LED module, LED display module and method of manufacturing the same
The invention relates to a method for manufacturing modules with one or more optoelectronic components, comprising the steps: producing at least one layer stack providing a base module on a carrier having a first layer, an active layer formed thereon, and a second layer formed thereon; exposing a surface area of the first layer facing away from the carrier; forming a first contact to a surface region of the second layer facing away from the carrier; and forming a second contact to the surface area of the first layer facing away from the carrier.
1 . A method of manufacturing modules of LEDs, comprising:
producing at least one layer stack providing a base module on a carrier comprising a first layer, an active layer formed thereon, and a second layer formed thereon;
exposing of a surface area of the first layer facing away from the carrier;
forming a first contact to a surface region of the second layer facing away from the carrier;
forming a second contact to the surface area of the first layer facing away from the carrier;
forming at least one LED module from the base module by means of deep mesa structuring through the first layer, in particular from a side of the second layer; and
generating quantum well intermixing in regions of the active layer that extend adjacent to the deep mesa structuring.
2 . The method according to claim 1 , wherein forming the second contact comprises:
forming an electrically insulating dielectric over a portion of the active layer and the second layer; and
forming the second contact with a conductive material electrically contacting the remote surface region of the first layer over the dielectric to a surface region of the second layer remote from the carrier.
3 . The method according to claim 1 , further comprising exposing the surface region of the first layer facing away from the carrier by means of the flat mesa structuring of the at least one layer stack, in particular from the side of the second layer, wherein in particular a flat trench is produced, surrounding the respective layer stack.
4 . The method according to claim 1 , further comprising:
generating a plurality of base modules as a matrix along an X-Y plane along at least one row and along at least one column, wherein base modules of a respective row are oriented the same, wherein optionally:
the base modules of two adjacent lines are oriented the same way; or
the base modules of two adjacent rows are oriented in opposite directions, thereby arranging contacts of the same polarity, in particular first contacts, adjacent to each other.
5 . The method according to claim 4 , further comprising creating a common layer stack of two adjacent base modules oriented opposite to each other.
6 . The method according to claim 1 , wherein a plurality of base modules are arranged on a different support when structuring the deep mesa, in contrast to exposing the first and second contacts.
7 . The method according to claim 1 , further comprising at least one of:
detachment of the base module or the at least one LED module from the carrier, by means of a laser lift-off; or
detachment of the base module or the at least one LED module from the carrier, by means of a mechanical process.
8 . The method according to claim 1 , further comprising contacting the contacts of the at least one LED module to a replacement carrier or end carrier, using flip-chip technology.
9 . The method according to claim 8 , wherein common contact areas are created for contacts of adjacent oppositely oriented base modules of the at least one LED module.
10 . The method according to claim 1 , wherein:
the first layer is n-doped and the second layer is p-doped, the active layer being designed in particular for the emission of blue or green light; and/or
the first layer is p-doped and the second layer is n-doped, the active layer being designed in particular for the emission of red light.
11 . The method according to claim 1 , wherein:
the at least one layer stack is created by means of epitaxy; and/or
exposure and/or grouping is carried out by means of etching.
12 . An LED module, comprising:
a layer stack forming a plurality of base modules, each base module having a first layer formed on a carrier, an active layer and a second layer, wherein a first contact is formed in or on a surface region of the second layer remote from the carrier, and a second contact is formed in or on the surface region of the first layer remote from the carrier, the first and second contacts being spaced apart; and
wherein at least some of the plurality of base modules base are partially separated from each other by deep mesa structuring through the second layer, the active region, and a part of the first layer, wherein regions of the active layer which run adjacent to deep mesa structuring comprise an increased band gap produced in particular by quantum well intermixing.
13 . The LED module of claim 12 , wherein a light emitting surface is formed on a side of the layer stack opposite the first and second contacts.
14 . The LED module according to claim 12 , wherein the second contact is formed by means of a dielectric electrically insulated to the transition layer and to the second layer and formed at the surface region of the second layer facing away from the support.
15 . The LED module according to claim 14 , wherein the LED module comprises a plurality of base modules arranged in a matrix of at least one row and at least one column.
16 . The LED module according to claim 12 , wherein the base modules of two adjacent rows are oriented in opposite directions so that contacts of the same polarity, in particular first contacts, are thus arranged adjacent to each other.
17 . An LED module, including a light-emitting diode module, produced according to the method of claim 1 .
18 . A method of manufacturing an LED display module having a full-area target matrix formed on a first carrier and having rows and columns of base module occupiable locations, comprising the steps of:
forming a number of base modules on a second carrier in a start matrix having an equal spacing corresponding to locations which can be occupied by base modules in the target matrix,
forming, by means of a deep mesa etching, a number of LED modules that are separated from the second carrier, in particular by means of laser lift-off or a mechanical or chemical process, wherein at least some of the LED modules comprise two or more base modules; and
positioning and electrically connecting the LED modules to the first carrier in the target matrix in such a way that a number of unoccupied locations are left in the latter for base modules, at which at least partially in each case at least one sensor element is positioned and electrically connected.
19 . The method according to claim 18 , wherein a plurality of target matrices of a same size or of different sizes are formed on the first carrier along rows and columns with occupiable positions for target matrices at respective distances from one another.
20 . The method according to claim 18 , wherein the base modules form rectangles in a matrix plane and any number of base modules adjacent to each other along a common side are grouped in LED modules.
21 . The method according to claim 18 , wherein, in at least one LED module, four basic modules are grouped in two rows and two columns.
22 . The method according to claim 18 , wherein, in at least one LED module, three basic modules are grouped in two rows and two columns.
23 . The method according to claim 18 , wherein at least seven LED modules with four base modules each and at least two LED modules with three base modules each are positioned and electrically connected to the target matrix in such a way that at least two locations unoccupied by base modules are created, at which at least one sensor element is positioned and electrically connected in each case.
24 . The method according to claim 18 , wherein positions occupied by sensor elements are framed by base modules.
25 . The method according to claim 18 , wherein the base modules are formed to emit electromagnetic radiation from a first side of the first carrier.
26 . The method according to claim 18 , wherein a plurality of sensor elements is formed as part of a sensor device formed on the first carrier to receive electromagnetic radiation incident on a first side of the first carrier.
27 . The method according to claim 18 , wherein a sensor element is formed as a vital sign monitoring sensor.
28 . The method according to claim 27 , wherein the vital sign monitoring sensor is disposed within a display screen or behind the rear surface of a display screen, wherein the vital sign monitoring sensor is arranged to measure one or more vital sign parameters of a user who places a body part against a front major surface of the display screen at the vital sign monitoring sensor.
29 . The method according to claim 18 , wherein a base module each comprises a first layer formed on a second carrier, an active transition layer formed on the first layer, and a second layer formed on the active transition layer, wherein a first contact is connected to a surface portion of the second layer remote from the carrier, wherein a second contact is connected to a surface portion of the first layer remote from the second carrier.
30 . The method according to claim 29 , wherein the second contact is formed by means of a dielectric to the transition layer and to the second layer electrically insulated to and extending on the surface region of the second layer facing away from the second support.
31 . The method according to claim 18 , wherein a sensor element is formed in each case in the form of a photodiode, or in the form of a phototransistor, or in the form of a photoresistor, or in the form of an ambient light sensor, or in the form of an infrared sensor, or in the form of an ultraviolet sensor, or in the form of a proximity sensor, or in the form of an infrared component.