IP Library › Granted Patent US 12,520,448
Granted Patent B2
US 12,520,448 · App. 17/531,470 · Granted Jan 6, 2026

Thermal design for rack mount systems including optical communication modules

Inventors: Brett Michael Dunn Sawyer (Pasadena, CA); Ron Zhang (Sunnyvale, CA); Peter James Pupalaikis (Ramsey, NJ); Peter Johannes Winzer (Aberdeen, NJ); Clinton Randy Giles (Watchung, NJ); Guilhem de Valicourt (Jersey City, NJ)
Assignee: Nubis Communications, Inc.
H05K7/1492H05K7/1425H05K7/1487H05K7/1489H05K7/20181H05K7/20727
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Quick Facts
Patent No.
US 12,520,448
App. No.
17/531,470
Filed
Nov 19, 2021
Granted
Jan 6, 2026
Kind
B2
Art Unit
3763
USPC
165/104.33
Abstract

An apparatus includes a rackmount device, in which the rackmount device includes a housing configured to be installed in a server rack, in which the housing has a width in a range from 16 to 20 inches and a height in a range from 1 to 12 inches, the housing includes a front panel, a rear panel, and a bottom surface. The rackmount device includes a first circuit board or substrate having a first surface that defines a length and a width of the first circuit board or substrate, in which the first circuit board or substrate is positioned relative to the housing such that the first surface of the first circuit board or substrate is at an angle relative to the bottom surface of the housing, and the angle is in a range from 45° to 90°. At least one of (i) the front panel of the housing is formed at least in part by the first circuit board or substrate, (ii) the first circuit board or substrate is attached to the front panel of the housing, or (iii) the first circuit board or substrate is substantially parallel to the front panel of the housing. The rackmount device includes at least one data processor electrically coupled to the first circuit board or substrate and configured to process data; and at least one optical/electrical communication interface coupled to the first circuit board or substrate and configured to convert received optical signals to electrical signals that are provide to the at least one data processor. The rackmount device includes at least one of (i) at least one inlet fan attached to the front panel of the housing, or (ii) at least one fan positioned near the front panel in which at least a portion of a fan blade of the at least one fan is within a first distance from the front panel for at least some time period during operation of the at least one fan, and the first distance is less than one-fourth of a second distance between the front panel and the rear panel.

Claims (84)

1 . An apparatus comprising:

a rackmount device comprising:

a housing configured to be installed in a server rack, in which the housing includes a front panel, a rear panel, a bottom panel, a top panel, and side panels, in which a plurality of optical connectors are mounted on the front panel, each optical connector is configured to be optically coupled to an optical fiber interconnection cable; and

an active airflow control module comprising at least one inlet fan and configured to actively control airflow in a first zone within 12 inches behind the front panel inside the housing to optimize heat dissipation from a data processor positioned in the first zone, wherein at least one of

(i) the front panel comprises a circuit board, and the data processor is mounted on the circuit board,

(ii) a circuit board is attached to the front panel, and the data processor is mounted on the circuit board, wherein the angle between a main surface of the circuit board and a main surface of the front panel is in a range of −5° to 5°, or

(iii) a circuit board is positioned behind the front panel and oriented substantially parallel to the front panel, wherein the angle between a main surface of the circuit board and a main surface of the front panel is in a range of −5° to 5°, and the data processor is mounted on the circuit board;

wherein a first surface of the circuit board faces a front direction relative to the housing, a second surface of the circuit board faces a rear direction relative to the housing,

at least one co-packaged optical module is coupled to the first surface of the circuit board, and

the data processor is electrically coupled to the second surface of the circuit board.

2 . The apparatus of claim 1 in which the front panel comprises the circuit board, and the data processor is mounted on the circuit board.

3 . The apparatus of claim 2 in which the data processor is mounted on a backside of the circuit board, a plurality of photonic integrated circuits are electrically coupled to a front side of the circuit board, and each photonic integrated circuit is optically coupled to a corresponding optical connector.

4 . The apparatus of claim 2 in which the active airflow control module comprises one or more inlet fans installed in the first zone in which the data processor is positioned.

5 . The apparatus of claim 4 in which each inlet fan is oriented such that a rotational axis of the inlet fan is at an angle θ relative to a front-to-rear direction, the angle being measured on a plane parallel to the bottom panel, and θ≤45°.

6 . The apparatus of claim 5 in which θ≤25°.

7 . The apparatus of claim 6 in which θ≤5°.

8 . The apparatus of claim 4 in which each inlet fan is oriented such that a rotational axis of the inlet fan is at an angle θ relative to a plane of the front panel, the angle being measured on a plane parallel to the bottom panel, and θ≤45°.

9 . The apparatus of claim 8 in which θ≤25°.

10 . The apparatus of claim 9 in which θ≤5°.

11 . The apparatus of claim 4 , comprising a heat dissipating device thermally coupled to the data processor, the heat dissipating device comprising at least one surface that dissipates heat during operation of the data processor.

12 . The apparatus of claim 11 in which the heat dissipating device is positioned within the first zone.

13 . The apparatus of claim 12 , comprising a second heat dissipating device that is positioned behind the first zone, in which the second heat dissipating device is also thermally coupled to the data processor.

14 . The apparatus of claim 13 in which the second heat dissipating device has a heat dissipating surface area that is larger than the heat dissipating surface area of the first heat dissipating device.

15 . The apparatus of claim 11 , comprising one or more air louvers, in which the one or more inlet fans and the one or more air louvers direct air toward the heat dissipating device, and the design of the one or more inlet fans and the one or more air louvers is configured to enhance heat dissipation.

16 . The apparatus of claim 11 in which the one or more inlet fans generate one or more positive air pressure regions at at least one of a first region to the left of the heat dissipating device, or a second region to the right of the heat dissipating device.

17 . The apparatus of claim 11 , wherein the at least one inlet fan of the active airflow control module is installed in the first zone in which the data processor is positioned,

wherein the one or more inlet fans generate one or more positive air pressure regions at at least one of a first region to the left of the heat dissipating device, or a second region to the right of the heat dissipating device,

wherein the apparatus comprises one or more outlet fans installed in a second zone within 12 inches of the rear panel, in which the one or more outlet fans generate one or more negative air pressure regions behind the heat dissipating device.

18 . The apparatus of claim 17 , comprising one or more air louvers that guide the air to flow from the one or more positive air pressure regions to the one or more negative air pressure regions along an airflow path that passes through the heat dissipating device.

19 . The apparatus of claim 18 , in which the one or more inlet fans and the one or more air louvers are configured to guide the air in a way such that the airflow path passes the heat dissipating device in a direction substantially parallel to the front panel for more than half the length of the heat dissipating device, and the angle between the direction of the airflow path and a main surface of the front panel is in a range of −5° to 5°.

