Method to form a 3D semiconductor device and structure
A method to form a 3D semiconductor device, the method including: providing a first level including first circuits, the first circuits including first transistors and first interconnection; preparing a second level including a silicon layer; performing growth of an epitaxial layer on top of the silicon layer, the epitaxial layer including non-silicon atoms; forming second circuits over the second level, the second circuits including second transistors and second interconnection; transferring and then bonding the second level on top of the first level; and then thinning the second level to a thickness of less than ten microns, where the bonding includes oxide to oxide bonds.
1. A method to form a 3D semiconductor device, the method comprising:
providing a first level comprising first circuits, said first circuits comprising first transistors and first interconnection;
preparing a second level comprising a silicon layer;
performing growth of an epitaxial layer on top of said silicon layer, said epitaxial layer comprising non-silicon atoms;
forming second circuits over said second level, said second circuits comprising second transistors and second interconnection;
transferring and then bonding said second level on top of said first level; and then
thinning said second level to a thickness of less than ten microns,
wherein said bonding comprises oxide to oxide bonds.
2. The method according to claim 1 ,
wherein said bonding comprises metal to metal bonds.
3. The method according to claim 1 , further comprising:
forming at least one shielding metal layer designed to protect against electromagnetic fields (EMF) generated by said second circuits and/or by said first circuits.
4. The method according to claim 1 , further comprising:
constructing a Global Power distribution network,
wherein said Global Power distribution network distributes power to at least one Local Power distribution network.
5. The method according to claim 1 ,
wherein a first operating voltage of said first circuits differs by at least 15% from a second operating voltage of said second circuits.
6. The method according to claim 1 , further comprising:
forming connection pads at said first level bottom,
wherein said connection pads provide connections for external devices.
7. The method according to claim 1 ,
wherein said thinning of said second level is to a thickness of less than two microns.
8. A method to form a 3D semiconductor device, the method comprising:
providing a first level comprising first circuits, said first circuits comprising first transistors and first interconnection;
preparing a second level comprising a silicon layer;
performing growth of an epitaxial layer on top of said silicon layer, said epitaxial layer comprising non-silicon atoms;
forming second circuits over said second level, said second circuits comprising second transistors and second interconnection;
transferring and then bonding said second level on top of said first level; and then
thinning said second level to a thickness of less than ten microns;
wherein said device comprises an upper most semiconductor level, and
wherein said upper most semiconductor level comprises Input/Output (“I/O”) circuits designed to connect said device to external devices.
9. The method according to claim 8 ,
wherein said bonding is hybrid bonding.
10. The method according to claim 8 , further comprising:
forming at least one shielding metal layer designed to protect against electromagnetic fields (EMF) generated by said second circuits and/or by said first circuits.
11. The method according to claim 8 , and further comprising:
constructing a Global Power distribution network,
wherein said Global Power distribution network distributes power to at least one Local Power distribution network.
12. The method according to claim 8 ,
wherein a first operating voltage of said first circuit differs by at least 15% from a second operating voltage of said second circuit.
13. The method according to claim 8 , further comprising:
forming connection pads at said first level bottom,
wherein said connection pads provide connections for external devices.
14. The method according to claim 8 ,
wherein said thinning of said second level is to a thickness of less than two microns.
15. A method to form a 3D semiconductor device, the method comprising:
providing a first level comprising first circuits, said first circuits comprising first transistors and first interconnection;
preparing a second level comprising a silicon layer;
performing growth of an epitaxial layer on top of said silicon layer, said epitaxial layer comprising non-silicon atoms;
forming second circuits over said second level, said second circuits comprising second transistors and second interconnection;
transferring and then bonding said second level on top of said first level; and then
thinning said second level to a thickness of less than ten microns; and
forming heat removal paths designed to remove heat of said second circuit to an external surface of said 3D semiconductor device.
16. The method according to claim 14 ,
wherein said bonding is hybrid bonding.
17. The method according to claim 14 , further comprising:
forming at least one shielding metal layer designed to protect against electromagnetic fields (EMF) generated by said second circuits and/or by said first circuits.
18. The method according to claim 14 , further comprising:
constructing a Global Power distribution network,
wherein said Global Power distribution network distributes power to at least one Local Power distribution network.
19. The method according to claim 14 , further comprising:
forming connection pads at said first level bottom,
wherein said connection pads provide connections for external devices.
20. The method according to claim 14 ,
wherein said thinning of said second level is to a thickness of less than two microns.