frame, and the masking dam is secured to protect the component.
1. A masking dam comprising:
a removable cover configured to protect a component; and
a frame comprising:
an integrated seal embedded in the frame, the integrated seal configured to sealingly engage the removable cover and a circuit board, wherein the integrated seal resides in a groove on the frame;
a mounting feature configured to attach the frame to the circuit board; and
a securing feature configured to attach the frame to the removable cover;
wherein, the frame and the integrated seal are configured to tolerate up to 260 degrees Celsius and the masking dam prevents a conformal coating from flowing underneath the component and bridging between the component and the circuit board when the conformal coating is applied during a circuit board manufacturing process, thereby preventing a coefficient of thermal expansion mismatch between the component and the circuit board and protecting solder joints connecting the component to the circuit board; and
wherein, the removable cover is removed after the conformal coating is applied during the circuit board manufacturing process to permit a heat sink to be attached to a top surface of the component.
2. The masking dam of claim 1 , wherein the securing feature comprises a second seal between the frame and the removable cover.
3. The masking dam of claim 1 , wherein the securing feature comprises a lip feature configured to lock the removable cover onto the frame.
4. The masking dam of claim 1 , wherein the removable cover comprises a feature configured to hold the removable cover down on the frame and the circuit board.
5. The masking dam of claim 1 , wherein the removable cover is made of a material selected from a group consisting of aluminum, carbon fiber, ceramic, metal filament mixes, fiberglass, FR4, nylon 6-6, PBT polyester, polyphenylene sulfide, polyetherimide, liquid-crystal polymers, and combinations thereof.
6. The masking dam of claim 1 , wherein the frame is made of a material selected from a group consisting of aluminum, carbon fiber, ceramic, metal filament mixes, nylon 6-6, PBT polyester, polyphenylene sulfide, polyetherimide, liquid-crystal polymers, and combinations thereof.
7. The masking dam of claim 1 , wherein a height of the frame is less than a height of the component such that the component is heat sunk with a top plane of the component.
8. The masking dam of claim 1 , wherein the frame comprises a slot of the groove where the integrated seal resides.
9. The masking dam of claim 1 , further comprising a second seal between the frame and the removable cover.
10. The masking dam of claim 1 , wherein the masking dam has impedances of at least 1 mega ohm to 10 mega ohms.
11. The masking dam of claim 1 , wherein the mounting feature is one or more holes configured to receive fasteners.
12. A method of protecting a component on a circuit board comprising:
sealing a frame to the circuit board surrounding the component with an integrated seal embedded in the frame, wherein the frame and the integrated seal are configured to tolerate up to 260 degrees Celsius and the integrated seal resides in a groove on the frame;
placing a cover onto the frame above the component opposite the circuit board; and
securing the cover to the circuit board with an attachment mechanism wherein the frame, the cover, and the integrated seal are components of a masking dam that prevent a conformal coating from flowing underneath the component and bridging between the component and the circuit board when the conformal coating is applied during a circuit board manufacturing process, thereby preventing a coefficient of thermal expansion mismatch between the component and the circuit board and protecting solder joints connecting the component to the circuit board;
removing the cover after the conformal coating is applied during the circuit board manufacturing process; and
attaching a heat sink to a top surface of the component.
13. The method of claim 12 , further comprising sealing the cover to the frame with a second seal.
14. The method of claim 12 , further comprising locking the cover to the frame with a lip feature on the cover.
15. The method of claim 12 , wherein sealing the frame to the circuit board comprises aligning the frame with the circuit board in a plane such that the frame and the circuit board are co-planar.
16. The method of claim 12 , wherein securing the cover to the circuit board is done with one or more fasteners.
17. The method of claim 12 , wherein the masking dam has an impedance of at least 1 mega ohm to 10 mega ohms.