20 . The apparatus of claim 1 , comprising the circuit board that is attached to the front panel, and the data processor is mounted on the circuit board.

21 . The apparatus of claim 1 , in which the first zone is within 10 inches behind the front panel.

22 . The apparatus of claim 21 , in which the first zone is within 8 inches behind the front panel.

23 . The apparatus of claim 1 , comprising the circuit board that is positioned behind the front panel and oriented substantially parallel to the front panel, and the data processor is mounted on the circuit board.

24 . The apparatus of claim 1 wherein a main surface of the data processor is oriented at an angle with respect to a main surface of the front panel, and the angle is in a range of −45° to 45°.

25 . The apparatus of claim 24 wherein the angle is in a range from −5° to 5°.

26 . The apparatus of claim 1 , comprising the data processor, wherein the data processor comprises at least one of a network switch, a central processor unit, a graphics processor unit, a tensor processing unit, a neural network processor, an artificial intelligence accelerator, a digital signal processor, a microcontroller, an application specific integrated circuit (ASIC), or a data storage device.

27 . The apparatus of claim 1 wherein the data processor comprises an integrated circuit or a system on a chip (SoC) that includes at least one million transistors.

28 . The apparatus of claim 1 , comprising the circuit board, the data processor, and a plurality of photonic integrated circuits that are electrically coupled to the circuit board, wherein each photonic integrated circuit is optically coupled to a corresponding optical connector.

29 . The apparatus of claim 28 wherein the data processor have circuitry that is configured to be capable of processing data from the photonic integrated circuits at a rate of at least 25 gigabits per second.

30 . The apparatus of claim 28 wherein the data processor and the photonic integrated circuits have active electrical and optical components that are configured to consume at least 100 watts of electric power continuously for at least ten minutes during operation.

31 . The apparatus of claim 30 wherein the data processor and the photonic integrated circuits have active electrical and optical components that are configured to consume at least 600 watts of electric power continuously for at least ten minutes during operation.

32 . The apparatus of claim 31 wherein the active airflow control module is configured to operate the at least one inlet fan at a speed to actively control the airflow in the first zone so as to remove heat generated by the data processor and the photonic integrated circuits so as to maintain a temperature of the data processor and the photonic integrated circuits to be not more than 160° F. when ambient temperature outside of the housing is in a range from 62° F. to 82° F.

33 . The apparatus of claim 30 wherein the apparatus active airflow control module is configured to operate the at least one inlet fan at a speed to actively control the airflow in the first zone so as to remove heat generated by the data processor and the photonic integrated circuits so as to maintain a temperature of the data processor and the photonic integrated circuits to be not more than 160° F. when ambient temperature outside of the housing is in a range from 62° F. to 82° F.

34 . The apparatus of claim 30 , comprising a plurality of laser modules configured to provide a plurality of light sources to the photonic integrated circuits,

wherein the data processor, the photonic integrated circuits, and the laser modules have active electrical and optical components that are configured to consume at least 200 watts of electric power continuously for at least ten minutes during operation.

35 . The apparatus of claim 34 in which the at least one data processor, the photonic integrated circuits, and the at least one laser module have active electrical and optical components that are configured to consume at least 700 watts of electric power continuously for at least ten minutes during operation.

36 . The apparatus of claim 35 wherein the active airflow control module is configured to operate the at least one inlet fan at a speed to actively control the airflow in the first zone to remove heat generated by the data processor, the photonic integrated circuits, and the laser modules so as to maintain a temperature of the data processor and the photonic integrated circuits to be not more than 160° F. when ambient temperature outside of the housing is in a range from 62° F. to 82° F.

37 . The apparatus of claim 34 wherein the active airflow control module is configured to operate the at least one inlet fan at a speed to actively control the airflow in the first zone to remove heat generated by the data processor, the photonic integrated circuits, and the laser modules so as to maintain a temperature of the data processor and the photonic integrated circuits to be not more than 160° F. when ambient temperature outside of the housing is in a range from 62° F. to 82° F.

38 . The apparatus of claim 1 in which the at least one co-packaged optical module comprises a first optical connector part that is configured to be removably coupled to a second optical connector part that is attached to a first fiber cable that comprises an array of optical fibers.

39 . The apparatus of claim 38 wherein the at least one co-packaged optical module comprises a photonic integrated circuit that is optically coupled to the first optical connector part, and configured to receive input optical signals from the first optical connector part and generate input electrical signals based on the input optical signals.

40 . The apparatus of claim 39 wherein at least a portion of the input electrical signals generated by the photonic integrated circuit are transmitted to the data processor.

41 . The apparatus of claim 39 wherein the photonic integrated circuit is configured to generate a plurality of first serial electrical signals based on the received optical signals, in which each first serial electrical signal is generated based on one of the channels of first optical signals;

wherein the at least one co-packaged optical module comprises:

a first serializers/deserializers module comprising multiple serializer units and deserializer units, the first serializers/deserializers module is configured to generate a plurality of sets of first parallel electrical signals based on the plurality of first serial electrical signals, and condition the electrical signals, and each set of first parallel electrical signals is generated based on a corresponding first serial electrical signal; and

a second serializers/deserializers module comprising multiple serializer units and deserializer units, in which the second serializers/deserializers module is configured to generate a plurality of second serial electrical signals based on the plurality of sets of first parallel electrical signals, and each second serial electrical signal is generated based on a corresponding set of first parallel electrical signals.

42 . The apparatus of claim 38 in which the fiber cable comprises at least 10 cores of optical fibers, and the first optical connector part is configured to couple at least 10 channels of optical signals to the photonic integrated circuit.

43 . The apparatus of claim 42 in which the fiber cable comprises at least 1000 cores of optical fibers, and the first optical connector part is configured to couple at least 1000 channels of optical signals to the photonic integrated circuit.

44 . The apparatus of claim 1 in which the at least one co-packaged optical module is electrically coupled to the circuit board using electrical contacts that comprise at least one of spring-loaded elements, compression interposers, or land-grid arrays.

45 . The apparatus of claim 1 wherein the active airflow control module comprises a first inlet fan and a second inlet fan, the first inlet fan is positioned on a left side of the at least one co-packaged optical module, and the second inlet fan is positioned on a right side of the at least one co-packaged optical module.

46 . The apparatus of claim 1 wherein the data processor is mounted on a substrate, and the substrate is electrically coupled to the circuit board.

47 . The apparatus of claim 1 wherein the at least one co-packaged optical module comprises a photonic integrated circuit mounted on a substrate, and the substrate is electrically coupled to the circuit board.

