Silicon-on-insulator die support structures and related methods
Implementations of a silicon-in-insulator (SOI) semiconductor die may include a first largest planar surface, a second largest planar surface and a thickness between the first largest planar surface and the second largest planar surface; and one of a permanent die support structure, a temporary die support structure, or any combination thereof coupled to one of the first largest planar surface, the second largest planar surface, the thickness, or any combination thereof. The first largest planar surface, the second largest planar surface, and the thickness may be included through a silicon layer coupled to a insulative layer.
1. A method of making silicon-on-insulator (SOI) die, the method comprising:
forming a ring around a perimeter of a second side of a silicon substrate through backgrinding the second side of the substrate to a desired substrate thickness;
depositing an insulative layer onto the second side of the silicon substrate after backgrinding;
forming one of a permanent die support structure, a temporary die support structure, or any combination thereof directly on the insulative layer deposited on the second side of the substrate;
removing the ring around the perimeter of the second side of the silicon substrate; and
singulating the silicon substrate into a plurality of SOI die.
2. The method of claim 1 , further comprising forming a plurality of semiconductor devices on the first side of the silicon substrate, the first side opposite the second side of the silicon substrate.
3. The method of claim 1 , further comprising stress relief etching the second side of the silicon substrate.
4. The method of claim 1 , wherein the insulative layer is deposited using one of co-evaporation and co-sputtering.
5. The method of claim 4 , further comprising dissipating heat through a heat dissipation device during deposition of the insulative layer.
6. The method of claim 1 , wherein the method does not comprise implanting hydrogen.
7. A method of making silicon-on-insulator (SOI) die, the method comprising:
thinning a second side of a silicon substrate to a desired thickness;
depositing a conductive layer onto the second side of the silicon substrate;
depositing an insulative layer over the conductive layer;
forming one of a permanent die support structure, a temporary die support structure, or any combination thereof on the insulative layer; and
singulating the silicon substrate into a plurality of SOI die.
8. The method of claim 7 , further comprising patterning the conductive layer.
9. The method of claim 7 , wherein the conductive layer comprises titanium.
10. The method of claim 7 , wherein the insulative layer is deposited using one of co-evaporation and co-sputtering.