48 . The apparatus of claim 1 wherein the housing comprises an enclosure for the rackmount device, and the rackmount device has an n rack unit form factor, and n is an integer in a range from 1 to 8.

49 . An apparatus comprising:

a rackmount device comprising:

a housing configured to be installed in a server rack, in which the housing includes a front panel, a rear panel, a bottom panel, a top panel, and side panels, in which a plurality of optical connectors are mounted on the front panel, each optical connector is configured to be optically coupled to an optical fiber interconnection cable; and

an active airflow control module configured to actively control airflow in a first zone within 12 inches behind the front panel inside the housing to optimize heat dissipation from a data processor positioned in the first zone, wherein the active airflow control module comprises one or more inlet fans installed in the first zone in which the data processor is positioned, and each of the one or more inlet fans is oriented such that a rotational axis of the inlet fan is at an angle θ relative to a plane of the front panel, the angle being measured on a plane parallel to the bottom panel, and θ≤45°.

50 . The apparatus of claim 49 wherein θ≤25°.

51 . The apparatus of claim 50 wherein θ≤5°.

52 . The apparatus of claim 49 wherein the front panel comprises a circuit board, and the data processor is mounted on the circuit board.

53 . The apparatus of claim 49 , comprising a circuit board that is attached to the front panel, and the data processor is mounted on the circuit board.

54 . The apparatus of claim 53 wherein the data processor is mounted on a backside of the circuit board that is attached to the front panel, a plurality of photonic integrated circuits are electrically coupled to a front side of the circuit board through openings in the front panel, and each photonic integrated circuit is optically coupled to a corresponding optical connector.

55 . The apparatus of claim 49 wherein the first zone is within 10 inches behind the front panel.

56 . The apparatus of claim 55 wherein the first zone is within 8 inches behind the front panel.

57 . The apparatus of claim 49 , comprising a circuit board that is positioned behind the front panel and oriented substantially parallel to the front panel, wherein the angle between a main surface of the circuit board and a main surface of the front panel is in a range of −5° to 5°, and the data processor is mounted on the circuit board.

58 . The apparatus of claim 49 , comprising the data processor, wherein the data processor comprises at least one of a network switch, a central processor unit, a graphics processor unit, a tensor processing unit, a neural network processor, an artificial intelligence accelerator, a digital signal processor, a microcontroller, an application specific integrated circuit (ASIC), or a data storage device.

59 . An apparatus comprising:

a rackmount device comprising:

a housing configured to be installed in a server rack, in which the housing includes a front panel, a rear panel, a bottom panel, a top panel, and side panels, in which a plurality of optical connectors are mounted on the front panel, each optical connector is configured to be optically coupled to an optical fiber interconnection cable; and

an active airflow control module configured to actively control airflow in a first zone within 12 inches behind the front panel inside the housing to optimize heat dissipation from a data processor positioned in the first zone,

wherein a main surface of the data processor is oriented at an angle with respect to a main surface of the front panel, and the angle is in a range of −45° to 45°.

60 . The apparatus of claim 59 wherein the angle is in a range from −5° to 5°.

61 . The apparatus of claim 60 , comprising a circuit board positioned behind the front panel and oriented substantially parallel to the front panel, wherein the angle between a main surface of the circuit board and a main surface of the front panel is in a range of −5° to 5°, and the data processor is mounted on the circuit board.

62 . The apparatus of claim 59 , comprising the data processor, wherein the data processor comprises at least one of a network switch, a central processor unit, a graphics processor unit, a tensor processing unit, a neural network processor, an artificial intelligence accelerator, a digital signal processor, a microcontroller, an application specific integrated circuit (ASIC), or a data storage device.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 25, 2026
From: NUBIS COMMUNICATIONS, INC.
To: CIENA CORPORATION
Reel/Frame 073895/0948 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 15, 2024
From: DUNN SAWYER, BRETT MICHAEL; ZHANG, RON; PUPALAIKIS, PETER JAMES; WINZER, PETER JOHANNES; GILES, CLINTON RANDY; DE VALICOURT, GUILHEM
To: NUBIS COMMUNICATIONS, INC.
Reel/Frame 066473/0188 →
Continuity (16)
Provisional Application 63272025 · Oct 26, 2021
Provisional Application 63245005 · Sep 16, 2021
Provisional Application 63245011 · Sep 16, 2021
Provisional Application 63225779 · Jul 26, 2021
Provisional Application 63223685 · Jul 20, 2021
Provisional Application 63210437 · Jun 14, 2021
Provisional Application 63208759 · Jun 9, 2021
Provisional Application 63192852 · May 25, 2021
Provisional Application 63178501 · Apr 22, 2021
Provisional Application 63175021 · Apr 14, 2021
Provisional Application 63173253 · Apr 9, 2021
Provisional Application 63159768 · Mar 11, 2021
Provisional Application 63146421 · Feb 5, 2021
Provisional Application 63145368 · Feb 3, 2021
Provisional Application 63116660 · Nov 20, 2020
Related Publication 20220264759A1 · Aug 18, 2022
References Cited (400)
US 4096548A · Misono · 1978 [cited by examiner]
US 5136410A · Heiling et al. · 1992 [cited by applicant]
US 5229925A · Spencer et al. · 1993 [cited by applicant]
US 5375724A · Mazura · 1994 [cited by examiner]
US 6305848B1 · Gregory · 2001 [cited by applicant]
US 6396990B1 · Ehn et al. · 2002 [cited by applicant]
US 6411520B1 · Hauke et al. · 2002 [cited by applicant]
US 6563696B1 · Harris et al. · 2003 [cited by applicant]
US 6675976B2 · Steinman · 2004 [cited by examiner]
US 6769812B1 · Handforth · 2004 [cited by applicant]
US 6822874B1 · Marler · 2004 [cited by applicant]
US 6845184B1 · Yoshimura et al. · 2005 [cited by applicant]
US 6924986B1 · Sardella et al. · 2005 [cited by applicant]
US 7042737B1 · Woolsey et al. · 2006 [cited by applicant]
US 7170749B2 · Hoshino et al. · 2007 [cited by applicant]
US 7180751B1 · Geschke et al. · 2007 [cited by applicant]
US 7187552B1 · Stewart · 2007 [cited by examiner]
US 7239523B1 · Collins et al. · 2007 [cited by applicant]
US 7643292B1 · Chen · 2010 [cited by applicant]
US 7787772B2 · Ota · 2010 [cited by applicant]
US 7813143B2 · Dorenkamp et al. · 2010 [cited by applicant]
US 8047856B2 · Mccolloch · 2011 [cited by applicant]
US 8090230B1 · Hasharoni et al. · 2012 [cited by applicant]
US 8116095B2 · Dorenkamp et al. · 2012 [cited by applicant]
US 8208253B1 · Goergen et al. · 2012 [cited by applicant]
US 8482917B2 · Rose · 2013 [cited by applicant]
US 8488921B2 · Doany et al. · 2013 [cited by applicant]
US 8780551B2 · Farnholtz · 2014 [cited by applicant]
US 8992099B2 · Blackwell et al. · 2015 [cited by applicant]
US 9250649B2 · Shabbir et al. · 2016 [cited by applicant]
US 9301025B2 · Kioski et al. · 2016 [cited by applicant]
US 9366832B2 · Arao et al. · 2016 [cited by applicant]
US 9461768B2 · Kipp · 2016 [cited by applicant]
US 9557478B2 · Doerr et al. · 2017 [cited by applicant]
US 9622388B1 · Van Gaal · 2017 [cited by examiner]
US 9645316B1 · Hasharoni et al. · 2017 [cited by applicant]
US 9722381B1 · Moen et al. · 2017 [cited by applicant]
US 9768881B2 · Georgas et al. · 2017 [cited by applicant]
US 9781546B2 · Barrett et al. · 2017 [cited by applicant]
US 9786641B2 · Budd et al. · 2017 [cited by applicant]
US 9794195B1 · Wilson et al. · 2017 [cited by applicant]
US 9874688B2 · Doerr et al. · 2018 [cited by applicant]
US 9927575B2 · Goodwill et al. · 2018 [cited by applicant]
US 10012811B2 · Rivaud et al. · 2018 [cited by applicant]
US 10018787B1 · Wang · 2018 [cited by applicant]
US 10025043B2 · Vallance et al. · 2018 [cited by applicant]
US 10054749B1 · Wang et al. · 2018 [cited by applicant]
US 10082633B2 · Schaevitz et al. · 2018 [cited by applicant]
US 10135218B2 · Popovic et al. · 2018 [cited by applicant]
US 10135539B2 · Moss et al. · 2018 [cited by applicant]
US 10178798B1 · Christensen · 2019 [cited by examiner]
US 10209464B2 · Pfnuer et al. · 2019 [cited by applicant]
US 10215944B2 · Sedor et al. · 2019 [cited by applicant]
US 10234646B2 · Mack et al. · 2019 [cited by applicant]
US 10271461B2 · Schmidtke · 2019 [cited by applicant]
US 10330875B2 · Fini et al. · 2019 [cited by applicant]
US 10365436B2 · Byrd et al. · 2019 [cited by applicant]
US 10365445B2 · Badihi · 2019 [cited by applicant]
US 10514509B2 · Popovic et al. · 2019 [cited by applicant]
US 10568238B1 · Leung · 2020 [cited by applicant]
US 10582639B1 · Chopra · 2020 [cited by applicant]
US 10615903B2 · Welch · 2020 [cited by applicant]
US 10725245B2 · Leigh et al. · 2020 [cited by applicant]
US 10739828B2 · Reed et al. · 2020 [cited by applicant]
US 10750250B1 · Parker et al. · 2020 [cited by applicant]
US 10866376B1 · Ghiasi · 2020 [cited by applicant]
US 10905025B1 · Thomas et al. · 2021 [cited by applicant]
US 11005572B1 · Chiang et al. · 2021 [cited by applicant]
US 11051422B2 · Norton et al. · 2021 [cited by applicant]
US 11058034B2 · Leung · 2021 [cited by applicant]
US 11079559B2 · Leclair et al. · 2021 [cited by applicant]
US 11107770B1 · Ramalingam et al. · 2021 [cited by applicant]
US 11121776B2 · Aboagye · 2021 [cited by applicant]
US 11153670B1 · Winzer · 2021 [cited by applicant]
US 11165509B1 · Nagarajan et al. · 2021 [cited by applicant]
US 11190172B1 · Raj et al. · 2021 [cited by applicant]
US 11194109B2 · Winzer · 2021 [cited by applicant]
US 11276955B2 · Rivaud et al. · 2022 [cited by applicant]
US 11287585B2 · Winzer · 2022 [cited by applicant]
US 11381891B2 · Leigh · 2022 [cited by applicant]
US 11385426B2 · Bechtolsheim et al. · 2022 [cited by applicant]
US 11411643B1 · Chaouch · 2022 [cited by applicant]
US 11477908B2 · Jochim et al. · 2022 [cited by applicant]
US 11483943B2 · Leigh et al. · 2022 [cited by applicant]
US 11509399B2 · Paraiso et al. · 2022 [cited by applicant]
US 11510329B2 · Leigh · 2022 [cited by applicant]
US 11521543B2 · Morris et al. · 2022 [cited by applicant]
US 11525967B1 · Bismuto et al. · 2022 [cited by applicant]
US 11543671B2 · Xu et al. · 2023 [cited by applicant]
US 11551636B1 · Buckley et al. · 2023 [cited by applicant]
US 11557875B2 · Kovsh · 2023 [cited by applicant]
US 11573387B2 · Sawyer et al. · 2023 [cited by applicant]
US 11580662B2 · Kimura · 2023 [cited by applicant]
US 11585977B2 · Lambert · 2023 [cited by applicant]
US 11592629B2 · Kawamura et al. · 2023 [cited by applicant]
US 11596073B2 · Zhang et al. · 2023 [cited by applicant]
US 11602086B2 · Crisp et al. · 2023 [cited by applicant]
US 11604347B2 · Axelrod et al. · 2023 [cited by applicant]
US 11609873B2 · Cannata et al. · 2023 [cited by applicant]
US 11612079B2 · Nagarajan et al. · 2023 [cited by applicant]
US 11615044B2 · Cannata et al. · 2023 [cited by applicant]
US 11620805B2 · Carminati et al. · 2023 [cited by applicant]
US 11627682B2 · Murakami · 2023 [cited by applicant]
US 11630261B2 · Xie · 2023 [cited by applicant]
US 11630799B2 · Nagarajan et al. · 2023 [cited by applicant]
US 11632175B2 · Di Mola et al. · 2023 [cited by applicant]
US 11639846B2 · Xian et al. · 2023 [cited by applicant]
US 11644628B1 · Brisebois et al. · 2023 [cited by applicant]
US 11650384B2 · Edwards et al. · 2023 [cited by applicant]
US 11650631B2 · Watamura et al. · 2023 [cited by applicant]
US 11652129B1 · Vincentsen et al. · 2023 [cited by applicant]
US 11657684B2 · Gupta et al. · 2023 [cited by applicant]
US 11662081B2 · Tamma et al. · 2023 [cited by applicant]
US 11665862B2 · Crisp et al. · 2023 [cited by applicant]
US 11665863B2 · Crisp et al. · 2023 [cited by applicant]
US 11668590B2 · Xie · 2023 [cited by applicant]
US 11675114B2 · Teissier et al. · 2023 [cited by applicant]
US 11677478B2 · Nagarajan et al. · 2023 [cited by applicant]
US 11681019B2 · O'Connor et al. · 2023 [cited by applicant]
US 11681209B1 · Sullivan et al. · 2023 [cited by applicant]
US 11681443B1 · Venugopal et al. · 2023 [cited by applicant]
US 11687480B2 · Heyd et al. · 2023 [cited by applicant]
US 11688088B2 · Kimura · 2023 [cited by applicant]
US 11699243B2 · Von Cramon · 2023 [cited by applicant]
US 11710914B2 · Azuma et al. · 2023 [cited by applicant]
US 11716278B1 · Grandhye et al. · 2023 [cited by applicant]
US 11720514B2 · Shah et al. · 2023 [cited by applicant]
US 11727858B2 · Peng et al. · 2023 [cited by applicant]
US 11735560B2 · Nishihara · 2023 [cited by applicant]
US 11736195B2 · Leclair et al. · 2023 [cited by applicant]
US 11754767B1 · Soskind et al. · 2023 [cited by applicant]
US 11757705B2 · Vobbilisetty et al. · 2023 [cited by applicant]
US 11764339B2 · Biebersdorf et al. · 2023 [cited by applicant]
US 11764878B2 · Pezeshki et al. · 2023 [cited by applicant]
US 11778354B2 · Chaouch et al. · 2023 [cited by applicant]
US 11817903B2 · Pleros et al. · 2023 [cited by applicant]
US 11828954B2 · Huang et al. · 2023 [cited by applicant]
US 11836019B2 · Dube et al. · 2023 [cited by applicant]
US 11844186B2 · Mcparland et al. · 2023 [cited by applicant]
US 11853587B2 · Tang et al. · 2023 [cited by applicant]
US 11868279B2 · Long et al. · 2024 [cited by applicant]
US 11895798B2 · Winzer et al. · 2024 [cited by applicant]
US 11988874B2 · Winzer et al. · 2024 [cited by applicant]
US 11997819B2 · Winzer et al. · 2024 [cited by applicant]
US 12004318B2 · Winzer et al. · 2024 [cited by applicant]
US 12019289B2 · Winzer et al. · 2024 [cited by applicant]
US 12029004B2 · Winzer et al. · 2024 [cited by applicant]
US 12055766B2 · Pupalaikis et al. · 2024 [cited by applicant]
US 12066653B2 · Winzer et al. · 2024 [cited by applicant]
US 12101904B2 · Cole et al. · 2024 [cited by applicant]
US 12250024B2 · Winzer et al. · 2025 [cited by applicant]
US 20020003232A1 · Ahn et al. · 2002 [cited by applicant]
US 20020142634A1 · Poplawski et al. · 2002 [cited by applicant]
US 20030030977A1 · Garnett et al. · 2003 [cited by applicant]
US 20030081287A1 · Jannson et al. · 2003 [cited by applicant]
US 20030201462A1 · Pommer et al. · 2003 [cited by applicant]
US 20030211759A1 · Olzak et al. · 2003 [cited by applicant]
US 20040027462A1 · Hing · 2004 [cited by applicant]
US 20040033016A1 · Kropp · 2004 [cited by applicant]
US 20040257766A1 · Rasmussen et al. · 2004 [cited by applicant]
US 20040264838A1 · Uchida et al. · 2004 [cited by applicant]
US 20050025409A1 · Welch et al. · 2005 [cited by applicant]
US 20050083653A1 · Chen · 2005 [cited by applicant]
US 20050111810A1 · Giraud et al. · 2005 [cited by applicant]
US 20050124224A1 · Schunk · 2005 [cited by applicant]
US 20050147117A1 · Pettey et al. · 2005 [cited by applicant]
US 20050224946A1 · Dutta · 2005 [cited by applicant]
US 20060005038A1 · Kitahara et al. · 2006 [cited by applicant]
US 20060062526A1 · Ikeuchi · 2006 [cited by applicant]
US 20060128091A1 · Chidambarrao et al. · 2006 [cited by applicant]
US 20060239605A1 · Palen et al. · 2006 [cited by applicant]
US 20070223865A1 · Lu et al. · 2007 [cited by applicant]
US 20070258683A1 · Rolston et al. · 2007 [cited by applicant]
US 20080055847A1 · Belady et al. · 2008 [cited by applicant]
US 20080181608A1 · Parker et al. · 2008 [cited by applicant]
US 20080259566A1 · Fried · 2008 [cited by applicant]
US 20090051558A1 · Dorval · 2009 [cited by examiner]
US 20090093073A1 · Chan et al. · 2009 [cited by applicant]
US 20090113698A1 · Love et al. · 2009 [cited by applicant]
US 20090154932A1 · Hinderthuer et al. · 2009 [cited by applicant]
US 20100008038A1 · Coglitore · 2010 [cited by applicant]
US 20100054681A1 · Biribuze · 2010 [cited by applicant]
US 20100097752A1 · Doll et al. · 2010 [cited by applicant]
US 20100262285A1 · Teranaka · 2010 [cited by applicant]
US 20100265658A1 · Sawai et al. · 2010 [cited by applicant]
US 20100284698A1 · Mccolloch · 2010 [cited by applicant]
US 20100288420A1 · Kimura et al. · 2010 [cited by applicant]
US 20100302754A1 · Nordin et al. · 2010 [cited by applicant]
US 20110116245A1 · Skirmont · 2011 [cited by examiner]
US 20110150486A1 · Davidson et al. · 2011 [cited by applicant]
US 20110188054A1 · Petronius et al. · 2011 [cited by applicant]
US 20110188815A1 · Blackwell et al. · 2011 [cited by applicant]
US 20110261427A1 · Hart et al. · 2011 [cited by applicant]
US 20120014639A1 · Doany et al. · 2012 [cited by applicant]
US 20120120596A1 · Bechtolsheim et al. · 2012 [cited by applicant]
US 20120201542A1 · Dahlfort · 2012 [cited by applicant]
US 20120219263A1 · Beamon et al. · 2012 [cited by applicant]
US 20120257355A1 · Yi et al. · 2012 [cited by applicant]
US 20130089293A1 · Howard et al. · 2013 [cited by applicant]
US 20130094827A1 · Haataja · 2013 [cited by applicant]
US 20130102237A1 · Zhou et al. · 2013 [cited by applicant]
US 20130107454A1 · Wilke · 2013 [cited by examiner]
US 20130193304A1 · Yu et al. · 2013 [cited by applicant]
US 20130279916A1 · Cho et al. · 2013 [cited by applicant]
US 20130315586A1 · Kipp · 2013 [cited by applicant]
US 20130342993A1 · Singleton · 2013 [cited by applicant]
US 20140002988A1 · Roesner · 2014 [cited by examiner]
US 20140049931A1 · Wellbrock et al. · 2014 [cited by applicant]
US 20140064659A1 · Doerr et al. · 2014 [cited by applicant]
US 20140098492A1 · Lam · 2014 [cited by applicant]
US 20140106582A1 · Wig et al. · 2014 [cited by applicant]
US 20140133101A1 · Sunaga et al. · 2014 [cited by applicant]
US 20140306131A1 · Mack et al. · 2014 [cited by applicant]
US 20140321803A1 · Thacker et al. · 2014 [cited by applicant]
US 20140321804A1 · Thacker · 2014 [cited by applicant]
US 20140327902A1 · Giger et al. · 2014 [cited by applicant]
US 20150037044A1 · Peterson et al. · 2015 [cited by applicant]
US 20150094896A1 · Cuddihy et al. · 2015 [cited by applicant]
US 20150107101A1 · DeCusatis et al. · 2015 [cited by applicant]
US 20150125110A1 · Anderson et al. · 2015 [cited by applicant]
US 20150139223A1 · Mayenburg · 2015 [cited by applicant]
US 20150261269A1 · Bruscoe · 2015 [cited by applicant]
US 20150293305A1 · Nakagawa et al. · 2015 [cited by applicant]
US 20160011390A1 · Montalvo Urbano et al. · 2016 [cited by applicant]
US 20160062068A1 · Giraud et al. · 2016 [cited by applicant]
US 20160073544A1 · Heyd et al. · 2016 [cited by applicant]
US 20160116693A1 · Oki et al. · 2016 [cited by applicant]
US 20160125706A1 · Butterbaugh et al. · 2016 [cited by applicant]
US 20160156999A1 · Liboiron-Ladouceur et al. · 2016 [cited by applicant]
US 20160209610A1 · Kurtz et al. · 2016 [cited by applicant]
US 20160291273A1 · Nguyen · 2016 [cited by applicant]
US 20160337727A1 · Graves et al. · 2016 [cited by applicant]
US 20160377821A1 · Vallance et al. · 2016 [cited by applicant]
US 20170005446A1 · Regnier · 2017 [cited by applicant]
US 20170077643A1 · Zbinden et al. · 2017 [cited by applicant]
US 20170123164A1 · Suematsu et al. · 2017 [cited by applicant]
US 20170131469A1 · Kobrinsky et al. · 2017 [cited by applicant]
US 20170139145A1 · Heanue et al. · 2017 [cited by applicant]
US 20170168253A1 · Wilcox et al. · 2017 [cited by applicant]
US 20170181314A1 · Leigh · 2017 [cited by examiner]
US 20170192184A1 · Kelty · 2017 [cited by applicant]
US 20170308725A1 · Sardaryan et al. · 2017 [cited by applicant]
US 20170332519A1 · Schmidtke · 2017 [cited by applicant]
US 20170363826A1 · Zer et al. · 2017 [cited by applicant]
US 20170364295A1 · Sardinha et al. · 2017 [cited by applicant]
US 20180131056A1 · Sato · 2018 [cited by applicant]
US 20180159651A1 · Li et al. · 2018 [cited by applicant]
US 20180188459A1 · Mekis et al. · 2018 [cited by applicant]
US 20180196196A1 · Byrd et al. · 2018 [cited by applicant]
US 20180223582A1 · Shin et al. · 2018 [cited by applicant]
US 20180231727A1 · Kurtz et al. · 2018 [cited by applicant]
US 20180278332A1 · Leigh et al. · 2018 [cited by applicant]
US 20180295737A1 · Balasubramania et al. · 2018 [cited by applicant]
US 20180303004A1 · Zhai et al. · 2018 [cited by applicant]
US 20180306990A1 · Badihi · 2018 [cited by applicant]
US 20180329159A1 · Mathai et al. · 2018 [cited by applicant]
US 20180335558A1 · Fini et al. · 2018 [cited by applicant]
US 20180335595A1 · Takeuchi et al. · 2018 [cited by applicant]
US 20190027898A1 · Bovington et al. · 2019 [cited by applicant]
US 20190027899A1 · Krishnamoorthy et al. · 2019 [cited by applicant]
US 20190027901A1 · Zheng et al. · 2019 [cited by applicant]
US 20190028207A1 · Saeedi et al. · 2019 [cited by applicant]
US 20190033528A1 · Ootorii · 2019 [cited by applicant]
US 20190086618A1 · Shastri et al. · 2019 [cited by applicant]
US 20190098788A1 · Leigh et al. · 2019 [cited by applicant]
US 20190116689A1 · Chen et al. · 2019 [cited by applicant]
US 20190207342A1 · Aden et al. · 2019 [cited by applicant]
US 20190208290A1 · Olson · 2019 [cited by applicant]
US 20190258175A1 · Dietrich et al. · 2019 [cited by applicant]
US 20190293971A1 · Yu et al. · 2019 [cited by applicant]
US 20190307014A1 · Adiletta · 2019 [cited by applicant]
US 20190312642A1 · Neilson et al. · 2019 [cited by applicant]
US 20190317287A1 · Raghunathan et al. · 2019 [cited by applicant]
US 20200015386A1 · Gupta · 2020 [cited by applicant]
US 20200033544A1 · Costello · 2020 [cited by applicant]
US 20200053904A1 · Panella et al. · 2020 [cited by applicant]
US 20200073061A1 · Leigh et al. · 2020 [cited by applicant]
US 20200077544A1 · Leung et al. · 2020 [cited by applicant]
US 20200158964A1 · Winzer et al. · 2020 [cited by applicant]
US 20200158967A1 · Winzer et al. · 2020 [cited by applicant]
US 20200161243A1 · Lee et al. · 2020 [cited by applicant]
US 20200163242A1 · Leigh et al. · 2020 [cited by applicant]
US 20200219865A1 · Nelson et al. · 2020 [cited by applicant]
US 20200292769A1 · Zbinden · 2020 [cited by applicant]
US 20210044356A1 · Aboagye · 2021 [cited by applicant]
US 20210072473A1 · Wall, Jr. · 2021 [cited by applicant]
US 20210084749A1 · Devalla et al. · 2021 [cited by applicant]
US 20210112683A1 · Mohajer et al. · 2021 [cited by applicant]
US 20210210894A1 · Rivaud et al. · 2021 [cited by applicant]
US 20210211785A1 · Rose et al. · 2021 [cited by applicant]
US 20210239927A1 · Rivaud et al. · 2021 [cited by applicant]
US 20210247580A1 · Reagan · 2021 [cited by applicant]
US 20210263247A1 · Bechtolsheim et al. · 2021 [cited by applicant]
US 20210281323A1 · Williams et al. · 2021 [cited by applicant]
US 20210281932A1 · Chaouch et al. · 2021 [cited by applicant]
US 20210286140A1 · Winzer · 2021 [cited by applicant]
US 20210294052A1 · Winzer · 2021 [cited by applicant]
US 20210305127A1 · Refai-Ahmed et al. · 2021 [cited by applicant]
US 20210345024A1 · Leigh · 2021 [cited by applicant]
US 20210345511A1 · Leigh et al. · 2021 [cited by applicant]
US 20210367674A1 · Leclair et al. · 2021 [cited by applicant]
US 20210376950A1 · Winzer · 2021 [cited by applicant]
US 20210385000A1 · Nagarajan et al. · 2021 [cited by applicant]
US 20210389536A1 · Dietrich et al. · 2021 [cited by applicant]
US 20220003946A1 · Edwards, Jr. et al. · 2022 [cited by applicant]
US 20220029379A1 · Kovsh · 2022 [cited by applicant]
US 20220029380A1 · Kovsh · 2022 [cited by applicant]
US 20220102583A1 · Baumheinrich et al. · 2022 [cited by applicant]
US 20220109501A1 · Latchman · 2022 [cited by applicant]
US 20220114125A1 · Thakur et al. · 2022 [cited by applicant]
US 20220141949A1 · Devalla et al. · 2022 [cited by applicant]
US 20220141990A1 · Gupta · 2022 [cited by applicant]
US 20220159860A1 · Winzer · 2022 [cited by applicant]
US 20220159878A1 · Dillman et al. · 2022 [cited by applicant]
US 20220187559A1 · Lin et al. · 2022 [cited by applicant]
US 20220244465A1 · Winzer · 2022 [cited by applicant]
US 20220263586A1 · Winzer · 2022 [cited by applicant]
US 20220279256A1 · Chaouch et al. · 2022 [cited by applicant]
US 20220329020A1 · Narayanan et al. · 2022 [cited by applicant]
US 20230003958A1 · Shimazu et al. · 2023 [cited by applicant]
US 20230018654A1 · Winzer · 2023 [cited by applicant]
US 20230039781A1 · Mohajer et al. · 2023 [cited by applicant]
US 20230043794A1 · Winzer · 2023 [cited by applicant]
US 20230064740A1 · Rathinasamy · 2023 [cited by applicant]
US 20230077979A1 · Winzer · 2023 [cited by applicant]
US 20230161109A1 · Pupalaikis et al. · 2023 [cited by applicant]
US 20230176304A1 · Winzer · 2023 [cited by applicant]
US 20230209761A1 · Winzer · 2023 [cited by applicant]
US 20230258873A1 · Pupalaikis et al. · 2023 [cited by applicant]
US 20230305247A1 · Hemp et al. · 2023 [cited by applicant]
US 20230305249A1 · Hemp et al. · 2023 [cited by applicant]
US 20230354541A1 · Cole et al. · 2023 [cited by applicant]
US 20230358979A1 · Winzer et al. · 2023 [cited by applicant]
US 20230375793A1 · Winzer et al. · 2023 [cited by applicant]
US 20230380095A1 · Winzer et al. · 2023 [cited by applicant]
US 20240036254A1 · Winzer · 2024 [cited by applicant]
US 20240049434A1 · Mohajer et al. · 2024 [cited by applicant]
US 20240064922A1 · Winzer · 2024 [cited by applicant]
US 20240118484A1 · Winzer et al. · 2024 [cited by applicant]
US 20240142731A1 · Hemp et al. · 2024 [cited by applicant]
US 20240159979A1 · Winzer et al. · 2024 [cited by applicant]
US 20240302612A1 · Winzer et al. · 2024 [cited by applicant]
US 20240418943A1 · Winzer et al. · 2024 [cited by applicant]
US 20250031336A1 · Winzer et al. · 2025 [cited by applicant]
US 20250098095A1 · Cole et al. · 2025 [cited by applicant]
US 20250147225A1 · Winzer et al. · 2025 [cited by applicant]
CA 3055376 · 2018 [cited by applicant]
CN 103402337 · 2016 [cited by applicant]
DE 2833302 · 1980 [cited by applicant]
JP 2010176010 · 2010 [cited by applicant]
JP 2013051448 · 2013 [cited by applicant]
TW 201937335A · 2019 [cited by applicant]
WO WO2006113094 · 2006 [cited by applicant]
WO WO2009107671 · 2009 [cited by applicant]
WO WO2020083845 · 2020 [cited by applicant]
WO WO2021183792 · 2021 [cited by applicant]
WO WO2021188648 · 2021 [cited by applicant]
WO WO2021211725 · 2021 [cited by applicant]
WO WO2021247521 · 2021 [cited by applicant]
WO WO2022061160 · 2022 [cited by applicant]
WO WO2022076539 · 2022 [cited by applicant]
WO WO2022109349 · 2022 [cited by applicant]
WO WO2023183703 · 2023 [cited by applicant]
Brusberg et al., “On-board Optical Fiber and Embedded Waveguide Interconnects,” 2018 7th Electronic System-Integration Technology Conference (ESTC), Nov. 29, 2018, pp. 1-9. [cited by applicant]
Cook et al., “36-Channel Parallel Optical Interconnect Module Based on Optoelectronics-on-VLSI Technology,” IEEE Journal of Selected Topics in Quantum Electronics, Mar./Apr. 2003, 9(2):387-391. [cited by applicant]
Grani et al., “Design and Evaluation of AWGR-based Photonic NoC Architectures for 2.5D Integrated High Performance Computing Systems,” 2017 IEEE International Symposium on High Performance Computer Architecture (HPCA), … [cited by applicant]
International Preliminary Report on Patentability in International Appln. No. PCT/US2022/033870, mailed on Dec. 28, 2023, 13 pages. [cited by applicant]
Krishnamoorthy et al., “From Chip to Cloud: Optical Interconnects in Engineered Systems,” Journal of Light Wave Technology, Aug. 1, 2017, 35(15):3101-3111. [cited by applicant]
Rostan et al., “EtherCAT enabled Advanced Control Architecture,” 2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2010, pp. 39-41. [cited by applicant]
Young et al., “Optical I/O Technology for Tera-Scale Computing,” IEEE Journal of Solid-State Circuits, Jan. 2010, 45(1):235-242. [cited by applicant]
International Preliminary Report on Patentability Chapter II in International Appln. No. PCT/US2021/053745, mailed Jun. 14, 2023, 14 pages. [cited by applicant]
International Preliminary Report on Patentability in International Appln. No. PCT/US2021/050945, mailed Mar. 30, 2023, 12 pages. [cited by applicant]
International Preliminary Report on Patentability in International Appln. No. PCT/US2021/060215, mailed Jun. 1, 2023, 41 pages. [cited by applicant]
[No Author Listed], “IEEE P802.3 Electrical I/O Specifications,” LAN/MAN Standards Committee of the IEEE Computer Society, May 13, 2022, 235 pages. [cited by applicant]
[No Author Listed], “QSFP-DD MSA QSFP-DD/QSFP-DD800/QSFP112 Hardware Specification for QSFP Double Density 8X and QSFP 4X Pluggable Transceivers,” Revision 6.2, Mar. 11, 2022, 169 pages. [cited by applicant]
[No Author Listed], “Support Tomorrow's Speeds Inside Today's Footprint; Molex Solutions for 112 Gbps Architecture,” Molex, 2019, 7 pages. [cited by applicant]
[No Author Listed], “QSFP-DD MSA QSFP-DD/QSFP-DD800/QSFP112 Hardware Specification for QSFP Double Density 8X and QSFP 4X Pluggable Transceivers,” QSFP-DD, Revision 6.01, May 28, 2021, 167 pages. [cited by applicant]
[No Author Listed], “Specification for OSFP Octal Small Form Factor Pluggable Module,” OSFP MSA, Rev 4.0, May 28, 2021, 109 pages. [cited by applicant]
Dogruoz et al., “Optimizing QSFP-DD Systems to Achieve at Least 25 Watt Thermal Port Performance,” QSFP-DD, Jan. 2021, 30 pages. [cited by applicant]
Ieee802.org [online], “Broadened Consensus for a 200GEL Copper Cable Objective,” Aug. 26, 2021, retrieved Oct. 17, 2022, retrieved from URL<https://www.ieee802.org/3/B400G/public/21_08/kocsis_b400g_01a_210826.pdf>, 17 p… [cited by applicant]
Ieeee802.org [online], “Multi-200Gbps/lane Package Model Considerations,” Jul. 12, 2022, retrieved Oct. 17, 2022, retrieved from URL<https://www.ieee802.org/3/df/public/22_07/benartsi_3df_01a_2207.pdf>, 13 pages. [cited by applicant]
International Search Report and Written Opinion in International Appln. No. PCT/US2022/033870, mailed Sep. 28, 2022, 15 pages. [cited by applicant]
International Search Report and Written Opinion in International Appln. No. PCT/US2023/20730, mailed Jul. 31, 2023, 10 pages. [cited by applicant]
Kocsis et al., “OSFP MDI Proposal,” Amphenol, High Speed Interconnects, Mar. 6, 2016, 13 pages. [cited by applicant]
Lusted et al. “Motions and Straw Polls, ” IEEE P802.3df Task Force, Intel, Sep. 2022, 6 pages. [cited by applicant]
Samtec.com [online], “Flyover® QSFP Cable Systems, Cages, and Heat Sinks,” 2022, retrieved on Dec. 22, 2022, retrieved from URL<https://www.samtec.com/cables/high-speed/assemblies/qsfp-flyover>, 7 pages. [cited by applicant]
Samtec.com [online], “Novaray® I/O 112 Gbps PAM4 Panel Mount Cable System,” May 18, 2022, retrieved on Mar. 29, 2023, retrieved from URL<https://www.samtec.com/cables/high-speed/io-assemblies/novaray-io>, 12 pages. [cited by applicant]
Tracy, “Supporting Data to Demonstrate 100Gbps Capability of Proposed MDIs,” TW Connectivity, Sep. 13, 2018, 9 pages. [cited by applicant]
[No Author Listed], “2020 Optical Fiber Communication Conference and Exhibition: Conference Schedule,” OFC 2020 tutorial M1H.4, Mar. 8-12, 2020, 152 pages. [cited by applicant]
[No Author Listed], “Hands-on with Intel Co-Packaged Optics and Silicon Photonics Switch,” Serve the Home, Mar. 18, 202, retrieved on Feb. 15, 2022, <https://www.youtube.com/watch?v=Esgyj26vdxs>, 31 pages. [cited by applicant]
[No Author Listed], “Paradigm Change: Reinventing HPC Architectures with In-Package Optical I/O,” Ayar Labs, Solution Brief, Jul. 2, 2020, 9 pages. [cited by applicant]
[No Author Listed], “Rockley Photonics Silicon Photonics Platform for Next Generation Transceivers,” Rockley Photonics, Mar. 2020, 1 page. [cited by applicant]
[No Author Listed], “Technical Brief: Optical I/O Chiplets Eliminate Bottlenecks to Unleash Innovation,” Ayar Labs, Technical Brief, Dec. 6, 2019, 9 pages. [cited by applicant]
Chopra, “Looking Beyond 400G: A System Vendor Perspective, Beyond 400 GB/s Ethernet Study Group,” Cisco Fellow, Feb. 8, 2020, 23 pages. [cited by applicant]
Dobbelaere, “Silicon Photonics Technology Platform for Integration of Optical IOs with ASICs,” 2013 IEEE Hot Chips 25 Symposium (HCS)—Silicon Photonics Technology Platform for integration of optical IOS with ASICs, Aug.… [cited by applicant]
Keeler et al., “Heterogeneous Integration of III-V Photonics and Silicon Electronics for Advanced Optical Microsystems,” Sandia National Laboratories, Mar. 1, 2016, 23 pages. [cited by applicant]
Kuchta et al., “Multi-wavelength Optical Transceivers Integrated on Node (Motion),” ARPA, IBM, Apr. 22, 2019, 28 pages. [cited by applicant]
Lee et al., “OnRamps: Optical Networks Using Rapid Amplified Multi-wavelength Photonic Switches,” PowerPoint, ARPA, IBM Research, Apr. 22, 2019, 27 pages. [cited by applicant]
Liang et al., “Integrated energy efficient WDM photonic solution for Data Centers and Supercomputers,” ARPA-E Enlightened Review Meeting, Seattle, WA, Oct. 23-24, 2018, 24 pages. [cited by applicant]
Liang, “Integrated DWDM Photonics 2.0 for Green Exascale Supercomputing in HPE,” ARPA-Enlightened Annual Review Meeting, Coronado, CA, USA, Oct. 30-Nov. 1, 2019, 19 pages. [cited by applicant]